Patents Assigned to Yazalci Corporation
  • Patent number: 5025554
    Abstract: A method of forming a crimp-style terminal and the resulting crimp-style terminal. A solder cream is applied to one or both of the inner surface of the conductor-holding portion of the terminal and the conductor wires which are to be held by the conductor-holding portion. The conductor-holding portion is subsequently deformed by pressing to grip the wire conductors. The solder cream fills the space between the conductor bundle and the inner surface of the conductor-holding portion and the space between conductors of the conductor bundle.
    Type: Grant
    Filed: July 25, 1990
    Date of Patent: June 25, 1991
    Assignee: Yazalci Corporation
    Inventor: Hikoo Dohi