Abstract: A coil forming apparatus includes: a coil winding jig that winds the belt-shaped coil, the coil winding jig including a plurality of comb-shaped grooves on an outer periphery thereof; a coil conveying mechanism that pivotally conveys the belt-shaped coil along at least a portion of the outer periphery of the coil winding jig; and guide members guide the belt-shaped coil in an arc shape while being in contact with the side ends. The guide members guide the belt-shaped coil so as to be in an arc shape having a diameter smaller than an outer diameter of the coil winding jig in a second half portion of the belt-shaped coil upon pivot conveying, and allow the plurality of straight portions to be inserted into a respective one of the plurality of comb-shaped grooves of the coil winding jig.

Abstract: A method for manufacturing a core-shell coaxial gallium nitride (GaN) piezoelectric nanogenerator is provided. A mask covering a center part of a gallium nitride wafer is removed. An electrodeless photoelectrochemical etching is performed on the gallium nitride wafer to form a primary GaN nanowire array on a surface of the gallium nitride wafer. A precious metal layer provided on the surface of the gallium nitride wafer is removed and an alumina layer is deposited on the surface of the gallium nitride wafer to cover the primary GaN nanowire array to obtain a core-shell coaxial GaN nanowire array. A first conductive layer is provided on a flexible substrate to which the core-shell coaxial GaN nanowire array is transferred. A second conductive layer is provided at a top end of the core-shell coaxial GaN nanowire array, and is connected to an external circuit to obtain the core-shell coaxial GaN piezoelectric nanogenerator.

Abstract: A holding and drive device including a frame; a rotation structure which is attached to the frame in such a manner that it can rotate around a rotation axis; a rotation drive for rotating the rotation structure around the rotation axis; and a rotation structure interface attached to or formed on the rotation structure, to which a tool device including a plurality of sleeves can be detachably attached, which are configured for the detachable attachment of a respective component holding device protruding from the rotation axis with a radial direction component or of another tool element. A corresponding tool device, a corresponding supplementary tool device, and a component handling device constructed from these components.

Abstract: A method of manufacturing an electrical circuit from bulk materials includes the steps of machining a first bulk dielectric material, forming a conductive element, and placing the conductive element on a first side the first bulk dielectric material. The method further includes the step of machining a second bulk dielectric material and placing the second bulk dielectric material on the first side of the first bulk dielectric material and over the conductive element. The first bulk dielectric material and the second bulk dielectric material may be laminated together.

Abstract: A method for manufacturing a transparent circuit board includes the following steps. A composite substrate including a conductive layer and a transparent insulating layer on the conductive layer is provided. A wiring groove is formed on the transparent insulating layer by laser ablation and a carbon black layer is formed on an inner wall of the wiring groove. The wiring groove penetrates the transparent insulating layer, the wiring groove extends toward the conductive layer to pass through a part of the conductive layer. A conductive wiring corresponding to the wiring groove is formed and fully fills the wiring groove. A black oxide treatment is performed on a surface of the conductive wiring facing away from the conductive layer to form a blackened layer. A transparent cover film is pressed on a side of the transparent insulating layer facing away from the conductive layer. The conductive layer is removed.

Abstract: A cable coater system for a downhole tool includes a cable coater. The cable coater may include a housing and one or more rollers that are coupled to the housing, wherein the one or more rollers are configured to rest on the downhole cable while guiding the cable through openings in the cable coater during wireline operations. The cable coater may remain on cable during all spooling (on and off) activities for the duration of operations and activated to coat the cable upon the final pull out of hole and prior to storage of the cable. The spooling in and out of the cable may further be automatically controlled by providing a positional indicator of the cable coater and thus where the cable is in three-dimensional space relative the spool.

Abstract: Methods for fabricating high frequency ultrasound transducers are disclosed. The methods include fabricating an acoustic lens layer with a curved center section and two flat side sections. The curved section includes a center portion with a midpoint and an edge. The midpoint has a first thickness, and the edge has a second thickness. The center portion is fabricated so that an average of the first and second thicknesses is approximately equal to an odd multiple of a quarter-wavelength of the center frequency of the ultrasound transducer. The methods can also include bonding the lens layer to a matching layer that is operationally coupled to a transducer layer. The matching layer can include an epoxy layer and another layer. Bonding the lens layer includes bonding the other layer to the lens layer using the epoxy layer such that the other layer is positioned between the epoxy layer and the transducer layer.

Abstract: A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.

Abstract: A method for manufacturing wire and cable products with a polymer cable component is provided. The method includes increasing the hardness of a polymer cable component in order to reduce compression and deformation of the cable components during manufacturing. In some instances, the hardness is temporarily increased prior to or during the process of creating twisted pair or during the cabling process.

Abstract: A method of manufacturing a wire harness having an electric wire and a protection tube covering, one end side of the electric wire being provided with a large-dimension portion greater than an inner dimension of the protection tube, including shaping the electric wire protection tube made of shape-memory polymer into a tube shape; expanding the protection tube by heating to a temperature equal to or higher than a glass-transition point such that the inner dimension of the protection tube becomes larger than the large-dimension portion; cooling the protection tube to a temperature below the glass-transition point and solidifying the protection tube; passing the large-dimension portion and the electric wire inside the protection tube; and reheating the electric wire protection tube to a temperature equal to or higher than the glass-transition point such that the electric wire protection tube is restored to the inner dimension obtained after the step of shaping.

