Abstract: A reflow furnace (1) has a decompression chamber (5), and air bubbles contained in a molten solder on a substrate (7) are removed in this decompression chamber (5). The substrate (7) supported on a first conveying rail (8) is fed into the decompression chamber (5) by a first conveyance rod (18). The substrate (7) in the decompression chamber (5) is taken out by a second conveyance rod (32) and is conveyed to the exit of the reflow furnace (1) while being supported on the second conveying rail (9). Before the treatment of substrates (7) having different widths, the width of the first conveying rail (8) and the width of the second conveying rail (9) are adjusted. During this adjustment, the second conveyance rod (32) is displaced in the width direction of the substrate (7), with the second conveyance rod (32) kept in the decompression chamber (5), and in association with this, the spacing between right and left rail portions (12a, 12a) in the decompression chamber (5) is adjusted.

Abstract: A conveyor apparatus which allows a workpiece to be carried in and out of a desired process and lends itself to easy maintenance as well is provided. A conveyor apparatus (13) includes a first conveyance mechanism (13A) capable of carrying a board (7) into a desired process and a second conveyance mechanism (13B) capable of carrying the board (7) out of the desired process.

Abstract: A conveyor apparatus includes a pusher piece (19) fixed to a conveying rod (18) adapted to reciprocate along a board conveyance path, and a switching mechanism adapted to switch the pushing piece, by turning the conveying rod a predetermined angle, between an engaged position where the pusher piece (19) engages with a rear end face of a board (7) and a retracted position where the pusher piece (19) does not interfere with the board (7). The switching mechanism includes a guide member (23) provided with a guide hole (24) adapted to guide a guide rod (22). The guide hole (24) is made up of first and second guide holes (25 and 26) configured to extend in parallel to each other in a conveyance direction and slanted coupling guide holes (27, 27) adapted to couple ends of the first and second guide holes (25 and 26). When the conveying rod (18) reciprocates, the guide rod (22) makes a round of the closed-loop guide hole (24).

Abstract: A conveyor apparatus includes a pusher piece (19) fixed to a conveying rod (18) adapted to reciprocate along a board conveyance path, and a switching mechanism adapted to switch the pushing piece, by turning the conveying rod a predetermined angle, between an engaged position where the pusher piece (19) engages with a rear end face of a board (7) and a retracted position where the pusher piece (19) does not interfere with the board (7). The switching mechanism includes a guide member (23) provided with a guide hole (24) adapted to guide a guide rod (22). The guide hole (24) is made up of first and second guide holes (25 and 26) configured to extend in parallel to each other in a conveyance direction and slanted coupling guide holes (27, 27) adapted to couple ends of the first and second guide holes (25 and 26). When the conveying rod (18) reciprocates, the guide rod (22) makes a round of the closed-loop guide hole (24).

Abstract: A conveyor apparatus which allows a workpiece to be carried in and out of a desired process and lends itself to easy maintenance as well is provided. A conveyor apparatus (13) includes a first conveyance mechanism (13A) capable of carrying a board (7) into a desired process and a second conveyance mechanism (13B) capable of carrying the board (7) out of the desired process.

Abstract: In a second horizontal plate (18a) bottoming an atmosphere recovery box (18), there are formed circular holes (21) between blowout pipes (20) adjacent to each other. Each of partition walls (2) positioned above a conveyor (5) includes an upper portion formed from a heat-insulating wall (2a) including a heat-insulative material having a thickness of T, and a lower portion formed from a metallic-plate wall (2b) extending downward from the heat-insulating wall (2a) toward the conveyor (5). The pitch P2 of the blowout pipes (20) across the metallic-plate wall (2b) is substantially same as the pitch P1 (12 mm) of the blowout pipes (20) disposed inside each of the chambers (R1 to R5) and adjacent to each other.

Abstract: In a reflow soldering apparatus comprising a conveyor 4 to transport circuit boards 5 mounted with electronic components into multiple chambers 1, 2 and 3, and fans 6 installed in the chambers 1, 2 and 3, the centers of the impellers in the adjacent fans 6 are not on a single perpendicular plane along the transport line of the conveyor and arrayed offset to the left and right. This apparatus may also employ a structure wherein the centers of the impellers in the adjacent fans are not on a single horizontal plane and arrayed offset up and down. Further, it may also employ a structure wherein the fans are arranged with their rotation shafts inclined.

Abstract: In a second horizontal plate (18a) bottoming an atmosphere recovery box (18), there are formed circular holes (21) between blowout pipes (20) adjacent to each other. Each of partition walls (2) positioned above a conveyor (5) includes an upper portion formed from a heat-insulating wall (2a) including a heat-insulative material having a thickness of T, and a lower portion formed from a metallic-plate wall (2b) extending downward from the heat-insulating wall (2a) toward the conveyor (5). The pitch P2 of the blowout pipes (20) across the metallic-plate wall (2b) is substantially same as the pitch P1 (12 mm) of the blowout pipes (20) disposed inside each of the chambers (R1 to R5) and adjacent to each other.

Abstract: In a reflow soldering apparatus comprising a conveyor 4 to transport circuit boards 5 mounted with electronic components into multiple chambers 1, 2 and 3, and fans 6 installed in the chambers 1, 2 and 3, the centers of the impellers in the adjacent fans 6 are not on a single perpendicular plane along the transport line of the conveyor and arrayed offset to the left and right. This apparatus may also employ a structure wherein the centers of the impellers in the adjacent fans are not on a single horizontal plane and arrayed offset up and down. Further, it may also employ a structure wherein the fans are arranged with their rotation shafts inclined.

Abstract: A reflow soldering apparatus using circulated heated gas to solder electronic components to a printed circuit board while transporting the printed circuit board mounted with electronic components on a conveyor chain. A plurality of gas passages for inflow of heated gas which have openings facing the circuit board, are provided at intervals in the transport direction of the conveyor chain. A first passage is provided for the flow of heated gas into the fan from an opening different from the opening for inflow and formed in the intermediate portion of the gas passage, and a second passage is provided for the flow of heated gas into the fan from openings formed on both ends of the gas passage.

Abstract: A reflow soldering apparatus uses circulated heated gas to solder electronic components to a printed circuit board while transporting the printed circuit board mounted with electronic components on a conveyor chain. A plurality of gas passages for inflow of heated gas which have openings facing the circuit board, are provided at intervals in the transport direction of the conveyor chain. A first passage is provided for the flow of heated gas into the fan from an opening different from the opening for inflow and formed in the intermediate portion of the gas passage, and a second passage is provided for the flow of heated gas into the fan from openings formed on both ends of the gas passage.