Patents Examined by Alan M. Boswell
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Patent number: 6631546Abstract: A method of manufacturing includes 2 mushroom plating process starts with an overplated component which includes an enlarged mushroom head having outer portions which overhang a resist layer. The next step in the first process embodiment is a heating step in which the resist layer is hard baked. Thereafter, using a dry etch process, such as a reactive ion etch (RIE) process, the hard baked resist layer is removed in all areas except beneath the overhang of the mushroom head. The area beneath the overhang thereby remains filled with hard baked resist. Thereafter, the device is ultimately encapsulated such that no voids and/or redeposition problems exist under the overhang due to the presence of the hard baked resist. In an alternative process embodiment of the present invention the dry etch process is conducted first upon the resist layer, such that the resist layer is removed in all areas except under the overhang. Thereafter, the device is baked, such that hard baked resist remains beneath the overhang.Type: GrantFiled: February 1, 2000Date of Patent: October 14, 2003Assignee: International Business Machines CorporationInventors: Thomas Edward Dinan, Richard Hsiao, John I. Kim, Ashok Lahiri, Clinton David Snyder
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Patent number: 6625874Abstract: A method of forming a thermal bend actuator (6) is provided with upper arms (23, 25, 26) and lower arms (27, 28) which are non planar, so increasing the stiffness of the arms. The arms (23, 25, 26, 27, 28) may be spaced transversely of each other and do not overly each other in plan view, so enabling all arms to be formed by depositing a single layer of arm forming material.Type: GrantFiled: August 31, 2001Date of Patent: September 30, 2003Assignee: Silverbrook Research Pty LtdInventor: Kia Silverbrook
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Patent number: 6618943Abstract: A drop-on-demand piezo-electric printhead has channel walls defined by piezo-electric material (10) with electrodes (26) along the length thereof. In portions of the channels which are open to an ink supply conduit, the piezo material is locally disabled, e.g. by reducing the width of the electrode or by interposing a material (40) of lower dielectric constant between the electrode and the piezo material. A lower capacitive load results.Type: GrantFiled: September 7, 2001Date of Patent: September 16, 2003Assignee: Xaar Technology LimitedInventors: James Ashe, Christopher David Phillips, Stephen Temple
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Patent number: 6609297Abstract: A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30b and an opening 3a through which a via hole is formed. A camera senses this register mark 30b so that the position of the board 30 is determined. A laser beam is directed to the approximate position of the opening 30a, so that the opening 26a through which the via hole is drilled is formed. The accuracy of the position of the opening of the via hole depends on the accuracy of the position of the opening 30a in the Cu film 30 as the conformal mask. Therefore, the via hole can be formed at an adequate position despite the low accuracy of the position for laser irradiation.Type: GrantFiled: June 12, 2000Date of Patent: August 26, 2003Assignee: Ibiden Co., Ltd.Inventors: Yasuji Hiramatsu, Motoo Asai, Naohiro Hirose, Takashi Kariya
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Patent number: 6604283Abstract: A method of manufacturing an electrode array has an elongate flexible carrier that is much more flexible in a first direction than in a second direction orthogonal thereto. The elongate flexible carrier is formed with a bias force that causes the array to flex in the first direction so as to assume the general spiral or circular shape of the scala tympani duct within the cochlea. The less-flexible direction is the direction that makes it difficult for the array to twist as it is inserted within the scala tympani duct. The bias force is sufficiently strong to cause the array to assume its preformed spiral shape even after being straightened during initial insertion into the cochlea. Electrode contacts, embedded into the carrier so as to be exposed along an inner or concave surface of the spiral, thus wrap snugly around the modiolus, thereby positioning the electrode contacts against the modiolar wall in an optimum position for stimulation.Type: GrantFiled: March 3, 2000Date of Patent: August 12, 2003Assignee: Advanced Bionics CorporationInventor: Janusz A. Kuzma
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Patent number: 6591494Abstract: A non-contact type IC card includes a plane coil comprising a conductor line wound several times on substantially the same surface. The plane coil has respective terminals at the innermost and outermost ends. A semiconductor element has electrode terminals electrically connected to the terminals of the plane coil, respectively. A resin-filled portion is defined by a part of the circumference of the plane coil where spaces between adjacent loops of conductor line of the plane coil are filled with light-setting resin to maintain predetermined intervals between the adjacent conductors lines of the plane coil.Type: GrantFiled: August 28, 2001Date of Patent: July 15, 2003Assignee: Shinko Electric Industries Co., LTDInventors: Shigeru Okamura, Tomoharu Fujii
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Patent number: 6578254Abstract: A process for fabricating coils using a Damascene process uses a curved substrate having a surface extending along and about an axis made of a first material. A groove is formed in the curved surface along and around said axis, and the groove is filled with a second material that is different from the first material to form a coil of second material in said first material. Excess second material is then removed from the surface of the first material, leaving the coil of second material in the groove.Type: GrantFiled: December 8, 2000Date of Patent: June 17, 2003Assignee: Sandia CorporationInventors: David P. Adams, Michael J. Vasile
