Abstract: When each signal line contact terminal (10ai) is installed in a base member (30), an upper housing (28), and a lower housing (26), the upper housing (28) is installed together in such a way as to be sandwiched between the base member (30) and the lower housing (26). Here, collars (16) are fitted on outer peripheral portions of a first extending portion (52A) and a second extending portion (52C) of the signal line contact terminal (10ai), respectively. Moreover, air layers are formed between an outer peripheral portion of a drum portion (52B) of the signal line contact terminal (10ai) and an inner peripheral surface forming a hole (28b), between an outer peripheral portion of the first extending portion (52A) and an inner peripheral surface forming a hole (30b), between an outer peripheral portion of the second extending portion (52C) and an inner peripheral surface forming a hole (26b), and between an outer peripheral portion of a plunger (56) and an inner peripheral surface forming a hole (26e).

Abstract: In a contact terminal, a first touch portion and a second touch portion of a movable piece and a first touch portion and a second touch portion of a movable piece bite into and thus pinch a spherical surface of a bump of a semiconductor device. In this state, when an electrode surface of the semiconductor device is warped upward during a test and the bump is about to be moved up, an inclined surface of a fixing portion of the movable piece and an inclined surface of a fixing portion of the movable piece fix the spherical surface of the bump.

Abstract: In a transceiver module, when one end portion of a module board (18) is inserted and connected to a concave portion (16R) of a plug connector (16), a projection portion (16PP) formed on the periphery of the concave portion (16R) of the plug connector (16) is fitted into a notch portion (18PH) as one end surface of the module board (18) comes into contact with an inner peripheral surface that forms the concave portion (16R).

Abstract: In a receptacle assembly, a module is guided by a guide rail and held inside an opening of a printed wiring board when a plug connector of the module is connected to a host connector. The receptacle assembly includes a guide member provided on the periphery of the opening of the wiring board and configured to form a module accommodation portion to detachably accommodate the module comprising a module board and to guide the module, a connector unit provided on the wiring board and configured to electrically connect the module board of the module to the wiring board, a first EMI gasket sealing a gap between a lower end portion of a connector cover covering the connector unit and the wiring board, and a second EMI gasket sealing a gap between a connecting end portion of the module and the periphery of an opening of the connector unit.

Abstract: In a transceiver module, where one end of a module substrate is inserted and connected to a concave portion of a plug connector and when one end face of the module substrate is touched to the inner periphery face forming the concave portion, a projection portion formed at the periphery of the concave portion of the plug connector is fitted to a notch portion of the module substrate.

Abstract: A cable connector includes a connection end portion of a flexible board, in which a rectangular reinforcing plate molded of a conductive resin material is fixed to part of an upper surface of a ground plate. The connection end portion of the flexible board is electrically connected to a printed circuit board through the cable connector.

Abstract: An electrode portion of a module board to be disposed in a transceiver module is formed from a group of contact pads which are arrayed substantially in parallel to a long side of the module board, and the group of contact pads include a line of ground line pads formed at predetermined intervals from one end to the other end, and two lines of signal line pads formed in spaces between the ground line pads.

Abstract: In a contact terminal, a first touch portion and a second touch portion of a movable piece and a first touch portion and a second touch portion of a movable piece bite into and thus pinch a spherical surface of a bump of a semiconductor device. In this state, when an electrode surface of the semiconductor device is warped upward during a test and the bump is about to be moved up, an inclined surface of a fixing portion of the movable piece and an inclined surface of a fixing portion of the movable piece fix the spherical surface of the bump.

Abstract: A contact unit includes signal and power-supply contact terminals, a first blade in which the contact terminals are nipped and held, and a second blade. In each contact terminal formed of a conductive metal material by using the MEMS technique, for example, a tapered portion of a short-circuit piece and a tapered portion of another short-circuit piece come into contact with each other when a pressure at a predetermined value or higher is applied to a first contact and a second contact in a direction to come close to each other.

Abstract: A cable connector includes a connection end portion of a flexible board, in which a rectangular reinforcing plate molded of a conductive resin material is fixed to part of an upper surface of a ground plate. The connection end portion of the flexible board is electrically connected to a printed circuit board through the cable connector.

