Abstract: A hearing system is disclosed comprising a support unit, and at least one abutment unit, wherein the support unit supports the at least one abutment unit. The at least one abutment unit has a contact surface. The support unit is configured to be placed at a user's head such that the contact surface of the at least one abutment unit contacts the user's head in an area surrounding one of the user's ears, in particular, in an area of one of the user's mastoid bones. The at least one abutment unit comprises a contact element, the contact element being configured to transmit vibrations generated by a vibration generating unit towards the contact surface. The contact element is made of a fiber-reinforced plastic material.

Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Abstract: Occlusion devices, earpiece devices and methods of forming occlusion devices are provided. An occlusion device is configured to occlude an ear canal. The occlusion device includes an insertion element and at least one expandable element disposed on the insertion element. The expandable element is configured to receive a medium via the insertion element and is configured to expand, responsive to the medium, to contact the ear canal. Physical parameters of the occlusion device are selected to produce a predetermined sound attenuation characteristic over a frequency band, such that sound is attenuated more in a first frequency range of the frequency band than in a second frequency range of the frequency band.

Abstract: A flat-panel display device described herein includes a display screen; a display backplate; a chassis slidably arranged on the display backplate; a fixing support, a motion module arranged on the chassis, wherein the motion module includes a first telescopic assembly and a second telescopic assembly arranged on the fixing support; a first speaker arranged on the chassis; and a second speaker connected to the second telescopic assembly. The first telescopic assembly is matched with the display backplate and configured to drive the chassis, the first speaker, the second speaker and the second telescopic assembly to move back and forth in a first direction relative to the display backplate. The second telescopic assembly is configured to drive the second speaker to move back and forth in a second direction relative to the display backplate and the first speaker.

Abstract: The present disclosure relates to a speaker device including a circuit housing, an ear hook, a rear hook, and a speaker assembly. The speaker assembly may include a headphone core and a housing for accommodating the headphone core, the housing may include a housing panel facing a human body and a housing back opposite to the housing panel, and the headphone core may cause the housing panel and the housing back to vibrate. An absolute value of a difference between a first phase of a vibration of the housing panel and a second phase of a vibration of the housing back may be less than 60 degrees when a frequency of each of the vibration of the housing panel and the vibration of the housing back is between 2000 Hz and 3000 Hz.

Abstract: The invention relates to a vibration module for placing on an eardrum, which vibration module has a flat sound transducer and an eardrum contact mold for contacting the eardrum.

Abstract: The embodiments of present disclosure disclose a loudspeaker. The loudspeaker may include an ear hook including a first plug end and a second plug end. The ear hook may be surrounded by a protection sleeve, and the protection sleeve may be made of an elastic waterproof material. The loudspeaker may include an earphone core housing configured to accommodate the earphone core, and the earphone core housing may be fixed to the first plug end through plugging, and may be elastically abutted against the protection sleeve elastically. The loudspeaker may include a circuit housing configured to accommodate a control circuit or a battery. The circuit housing may be fixed to the second plug end through plugging.

Abstract: A damping system for an ear cup headphone design. The damping system introduces a completely enclosed inner acoustic volume in the rear volume of the ear cup by way of supporting a baffle damper spaced apart from the driver of the ear cup, wherein the density of the baffle damper diffuses acoustic wave rearwardly emanating from the driver. Additional damper masses of different relative densities may occupy the rear volume rearward of baffle damper.

Abstract: Example techniques may involve controlling a passive radiator. An implementation may include a device receiving, via a network interface, audio content and generating an audio signal representing the audio content. Generating the audio signal involves modifying portions of the audio content to limit excursion of the speaker driver to less than an excursion limit when a forward prediction model indicates that the portions of the audio content are predicted to cause the speaker driver to move beyond the excursion limit. While playing back the generated audio signal via the audio stage, the device detects, via a sensor, clipping of the speaker driver and generates a feedback signal based on the detected clipping of the speaker driver. The device adjusts the forward prediction model based on the generated feedback signal.

Abstract: An earphone with a circuit board module includes a casing, a speaker, and a circuit board module. The casing includes a back cover and has an accommodation space inside. The speaker is disposed in the accommodation space, and a first chamber is defined between the speaker and the back cover. The circuit board module is disposed in the first chamber and includes a first circuit board having a first surface, a second circuit board having a second surface, and a first flexible connector. The first surface faces and is spaced apart from the second surface of the second circuit board. The first flexible connector includes a first end connected to the first circuit board, a second end which is opposite to the first end and connected to the second circuit board, and a connection segment which connects the first and second ends and is shaped as a letter U.

Abstract: The present disclosure discloses a loudspeaker apparatus. The loudspeaker apparatus may include a support connection member configured to contact with a user's head. The loudspeaker apparatus may include at least one loudspeaker assembly. The loudspeaker assembly may include an earphone core and a core housing configured to accommodate the earphone core. The core housing may be fixedly connected to the support connection member. At least one button module may be arranged on the core housing. The interior of the core housing may further include at least two microphones, and the at least two microphones may be arranged at a position different from a user's mouth. The loudspeaker apparatus may further include a control circuit or a battery accommodated in the support connection member. The control circuit or the battery may drive the earphone core to vibrate to generate sound.

