Patents Examined by Amol Patel
  • Patent number: 10197190
    Abstract: A cable guard (20) for enclosing and protecting at least one cable (34) extending alongside a tube (28) comprising, a base (22), a ring (24), and a u-bolt (124), the base (22) has hinge receivers (72 and 74) to receive hinge pins (106 and 108) for rotatably and removably connecting base (22) and ring (24), and the ring (24) includes u-bolt receivers (70 and 71) for rotatably and removably connecting u-bolt (124) and ring (22), the ring (22) includes ring rotational stops (200 and 202) to prevent over rotation and uncontrollable detachment of the base (22) and ring (24); the base (22) includes u-bolt slots (116 and 118) and the ring (24) includes u-bolt leg receivers (144 and 146) for cooperating with the u-bolt slots (116 and 118) and receiving the u-bolt legs (140 and 142) in the base (24), whereby the cable guard (20) is assembled, at least one cable (34) is enclosed, the cable guard (20) is mounted, and the u-bolt (124) is tensioned by tightening the nuts (148 and 150) and as tension increases along with r
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: February 5, 2019
    Inventor: Scott E. Neff
  • Patent number: 10178757
    Abstract: A compartment EMI shield is provided that is suitable for use in system module packages having thin form factors and/or smaller widths and/or lengths. The compartment EMI shield comprises a fence arranged along a compartment boundary at least in between first and second sets of electrical components of the system module package and a substantially horizontal conductive structure that is coupled to the conductive fence. The fence being configured to attenuate EMI of a frequency of interest traveling in at least one of a first direction and a second direction, where the first direction is from the first set of electrical components toward the second set of electrical components and the second direction is from the second set of electrical components toward the first set of electrical components.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: January 8, 2019
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Ah Ron Lee, Deog Soon Choi, Young Ho Lee, Boon Keat Tan, Jin Ho Choi
  • Patent number: 10178761
    Abstract: A multiple-layer circuit board has a signaling layer, an exterior layer, and a ground layer. A pair of differential signal lines implemented as strip lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. An element conductively extends inwards from the exterior layer, and as an antenna radiates the EMI propagated by the strip lines along the signaling layer outwards from the circuit board. A defected ground structure within the ground layer has a size, shape, and a location in relation to the element to suppress the EMI propagated by the strip lines to minimize the EMI that the element radiates outwards as the antenna.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: January 8, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Karl J. Bois, Benjamin Toby
  • Patent number: 10177468
    Abstract: A heat-shrinkable protective element having at least one protective layer is obtained from a polymeric composition having a polymer material, where the polymeric composition additionally has an electrically conducting filler having a BET specific surface of at least 100 m2/g according to Standard ASTM D 6556.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: January 8, 2019
    Assignee: NEXANS
    Inventors: Arnaud Allais, Anthony Combessis, Lionel Flandin, Melek Maugin, Mathieu Badard
  • Patent number: 10170897
    Abstract: A protector-equipped wire harness includes: an electrical wire; a protector that includes a pair of side walls that protrude from a bottom, a slide supporting portion that is formed so as to extend in a first direction X, and a receiver that is provided on a bottom side of the slide supporting portion, and in which the electrical wire can be disposed in a groove that is defined by the bottom and the pair of side walls; and an attachment member that includes a band that can be wound around the electrical wire, and a band lock portion that includes a slidable portion that is supported by the slide supporting portion so as to be slidable in the first direction, the band lock portion keeping the band in a state of being wound around the electrical wire.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: January 1, 2019
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Yuki Nomura, Hiroaki Sakamoto
  • Patent number: 10158187
    Abstract: A conductor module attachment structure includes a case having a connection conductor, a recessed groove that is provided protrusively on an outer wall of the case, a protector that extends along the recessed groove and is formed into a U-shape and that is configured that an opening portion of a U-groove of the protector is closed by an inner wall face of the recessed groove when the protector is inserted into the recessed groove, a voltage detecting line that is routed in the U-groove of the protector, a voltage detecting terminal that is connected to one end of the voltage detecting line, a terminal retaining portion that is provided on the protector and positions the voltage detecting terminal contactably with the connection conductor.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: December 18, 2018
    Assignee: YAZAKI CORPORATION
    Inventor: Takahiro Chaen
  • Patent number: 10135177
    Abstract: A cable termination including a cable terminal and a cable joint assembly. The cable terminal includes: a terminal conductor; a monitoring device including a capacitive voltage sensor around the terminal conductor; and an electrically insulating body fitted around the terminal conductor, including a bell-shaped end portion in which the voltage sensor is at least partially embedded. The cable terminal alternatively includes: a terminal conductor; a monitoring device including a capacitive voltage sensor around the terminal conductor; and an electrically insulating body fitted around the terminal conductor, including a bell-shaped end portion in which the voltage sensor is at least partially embedded and a stem end portion, the terminal conductor extending beyond the stem end portion.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: November 20, 2018
    Assignee: PRYSMIAN S.p.A.