Abstract: A receptacle connector includes: a housing provided with an accommodating space having an opening into which a object to be connected is to be inserted; a plurality of contacts to be housed in the accommodating space while being arranged adjacent to one another, the contacts including a plurality of signal line contacts and a plurality of ground contacts; and a conductive member including first connection parts which are each made of a metal material and are electrically connected to the plurality of ground contacts, respectively, and a conductive resin member which is electrically connected to the first connection parts.

Abstract: The invention provides a contact probe and a semiconductor element socket provided with the same, the contact probe capable of smooth inspection of a device while securing good conductivity. A contact probe has an upper plunger having a contact stem portion, a lower plunger having an insertion hole with which the contact stem portion is capable of coming into contact, and a coil spring connected to the upper plunger and the lower plunger in such a way as to cover the contact stem portion. The coil spring is configured by helically winding a wiring, and includes a guide portion wound tight in the axial direction of the coil spring by the wire, the guide portion located on the lower plunger side of the coil spring and also includes the upper plunger side portion than an upper end portion of the insertion hole.

Abstract: In a receptacle assembly, a module is guided by a guide rail and held inside an opening of a printed wiring board when a plug connector of the module is connected to a host connector.

Abstract: An inspection probe 16Ai is formed by subjecting a thin sheet material made of a copper alloy to press working. The inspection probe 16Ai includes: a device side plunger 16A having a contact point which selectively comes into contact with an electrode portion DVb of a semiconductor device DV; a board side plunger 16B having a contact point which selectively comes into contact with a contact pad of a printed wiring board 18; a spring portion 16D which biases the device side plunger 16A and the board side plunger 16B in a direction away from each other; and a cylindrical support stem 16C being disposed inside the spring portion 16D, making the spring portion 16D slidable thereon, and being configured to retain straight advancing property of the spring portion 16D.

Abstract: In a receptacle assembly, a module is guided by a guide rail and held inside an opening of a printed wiring board when a plug connector of the module is connected to a host connector.

Abstract: In a transceiver module, where one end of a module substrate is inserted and connected to a concave portion of a plug connector and when one end face of the module substrate is touched to the inner periphery face forming the concave portion, a projection portion formed at the periphery of the concave portion of the plug connector is fitted to a notch portion of the module substrate.

Abstract: In a receptacle assembly, a module is guided by a guide rail and held inside an opening of a printed wiring board when a plug connector of the module is connected to a host connector.

Abstract: A receptacle connector includes: a housing provided with an accommodating space having an opening into which a object to be connected is to be inserted; a plurality of contacts to be housed in the accommodating space while being arranged adjacent to one another, the contacts including a plurality of signal line contacts and a plurality of ground contacts; and a conductive member including first connection parts which are each made of a metal material and are electrically connected to the plurality of ground contacts, respectively, and a conductive resin member which is electrically connected to the first connection parts.

Abstract: A contact probe having a plunger; a top contacting member which is provided at a tip end of the plunger and is brought into contact with an electrode of a semiconductor device; a bottom contacting member which is brought into contact with an electrode of a testing board; and an elastic member for urging the top contacting member and the bottom contacting member in opposite directions away from each other. The plunger is formed into a cylindrical shape and includes a through-hole which penetrates through the plunger in an axial direction thereof. The top contacting member includes a plurality of mountain-shaped sharp portions at a tip end thereof, and each of the sharp portions is asymmetrical with respect to a straight line that passes through a peak of the sharp portion and extends along an axial direction of the plunger, and is bent toward a center line of the plunger.

Abstract: In a receptacle cage, a front EMI finger in a tubular shape serving as a first shield member is provided on the entire periphery of a substantially rectangular module slot. In addition, a gap between the peripheral edge of a slot of a cover, into which a plug connector for the optical module connected to a receptacle connector in a receptacle connector accommodating portion is inserted, and a peripheral surface of a plug connector and a gap between a lower surface of the cover and a surface, on which a printed wiring board is mounted, are shielded by an EMI gasket serving as a second shield member and an EMI gasket serving as a third shield member, respectively.