Abstract: A clinch mechanism for assembling a printed circuit board with electronic components includes a drive shaft configured to move along a vertical axis, a stationary anvil configured to remain stationary during movement of the drive shaft, a cutter having a cutting tip, and a toggle configured to rotate about a toggle rotation axis that includes an involute gear shaped tooth configured to roll across an involute trapezoidal slot of the cutter in order to impart movement on the cutter relative to the stationary anvil. Movement of the drive shaft along the linear axis is configured to move the cutter relative to the stationary anvil, and to move the cutting tip across the stationary anvil to cut an electronic lead located between the cutting tip and the stationary anvil, and to rotate the toggle about the axis.

Abstract: The present invention is directed to improving an insulating property of a backing in which a lead array is buried. The method includes a coating forming process, in which insulating coatings are formed with respect to at least a plurality of lead rows included in a plurality of lead frames; after the forming of the insulating coatings, a plate manufacturing process, in which a plurality of backing plates are manufactured by pouring a backing material towards a lead row in each of the plurality of lead frames so that the lead row and the backing material are integrated with each other; and a laminating process, in which the plurality of backing plates are laminated.

Abstract: A preparation method for a piezoelectric fiber is provided including a piezoelectric functional layer and an insulating layer coated on the piezoelectric functional layer. The piezoelectric functional layer includes a piezoelectric composite layer of a spiral winding structure, and the piezoelectric composite layer includes a first piezoelectric layer, a conductive layer and a second piezoelectric layer that are sequentially stacked. The preparation method includes taking one end of the piezoelectric composite layer as a winding axis, winding the piezoelectric composite layer in a direction perpendicular to the winding axis to form the piezoelectric functional layer, wherein turns of winding the piezoelectric composite layer are greater than 5, coating the piezoelectric functional layer with the insulating layer, and vacuum heating to consolidate, to prepare a preform rod.

Abstract: A dieless crimp head is provided that includes a frame, an indentor, and a first positioning device. The frame has a first frame shell and a second frame shell, which define a frame opening. The indentor converges on a crimp center within the frame opening. The first positioning device has a connector slot defining a connector receipt area. The first positioning device is removably secured in the frame opening of the first frame shell at a use position in which the connector receipt area and the crimp center are aligned with, but offset along, a longitudinal axis of the crimp head.

Abstract: A method of manufacturing package structures includes providing a carrier including a supporting layer, a metal layer, and a release layer between the supporting layer and the metal layer at first. Afterwards, a composite layer of a non-conductor inorganic material and an organic material is disposed on the metal layer. Then, a chip embedded substrate is bonded on the composite layer. Afterwards, an insulating protective layer having openings is formed on the circuit layer structure and exposes parts of the circuit layer structure in the openings. Afterwards, the supporting layer and the release layer are removed to form two package substrates. Then, each of the package substrates is cut.

Abstract: A feeder includes a sprocket that feeds a tape accommodating multiple components; a motor that rotates the sprocket; a storage section to store the rotational position of the sprocket detected by a sensor as an initial rotational position when the tape is set in the feeder and store a cumulative feeding amount of the tape fed by the rotation of the sprocket; and a control section to control the motor such that the sprocket rotates in a forward direction based on a feeding amount of the tape required for a supply when supplying the components to the component mounting machine, and control the motor such that the sprocket does not rotate in a reverse direction in excess of the initial rotational position based on the initial rotational position and the cumulative feeding amount when rewinding the tape.

Abstract: A device for marking a conductor includes: a gripper for gripping the conductor extending in a longitudinal direction; a heating jaw assembly having two jaws spaced from each other in an open position in a first transverse direction transverse to the longitudinal direction; and a transport mechanism for dispensing a foil tape extending along the first transverse direction on a first side of the heating jaw assembly, a foil side of the foil tape facing away from the heating jaw assembly being weldable by heat and a foil side of the foil tape facing the heating jaw assembly including a marking of the conductor; and a gripper mechanism for moving the gripper along a second transverse direction transverse to the longitudinal direction and transverse to the first transverse direction when the heating jaw assembly is in the open position. The gripper moves the gripped conductor.

Abstract: A fire resistant coaxial cable and method of making is described that has a 2-part dielectric made of a polymer foam and a ceramifiable silicone rubber. The polymer foam, which can be polypropylene or other polymers, leaves little-to-no residue in the cable that causes electromagnetic loss when upon burning. The polymer foam can be extruded over a center conductor using an inert gas, such as nitrogen, to propagate the foam, ensuring little-to-no residue in the cable. The ceramifiable silicone rubber can be extruded over the polymer foam. The ceramifiable silicone rubber can have a polysiloxane matrix with inorganic flux and refractory particles that ceramify under high heat, such as temperatures specified by common fire test standards (e.g., 1850° F./1010° C. for two hours). The cable is configured to maintain a relatively coaxial relation between a center conductor and an outer conductor even under aforementioned fire tests.

Abstract: A method for creating a flexible transition joint between HVDC-MI cables having different diameters. The central wires of the conductors are thermally joined by a conical connection piece. The strands of the layers of stranded wires surrounding the central wires are rewound, cut and thermally joined along their respective lay lengths. The stranded are sanded/ground along the lay length of the strands to form a smooth uniform transition having the same slope as the conical connection piece. A paper lapping machine is used to form an insulation patch over the transition joint.

Abstract: A circuit formation method includes: a protruding portion formation step of forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid; a wiring formation step of forming a wiring extending toward the protruding portion by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and making the metal-containing liquid conductive; a paste application step of applying a resin paste containing micrometer-sized metal particles different from the metal-containing liquid on the protruding portion and the wiring, such that the protruding portion and the wiring are connected to each other; and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied on the protruding portion.