Patents Assigned to ZF Micro Solutions, Inc.
  • Patent number: 6711666
    Abstract: A multi-chip module and a chip set that comprises a plurality of the multi-chip modules. The multi-chip module includes a plurality of functional circuits provided on a substrate, the circuits defining a plurality of signal inputs and outputs. A plurality of pins are secured in a single row along the periphery of the substrate and are connected to the inputs and outputs. The pins include a set of 91 signal pins, two ground pins, and a power pin, the signal pins having a configuration complying in number and signal type with the IEEE-Prequirements to define an ISA bus. The multi-hip module includes a rectangular housing wherein the pins, in the form of gull wing pins, extend laterally from a peripherally extending wall. The ISA bus pins extend along one side and partially along adjacent sides of the rectangular module.
    Type: Grant
    Filed: March 14, 2000
    Date of Patent: March 23, 2004
    Assignee: ZF Micro Solutions, Inc.
    Inventor: David L. Feldman