Abstract: A lens apparatus includes an exterior unit incorporating a lens unit, and an operation unit arranged on the exterior unit, on which a touch operation is performed to control at least one controlled unit. The operation unit has a round shape and includes a detection unit configured to detect a clockwise direction touch operation and a counterclockwise direction touch operation.

Abstract: An imaging device including: a first photoelectric converter that generates a first signal by photoelectric conversion; a first transistor having a gate configured to be electrically coupled to the first photoelectric converter; a second photoelectric converter that generates a second signal by photoelectric conversion; a capacitor having a first terminal and a second terminal, the first terminal being configured to be electrically coupled to second photoelectric converter, a first potential being applied to the second terminal; and a switch element provided between the gate of the first transistor and the first terminal of the capacitor.

Abstract: A meta lens assembly includes a first meta lens, a second meta lens arranged on an image side of the first meta lens, and a third meta lens arranged on an image side of the second meta lens, the first meta lens, the second meta lens, and the third meta lens being arranged from an object side of the meta lens assembly to an image side of the meta lens assembly facing an image sensor.

Abstract: An image sensor includes sensing pixels, each comprising a photodetector in electrical communication with a floating diffusion capacitor via a transfer gate, and a lateral overflow storage capacitor coupled to the floating diffusion capacitor via a lateral overflow control gate. A first readout circuit circuitry located between the transfer gate and the lateral overflow control gate comprises a first amplifier. A second readout circuitry, located opposite the lateral overflow control gate from the first readout circuitry, comprises a second amplifier. Following image integration, charge stored on the floating diffusion capacitor is readout using the first readout circuitry and charge stored on the lateral overflow storage capacitor is readout using the second readout circuitry. In a second readout, charge stored on the photodetector is readout using the first readout circuitry with a first amplification applied and charge stored on the photodetector is readout with a second, different amplification applied.

Abstract: An image sensor may include a first photo-sensing device on a semiconductor substrate and configured to sense light of a first wavelength spectrum, and second and third photo-sensing devices integrated in the semiconductor substrate and configured to sense light of a second and third wavelength spectrum, respectively. The first photo-sensing device may overlap each of the second and third photo-sensing devices in a thickness direction of the semiconductor substrate. The second and third photo-sensing devices do not overlap in the thickness direction and each have an upper surface, a lower surface, and a doped region therebetween. The third photo-sensing device includes an upper surface deeper further from the upper surface of the semiconductor substrate than the upper surface of the second photo-sensing device and a doped region thicker than the doped region of the second photo-sensing device. The image sensor may omit the first photo-sensing device.

Abstract: An electronic device includes a lens assembly that receives external light, which is used by a camera module to capture a still image and/or a moving picture, in a first direction, a housing forming an outer portion of the camera module, a first support disposed inside the housing and disposed in a second direction away from the lens assembly, wherein the second direction is perpendicular to the first direction; and a second support including at least a portion protruding in the second direction while surrounding the lens assembly, wherein the first support and the second support are disposed in the second direction away from the lens assembly.

Abstract: According to various embodiments, an electronic device may comprise: a first camera arranged on a first surface of a housing of the electronic device; a second camera arranged apart from the first camera on the first surface; a display; and a processor set to process at least a portion of a first inputted image by applying a first image effect and display same on the display, on the basis of a first object area for the first inputted image obtained by using phase difference information of the first inputted image from among the first inputted image obtained from the first camera or a second inputted image obtained from the second camera, and to process at least a portion of the first inputted image by applying a second image effect and displaying same on the display, on the basis of a second object area for the first inputted image obtained by using time difference information between the first inputted image and the second inputted image.

Abstract: A vibration type actuator includes a vibrating body including an elastic body and an electro-mechanical energy conversion element, a contact body contacting the vibrating body, a flexible printed board provided with a concave portion on a surface opposite to a surface contacting the electro-mechanical energy conversion element and configured to supply electric power to the electro-mechanical energy conversion element, and a holding member provided with a projection portion engaging with the concave portion.

Abstract: The present teachings provide an image capture device including a bayonet and an integrated sensor and lens assembly (ISLA). The bayonet is connected to a body of the image capture device. The ISLA is connected to the bayonet. All or a portion of the ISLA extends into the body of the image capture device. The ISLA includes a lens assembly having a forward end and a rearward end and an integrated sensor. The integrated sensor is connected to the rearward end of the lens assembly. Fasteners extend through the bayonet into the forward end of the lens assembly to connect the ISLA to the bayonet.

Abstract: It is an object of the present technology to provide an image sensor capable of reducing crosstalk in an AD conversion unit. The image sensor includes: capacitors in an even-numbered column region; and a capacitor in an odd-numbered column region disposed facing the capacitors in the even-numbered column region with different areas.

Abstract: An image sensor includes a pixel array of pixels arranged in one or more rows and one or more columns, the pixel array configured to generate an image based on light being incident on one or more pixels of the pixel array. The image sensor includes pixel load circuitry connected to one column of pixels and including transistors serially connected to each other. The image sensor includes switches connected in parallel to separate, respective nodes between adjacent transistors. The image sensor includes image sensor processing circuitry configured to receive, from image processor circuitry, gain information indicating an intensity of light concurrently with an image being generated by the image sensor, and control at least one switch of the plurality of switches to be turned on/off to change an electrical path of a current that passes through the pixel load circuitry, based on the gain information.

