Patents Assigned to YMC Co. Ltd.
  • Patent number: 9194035
    Abstract: A non-adhesive sputtering structure includes a sputtering target having a plate shape; and a backing plate having a plate shape. The backing plate faces the sputtering target, and facing surfaces of the sputtering target and the backing plate are in contact with each other. The backing plate includes a body having a longitudinal axis; and a cooling member through which a cooling material flows in a longitudinal direction of the body substantially parallel to the longitudinal axis. The cooling material conducts heat generated from the sputtering target from sputtering to outside the backing plate. The non-adhesive sputtering structure further includes a plurality of non-adhesive fastening members which maintain the facing surfaces of the backing plate and the sputtering target in contact with each other. The non-adhesive fastening members are extended through a thickness of the backing plate and correspond to regions of the backing plate excluding the cooling member.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: November 24, 2015
    Assignees: SAMSUNG DISPLAY CO., LTD., YMC CO., LTD.
    Inventors: Kyung Il Park, Keun-Ik Jeon, Sang-Su Kim, Youn-Yong Lee
  • Publication number: 20130001077
    Abstract: A non-adhesive sputtering structure includes a sputtering target having a plate shape; and a backing plate having a plate shape. The backing plate faces the sputtering target, and facing surfaces of the sputtering target and the backing plate are in contact with each other. The backing plate includes a body having a longitudinal axis; and a cooling member through which a cooling material flows in a longitudinal direction of the body substantially parallel to the longitudinal axis. The cooling material conducts heat generated from the sputtering target from sputtering to outside the backing plate. The non-adhesive sputtering structure further includes a plurality of non-adhesive fastening members which maintain the facing surfaces of the backing plate and the sputtering target in contact with each other. The non-adhesive fastening members are extended through a thickness of the backing plate and correspond to regions of the backing plate excluding the cooling member.
    Type: Application
    Filed: June 29, 2012
    Publication date: January 3, 2013
    Applicants: YMC, CO., LTD., SAMSUNG DISPLAY CO., LTD.
    Inventors: Kyung Il PARK, Keun-Ik JEON, Sang-Su KIM, Youn-Yong LEE
  • Patent number: 7413714
    Abstract: An automated sequential reaction system that can be used to either sequentially produce a plurality of different products each requiring a single reaction, or to produce a desired product that requires a series of sequential reactions. A system controller controls an automated reactant supply, a solvent supply, a reaction module, a detector, and a product collector. Prior to initiating any reaction, the system is flushed with solvent and a heat exchanger supplies the reaction module with a temperature-conditioned fluid to maintain the reaction module at a desired temperature. For single reactions, a plurality of reactants are injected into a chemical reactor included in the reaction module. As fluid exits the chemical reactor, the detector determines if the fluid is a desired chemical product or solvent, and routes the fluid to the appropriate receptacle.
    Type: Grant
    Filed: July 16, 2000
    Date of Patent: August 19, 2008
    Assignee: YMC Co. Ltd.
    Inventors: Thomas Schwalbe, Klaus Golbig, Michael Hohmann, Andreas Oberbeck, Shahriyar Taghavi-Moghadam