    Inventors: Gerardo Sica, Paolo Boffi, Dario Quaggia
  • Patent number: 10134686
    Abstract: A compartment EMI shield is provided that is suitable for use in system module packages having thin form factors and/or smaller widths and/or lengths. The compartment EMI shield comprises a fence arranged along a compartment boundary at least in between first and second sets of electrical components of the system module package. The fence being configured to attenuate EMI of a frequency of interest traveling in at least one of a first direction and a second direction, where the first direction is from the first set of electrical components toward the second set of electrical components and the second direction is from the second set of electrical components toward the first set of electrical components.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: November 20, 2018
    Assignee: Avago Technologies International Sales Pte. Limited
    Inventors: Ah Ron Lee, Deog Soon Choi, Young Ho Lee, Boon Keat Tan, Jin Ho Choi
  • Patent number: 10135159
    Abstract: A circuit card assembly includes a first printed wiring board with a first receiving feature and a trace attached to the first printed wiring board. The three dimensional trace is formed by layer-by-layer additive manufacturing. The three dimensional trace includes first and second ends. The first end of the three dimensional trace engages with the first receiving feature of the first printed wiring board. The second end of the three dimensional trace is configured to engage with a second printed wiring board.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: November 20, 2018
    Assignee: Rosemount Aerospace Inc.
    Inventor: Tim DeAngelo
  • Patent number: 10135355
    Abstract: Power inverter assemblies are provided herein for use with motor vehicles. An inverter assembly may have a symmetrical structure configured to convert DC input power to AC output power. The inverter assembly may include a housing enclosing a symmetrical DC input portion, a symmetrical AC output portion, a DC link capacitor, and a gate drive portion having a pair of power modules. The symmetrical DC input portion can include a DC input bus bar sub-assembly to which the DC link capacitor is coupled, and a second DC bus bar sub-assembly that may electrically couple the DC link capacitor with the power modules. The symmetrical AC output portion may include a three phase output AC bus bar sub-assembly to which the power modules can be electrically coupled. A cooling sub-assembly may be provided for cooling the power modules with fluid transfer using a coolant.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: November 20, 2018
    Assignee: FARADAY&FUTURE INC.
    Inventors: Young Mok Doo, Steven E. Schulz, Silva Hiti
  • Patent number: 10118712
    Abstract: The disclosure provides in one embodiment an electrical conductor pathway system for diverting an electric charge. The electrical conductor pathway system includes a substrate having a first surface to be printed on and having one or more grounding points. The electrical conductor pathway system further includes a direct write conductive material pattern printed directly onto the first surface via a direct write printing process. The direct write conductive material pattern forms one or more electrical pathways interconnected with the one or more grounding points. The one or more electrical pathways interconnected with the one or more grounding points divert the electric charge from the first surface to the one or more grounding points.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: November 6, 2018
    Assignee: The Boeing Company
    Inventors: Victoria L. Garcia, Mark J. Gardner, Otis F. Layton, Jeffrey Lynn Duce, Joseph A. Marshall, IV
  • Patent number: 10123409
    Abstract: A flexible printed circuit board, configured to receive electronic components, comprising an electrically insulating flexible element, configured to bear conductive component-connecting tracks, the flexible element being further configured to be bent according to a curvature, the board further comprising an electrically insulating reinforcing element, mechanically secured to the flexible element, extending on one side of the curvature, and comprising two parts: a first part being substantially planar and a second part exhibiting a predefined curvature, arranged on the side of the curvature of the flexible element, the reinforcing element being arranged so as to leave a free part for the flexible element to be bent according to the curvature.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: November 6, 2018
    Assignee: Valeo Vision
    Inventor: Olivier Badia
  • Patent number: 10117333
    Abstract: A multilayer ceramic capacitor includes a stacked body including a stack of a plurality of dielectric layers and a plurality of internal electrodes, and a pair of external electrodes. In the stacked body, a width dimension is greater than a thickness dimension, a length dimension preferably is about 0.4 mm or less, a width dimension preferably is about 0.15 mm or more and about 0.35 mm or less, a thickness dimension preferably is about 0.2 mm or less, and each of the internal electrodes is made of Cu or Ag as a main component and has a width dimension that is about 60% or more of the width dimension of the stacked body.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: October 30, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Eiji Teraoka