Abstract: A headphone device includes a housing, a sound generator and a tube. The housing includes a main body and a cover plate. The cover plate includes a first surface and a second surface. The first surface is disposed towards the main body and connected to the main body to form an internal space. The second surface is disposed opposite to the first surface. The sound generator is disposed in the internal space. The tube includes a tubular body, a first end and a second end. The tubular body is disposed between the first end and the second end. The tubular body has a cross section which is in a closed shape. The second surface of the cover plate is disposed towards the tubular body. The tubular body and the second surface are disposed in parallel or have an included angle less than twenty degrees.

Abstract: An apparatus, including an external component of a medical device configured to generate a magnetic flux that removably retains, via a resulting magnetic retention force, the external component to a recipient thereof, wherein the external component is configured to enable the adjustment of a path of the generated magnetic flux so as to vary the resulting magnetic retention force.

Abstract: A system for positioning an earbud relative to the ear of a person includes an ear frame that extends between a first end and a second end. The ear frame extends in an ear frame plane defined by the first end, the second end, and a top portion. The system further includes an earbud receiver configured to receive a stem of an earbud. The earbud receiver is connected to the ear frame. The earbud receiver defines a bore extending along an earbud receiver axis between a first opening at a first end of the earbud receiver and a second opening at a second end of the receiver. The earbud receiver axis intersects the ear frame plane an angle theta selected to retain the position the earbud relative to the ear of the person. In some embodiments, theta is selected between 5 degrees and 30 degrees.

Abstract: Headphone playback devices can include a cable assembly including a plurality of conductors extending between a first earpiece and a second earpiece. The cable assembly includes a jacket, a power conductor disposed within the jacket and coupled between a power source in the first earpiece and a wireless transceiver in the second earpiece. The cable assembly further includes a microphone conductor at least partially disposed within the jacket and coupled to a microphone in one of the earpieces. A shield is at least partially disposed between the power conductor and the microphone conductor to reduce electromagnetic interference between the two.

Abstract: An electrostatic headphone is provided, comprising a first ear cup assembly, a second ear cup assembly, and a headband assembly coupled to each of the first ear cup assembly and the second ear cup assembly. Each ear cup assembly comprises an electrostatic transducer, a high voltage amplifier electrically coupled to the transducer, and a high voltage power supply electrically coupled to the high voltage amplifier. At least one of the ear cup assemblies further comprises a power source for providing electric power to the high voltage power supply included in the at least one ear cup assembly. In some cases, one or more of the ear cup assemblies further comprises a wireless communication module for receiving audio signals from an audio source.

Abstract: A sound producing package structure includes a first sub-package structure and a second sub-package structure. The first sub-package structure includes a first substrate having a first opening and a first chip including a first membrane, wherein a first cavity is formed between the first membrane and the first substrate. The first sub-package structure and the second sub-package structure are stacked, and the second sub-package structure includes a second substrate and a second chip. The second substrate is connected to the first substrate and has a second opening. The second chip includes a second membrane, wherein a second cavity is formed between the second membrane and the second substrate. A gap, connected to the first opening and the second opening, is formed between the first substrate and the second substrate, such that an ambient of the sound producing package structure, the first cavity and the second cavity are connected.

Abstract: A microelectromechanical system includes an enclosure defining a cavity and an opening communicating with the cavity; a membrane mounted at the opening; a cantilever located within the cavity, the at least one cantilever comprising a first end, a second end and a fulcrum located between the first end and the second end; a plunger positioned between the membrane and the cantilever and configured to transfer displacement of the membrane to the first end of the cantilever; and a sensing member connected to the second end of the cantilever. The distance between the first end and the fulcrum is less than that between the second end and the fulcrum. The microelectromechanical system has the advantages of high SNR, small package size and high sensitivity. The membrane has a stiffness order of magnitude higher than a conventional membrane, which avoids mechanical collapse and large DC deformation under 1 atm.

Abstract: An earpiece including an external surface having a first fixed configuration disposable within the outer ear and having a passage adapted for retention of an in ear device, the earpiece heatable to achieve a moldable condition which allows reconfiguration of the external surface by engagement with the outer ear to dispose the external surface in a second fixed configuration in greater conformity to the outer ear.

Abstract: Micromechanical sound transducer including a plurality of unilaterally suspended bending transducers. The plurality of bending transducers are configured for deflection within a plane of vibration and are arranged side by side within the plane of vibration along a first axis and are extending along a second axis which is transverse to the first axis. The bending transducers are alternately suspended on opposite sides and engage with one another. Each bending transducer includes a first electrode and a second electrode which are located opposite one another along the first axis to cause deflections of the respective bending transducer along the first axis upon application of voltage. Mutually facing electrodes of adjacent bending transducers are electrically connected to one another by a transverse connection crossing the plane of vibration transverse to the first axis.