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Patent number: 6568071Abstract: A method for fabricating an encoder containing a plurality of registration markings per unit distance for use as a registration reference, for instance for a print head of a printer. The registration markings being aligned in a longitudinal direction. In one preferred method of practicing the invention a polymer substrate on which the encoder is to be imprinted is first provided. An optical imagesetter device is utilized which includes a cylindrical drum and a controllable light source for directing light toward the cylindrical drum. The cylindrical drum includes a surface for receiving the polymer substrate and an axis of rotation. After the polymer substrate is retained upon the drum surface, an image of the encoder is projected upon the retained polymer substrate wherein the longitudinal axis of the encoder being angularly offset relative to the axis of rotation.Type: GrantFiled: February 15, 2000Date of Patent: May 27, 2003Assignee: Encoder Science Technologies, LLCInventors: Gregory A. Hansel, Bryan L. Hansel, Donald C. Hansel, Jeffrey J. Johnson
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Patent number: 6553659Abstract: Each of a plurality of suction nozzle sections 20 provided about the outer circumference of an intermittently rotating head section 21 comprises a plurality of nozzle tip sections 10 for picking up electronic components 22 by suction, these nozzle tip sections 10 being connected to a rod section 4, which is driven to rotate by a motor 1. A cylindrical cam section 8having a cam surface 8a and being able to rotate relative to the rod section 4 is provided such as to encase the nozzle tip sections 10, and one ends of the nozzle tip sections 10 engage with the cam surface 8a of the cam section 8 via rollers 6, whereby the nozzle tip sections 10 are movable in a vertical direction. On the outer side of the cylindrical cam section 8, a stopper section 12 is provided for halting temporarily the rotation of only the cylindrical cam surface 8.Type: GrantFiled: August 24, 2000Date of Patent: April 29, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Akiko Ida, Muneyoshi Fujiwara, Kunio Sakurai, Minoru Yamamoto, Kurayasu Hamasaki
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Patent number: 6553654Abstract: Arrangement for the insertion of coils in a stator including a moving wire-insertion spider, a plurality of parallel wire-guide blades arranged along the contour of the moving spider, a stack-guide member provided with a plurality of recesses accommodating respective blades which are provided with a groove on their outer surface. The recesses are provided with a rib protruding towards the interior of the respective recess and extending parallel to the longitudinal direction thereof, and are adapted to engage respective grooves when the stack-guide member is inserted within the wire-guide blades. The grooves maybe arranged in pairs on a respective blade and are symmetrical with respect to a vertical plane passing through the axis of the moving spider.Type: GrantFiled: August 14, 2000Date of Patent: April 29, 2003Assignee: Zanussi Elettromeccanica S.p.A.Inventor: Jose Sarro Alonso
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Patent number: 6550132Abstract: The present invention provides a manufacturing method of an ink-jet recording head which does not form stagnant ink even at a high density and high speed recording and does not bear stagnant ink due to a heat influence during radiation of excima laser beam on ejecting ports(orifice) 706 and due to defects or deposited foreign particles during connecting the orifice 706 with a top board 102. In order to obtain such recording heads, before fabricating the ejecting ports 706 a by-product removing tape 101 is pasted capable of being peeled off, on eject port forming plate which is fabricated to an orifice plate 102, so as to increase adhesive property between the by-product removing tape and removed portion by the laser beam.Type: GrantFiled: December 2, 1999Date of Patent: April 22, 2003Assignee: Canon Kabushiki KaishaInventor: Junji Tatsumi
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Patent number: 6539622Abstract: An electronic components mounting device has a plurality of feeder bases attached with tape feeders thereon, and a guide rail and a cylinder for drawing each of the feeder bases independently to a position for replenishing electronic components. When an electronic component runs out of the storage, only the feeder base that is carrying the relevant tape feeder gone out of the stock is drawn to a place for parts replenishment; in the mean time, the mounting actions keep on going by making use of tape feeders attached on other feeder base. Machine stop times can be decreased with the mounting device.Type: GrantFiled: December 6, 1999Date of Patent: April 1, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Wataru Hidese, Yusuke Yamamoto
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Patent number: 6425177Abstract: An apparatus and a method for compliant positioning of an object during an assembly operation wherein the apparatus includes a base plate, a locator plate for mounting an object such as a clamp or a tool spaced from the base plate and a plurality of linear actuators connected between the base plate the locator plate by universal joints providing six degrees of freedom of movement. According to the apparatus and the method a control is connected to the actuators for selectively moving the locator plate to a predetermined position relative to the base plate for contacting a component to be assembled with an object mounted on the locator plate. Tow or more of the actuators can be mechanically coupled to move the locator plate with less than six degrees of freedom. The control is responsive to a force applied to the locator plate through the object during assembly of the component for actuating the linear actuators to change the applied force.Type: GrantFiled: March 27, 2000Date of Patent: July 30, 2002Assignee: Fanuc Robotics North America, Inc.Inventor: Hadi A. Akeel