Patents Examined by Aexander Gilman
  • Patent number: 10096958
    Abstract: In one embodiment, the present invention includes an interface apparatus for semiconductor testing. The interface apparatus includes a housing. The housing includes a lower housing substrate and an upper housing substrate. The lower housing substrate has a plurality of apertures arranged according to a fine pitch, and the upper housing substrate has a plurality of apertures arranged according to a coarse pitch. A plurality of wires passes through the plurality of apertures from the lower housing substrate to the upper housing substrate. Each wire has plated conductive ends emanating from opposing sides of the housing. The plurality of apertures of the lower housing substrate corresponds to the plurality of apertures of the upper housing substrate. The interface apparatus transforms a pattern having a course pitch to a pattern having a fine pitch.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: October 9, 2018
    Assignee: Spire Manufacturing Inc.
    Inventors: Hai Dau, Lim Hooi Weng, Kothandan Shanmugam, Christine Bui
  • Patent number: 9871310
    Abstract: An electrical connector includes an anode assembly for conducting an electrical supply current from a source to a destination, the anode assembly includes an anode formed into a first shape from sheet metal or other sheet-like conducting material. A cathode assembly conducts an electrical return current from the destination to the source, the cathode assembly includes a cathode formed into a second shape from sheet metal or other sheet-like conducting material. An insulator prevents electrical conduction between the anode and the cathode. The first and second shapes are such as to provide a conformity of one to the other, with the insulator therebetween having a predetermined relatively thin thickness.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: January 16, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Paul W. Coteus, Andrew Ferencz, Shawn Anthony Hall, Todd Edward Takken
  • Patent number: 7601009
    Abstract: One embodiment of the present invention is a socket useful to contact an electronic device, the socket including: (a) one or more contactor holder plates including one or more first through holes having a first hole cross sectional area, and one or more second through holes having a second hole cross sectional area; (b) one or more first contactors having a body with a first body cross sectional area disposed in the first through holes; (c) one or more second contactors having a body with a second body cross sectional area disposed in the second through holes; and (d) a heat sink in thermal contact with one or more of the one or more contactor holder plates; wherein a first ratio of the first hole cross sectional area to the first body cross sectional area is different from a second ratio of the second hole cross sectional area to the second body cross sectional area.
    Type: Grant
    Filed: January 17, 2007
    Date of Patent: October 13, 2009
    Assignee: Centipede Systems, Inc.
    Inventor: Thomas H. Di Stefano