Abstract: The present invention relates to a (meth)acrylic polymer composition. In particular the present invention it relates to polymeric composition suitable for security glazing. The invention also relates to a process for manufacturing such a polymeric composition suitable for security glazing. More particularly the present invention relates to a bullet resistant (meth)acrylic polymer composition and relates also to a process for preparing such a bullet resistant (meth)acrylic polymer composition and its use in glazing.

Abstract: A support backplate includes a plurality of support strips and a first elastic connection layer. The plurality of support strips are arranged at intervals in a first direction, and each support strip of the plurality of support strips extends in a second direction. The first direction is perpendicular to a thickness direction of the support strip, and the second direction is substantially perpendicular to the first direction in a first plane perpendicular to the thickness direction. The first elastic connection layer is disposed on a side of the plurality of support strips in the thickness direction, and the first elastic connection layer is directly connected to the support strip.

Abstract: There is provided a method of producing a containerboard, comprising the step of pressing a web formed from a pulp comprising NSSC pulp in an extended nip press, such as a shoe press, wherein the line load in the extended nip press is above 1200 kN/m. Further, there is provided a corrugated board comprising a liner and a fluting, wherein the fluting is formed from a pulp comprising NSSC pulp, the density of the fluting is above 725 kg/m3 and the geometric SCT index (ISO 9895) of the fluting is above 37 Nm/g.

Abstract: A metal-clad laminate is provided. The metal-clad laminate includes: a dielectric layer, which has a first reinforcing material and a dielectric material formed on the surface of the first reinforcing material, wherein the dielectric material includes 60 wt % to 80 wt % of a first fluoropolymer and 20 wt % to 40 wt % of a first filler; an adhesive layer, which is disposed on at least one side of the dielectric layer and includes an adhesive material, wherein the adhesive material has 60 wt % to 70 wt % of a second fluoropolymer and 30 wt % to 40 wt % of a second filler; and a metal foil, which is disposed on the other side of the adhesive layer that is opposite to the dielectric layer, wherein the melting point of the second fluoropolymer is lower than the melting point of the first fluoropolymer.

Abstract: A purpose of the present invention is to provide a photosensitive resin composition which retains satisfactory image resolution and gives cured objects reduced in wet-heat dissolution or contamination and having satisfactory wet-heat adhesiveness. The photosensitive resin composition of the present invention comprises: (A) a cationic photopolymerization initiator which comprises a salt of a cation with an anion represented by formula (1) (wherein R1 to R4 each independently represent a C1?18 alkyl or C6-14 aryl group, provided that at least one of R1 to R4 represents a C6-14 aryl group); and (B) an epoxy compound. R1 to R4 may be each independently either a phenyl group having one or more perfluoroalkyl groups as substituents or a phenyl group having one or more fluorine atoms as substituents. R1 to R4 may be each independently a pentafluorophenyl or bis(trifluoromethyl)phenyl group.

Abstract: The present invention relates to a photoelectric film and a fabrication method thereof, and in particular, to a layered polycrystalline lead selenide (PbSe) film and a fabrication method thereof. The fabrication method mainly includes: (1) fabricating a dense PbSe layer on a substrate through chemical bath deposition (CBD); (2) fabricating a loose plumbonacrite (Pb10O(OH)6(CO3)6) layer on the dense PbSe layer through CBD; (3) placing a sample with the dense PbSe layer and the Pb10O(OH)6(CO3)6 layer in a selenium ion-containing solution to allow an ion exchange reaction to finally form the layered polycrystalline PbSe film. The fabrication method has the advantages of simple process, low cost, and high controllability.

Abstract: A high-performance multilayer film for packaging, the structure being: BL/TIE/PO1/POX/PO3, obtained once by multilayer coextrusion and biaxial stretching, wherein: the total thickness of the multilayer film is 8 to 100 micrometers; the absolute value of the difference of the solubility parameters between the PO1 and PO3 layer materials is ?0.1 and ?0.5, and the absolute value of the difference of the cohesive energy density is ?3, and ?5; the solubility parameter and cohesive energy density of the POX bridge material are based on one of the PO1 and PO3 layer materials, and it's transitioned to the other in a gradient way; the absolute value of the difference of the solubility parameters between adjacent layers from the PO1 layer to the POX bridge and the PO3 layer is ?0.1 (J·cm?3)1/2, and the absolute value of the difference of the cohesive energy density is ?3 J/cm3).

Abstract: A first embodiment is a hard coat laminated film which sequentially includes a first hard coat layer and a transparent resin film layer from the surface layer side, and wherein the first hard coat layer is formed from a coating material that contains 100 parts by mass of (A) a copolymer of (a1) a polyfunctional (meth)acrylate and (a2) a polyfunctional thiol and 0.01-7 parts by mass of (B) a water repellent agent, while containing no inorganic particles.

Abstract: Disclosed herein are compositions and methods related to a packaging laminate comprising: a first polymeric layer comprising a polypropylene copolymer or a high density polyethylene (HDPE) resin; and a second polymeric layer comprising a high density polyethylene (HDPE) resin or linear low density polyethylene (LLDPE) resin with a coextruded ethyl vinyl alcohol (EVOH) compatibilizer. Also disclosed herein are packaging containers formed of the packaging laminates.

Abstract: An organopolysiloxane cured film which can be made thin, has an extremely low number of defects on a surface and inside of the film, and exhibits high dielectric breakdown strength with regard to a load voltage is provided. Also provided are applications thereof and a method of manufacturing. The organopolysiloxane cured film has an average thickness within a range of 1 to 200 ?m. In general, the number of surface defects is 0 to 1, and the number of internal defects is 0 to 20, when measuring the number of surface defects using optical means in an arbitrary position on the organopolysiloxane cured film with a unit area of 15 mm×15 mm. The organopolysiloxane cured film may be obtained by a rolling step in a clean room or the like, or may be obtained by curing between separators provided with a release layer.