Abstract: A method of calibrating an image sensor including a color filter array having a first-type array pattern, the method includes capturing a target using the image sensor to generate first image data, performing a white balance operation on the first image data to generate second image data, performing an inverse white balance operation on the second image data based on a second-type array pattern to generate third image data, the second-type array pattern being different from the first-type array pattern, and calibrating the image sensor based on the third image data.

Abstract: The present disclosure relates to a camera module capable of achieving a smaller height, a method of manufacturing a camera module, an imaging apparatus, and an electronic apparatus. An imaging device having its imaging surface bonded to a provisional substrate is attached, and the imaging device in that state is joined to a substrate via an electrode having a TSV structure. After the provisional substrate is detached, an IR cut filter (IRCF) on which a light blocking film is printed or jet-dispensed in a region other than the effective pixel region is bonded to the imaging surface via a transparent resin. Because of this, there is no need to provide any sealing glass in the stage before the imaging surface, and the optical length of the lens can be shortened. Thus, a smaller height can be achieved. The present disclosure can be applied to camera modules.

Abstract: A photoelectric conversion device includes a photoelectric conversion region, a readout circuit, and a counting circuit. The photoelectric conversion region is configured to generate a signal charge. The readout circuit is configured to, when reading out a signal that is based on the signal charge generated at the photoelectric conversion region, selectively perform first readout for reading out the signal using avalanche multiplication that is based on the signal charge and second readout for reading out the signal without causing avalanche multiplication to occur with respect to at least a part of the signal charge. The counting circuit is configured to count a number of occurrences of avalanche current which is caused to occur by avalanche multiplication in the first readout.

Abstract: There is provided a solid-state imaging device including a semiconductor substrate on which photoelectric conversion devices are arranged in an imaging device region in a two-dimensional array, and a stacked body formed by stacking layers on the semiconductor substrate, wherein the stacked body includes an in-layer lens layer that has in-layer lenses each provided at a position corresponding to each of the photoelectric conversion devices, a planarization layer that is stacked on the in-layer lens layer and that has a generally planarized surface, and an on-chip lens layer that is an upper layer than the planarization layer and that has on-chip lenses each provided at a position corresponding to each of the photoelectric conversion devices, and the in-layer lens layer has structures at a height generally equal to a height of the in-layer lenses, the structures being provided on an outside of the imaging device region.

Abstract: An image sensor includes ADCs, each including a comparator receiving a ramp signal and an image signal, and generating a comparator output. Each ADC also includes a counter ceasing to change a digital count value in response to a change in the comparator output. The digital count value has a first resolution. Each ADC also includes a delay line circuit including a delay line generating a first digital value encoding a duration of a period of the counter clock and generating a second digital value encoding a first portion of the period of the counter clock. Each ADC also includes a delay to digital circuit generating a digital output value based on the first and digital values. The digital output value encodes a second value of the ramp signal, where the digital count value has a second resolution that is greater than the first resolution.

Abstract: A multi-aperture imaging device includes an image sensor, an array of optical channels, each optical channel including an optic for imaging a partial field of view of a total field of view onto an image sensor region of the image sensor, and a beam-deflector switchable between a first rotational position and a second rotational position by executing a switching movement, and configured to deflect, in a first rotational position, optical paths of the optical channels into a first viewing direction, and to deflect, in a second rotational position, the optical paths of the optical channels into a second viewing direction. The array is configured to execute, based on the switching movement, an adjustment movement for adjusting an orientation of the array with respect to the beam-deflector.

Abstract: A camera module according to various embodiments of the present invention comprises a lens module including at least one lens, and an image sensor module coupled to the lens module, wherein the image sensor module comprises a micro lens, at least one photodiode, and a filter array, the filter array includes a first filter capable of transmitting light of a first designated band and a second filter capable of transmitting light of a second designated band corresponding to a color having a complementary color relationship with another color corresponding to the first designated band, and the filter array may be disposed between the micro lens and the at least one photodiode. Various other embodiments are possible.

Abstract: An image sensor includes unit pixels of a first pixel group sharing a first floating diffusion region and associated with a single color filter, and unit pixels of a second pixel group sharing a second floating diffusion region and associated with the single color filter. Control logic may generate an image by obtaining capacitance having a first value from the first floating diffusion region at a first time, and obtaining capacitance having a second value different from the first value from the second floating diffusion region at a second time following the first time. The first pixel group and the second pixel s group have different sensitivity levels.

Abstract: A lens driving device is disclosed that includes two movers, a long quadrangular frame body, at least two coils and an FPC. The movers are arranged side by side and provided with a through hole for accommodating a lens body, respectively. The frame body surrounds an outer periphery of the two movers. The two coils face one mover of the two movers and are fixed to two long sides of the frame body. The FPC includes coil connecting terminals electrically connected to the two coils.