Patents Assigned to XPC, Incorporated
  • Fusing together metal particles using a high-frequency electromagnetic field
    Patent number: 5014420
    Abstract: Micro-miniature particles of low resistivity material are fused by applying a highly concentrated high-frequency electromagnetic field to the particles. An electrially conductive printed circuit is formed by laying out a pattern of contiguous micr-miniature particles of low resistivity material and applying a highly concentrated high-frequency electromagnetic field to the particles to fuse them together to form a low resistance electrical conductive circuit.
    Type: Grant
    Filed: July 11, 1989
    Date of Patent: May 14, 1991
    Assignee: XPC, Incorporated
    Inventors: Thomas A. Howard, Donovan E. McGee