  • Patent number: 10102944
    Abstract: A multi-core cable for vehicles comprises two power lines, two signal lines, two electric wires, and a jacket. The two power lines are the same in size and material, each comprise an insulation layer composed of an inner layer and an outer layer, and are excellent in abrasion resistance and bending resistance. The two signal lines are the same in size and material and the two lines are twisted as a set to constitute a twisted pair of the signal lines. The two electric wires are the same in size and material and the two wires are twisted as a set to constitute a twisted pair of the electric wires. The two power lines, the twisted pair of the signal lines, and the twisted pair of the electric wires are integrally twisted.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: October 16, 2018
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takaya Kohori, Hiroyuki Okawa
  • Patent number: 10092241
    Abstract: Elongated conductors are provided. Aspects of the elongated conductors include: an elongated structure having a proximal region and a distal region, where the elongated conductor includes two or more insulated conducting members that are in fixed relative position along at least a portion of the elongated structure and extend from the proximal region to the distal region. A pattern of insulation openings among the insulated conducting members is present at one or both of the proximal and distal regions. Aspects of the invention further include methods of making the elongated conductors, as well as devices that include the elongated conductors.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: October 9, 2018
    Assignee: Autonomix Medical, Inc.
    Inventors: Landy Toth, Robert Schwartz
  • Patent number: 10076030
    Abstract: The present invention relates to a flexible hybrid substrate for a display and a method for manufacturing the same and, more specifically, to a flexible hybrid substrate for a display, which has a reduced occurrence of cracks, an improved level of flexibility, and can be used in a high-temperature process for manufacturing a display element, and a method for manufacturing the same. To this end, the present invention provides a flexible hybrid substrate for a display and a method for manufacturing the same, the flexible hybrid substrate for a display comprising: an ultra-thin plate glass; a first transparent thin film formed on one surface of the ultra-thin plate glass; and a second transparent thin film formed on the other surface of the ultra-thin plate glass, wherein the second transparent thin film includes a transparent conductive polymer.
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: September 11, 2018
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Jin Nyoung Heo, Tae Hyo Park, Dong Keun Shin, Jong Taek Kim, Sang Yoon Oh, Jin Sung Lim
  • Patent number: 10076023
    Abstract: A compartment EMI shield for use inside of a system module package is provided that comprises at least a first set of electrically-conductive wires that surrounds and extends over circuitry of the module package. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the compartment EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire that is located in between the first and second ends of the respective wire extends above the circuitry and is spaced apart from the components of the circuitry so as not to be in contact with the components of the circuitry.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: September 11, 2018
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Deog-Soon Choi, Chang-Yul Cheon, Sang-Hwa Jung, Sung-Phyo Lim, Aaron Lee
  • Patent number: 10069238
    Abstract: An electric cable includes at least one current line having first and second ends, including several wires, a first plug connector and at least one second plug connector arranged on the first and second ends, respectively. At least one plug connector includes a material having A) 98.0% to 99.8% by weight of a polymer selected from the group consisting of polyurethane (PU), styrene-butadiene block copolymers (SBS), perfluorocarbons and mixtures thereof, and B) 0.2% to 2.0% by weight additives. The total of components A and B results in 100% by weight. A first connection nut and at least one second connection nut are arranged on the first and second plug connectors, respectively. At least one light source is arranged in a first plug connector and/or in a second plug connector and is configured in order to be supplied with electrical energy by at least one wire of the current line.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: September 4, 2018
    Assignee: Balluff GmbH
    Inventors: Michael Mayer-Rosa, Thomas Bayer, Andreas Kammerer
  • Patent number: 10064271
    Abstract: The present disclosure discloses a PCB processing method and a PCB. The method includes: respectively carrying out laminating processing on a plurality of PCB daughter boards constituting a PCB, and drilling and electroplating the top-most PCB daughter board to form a via hole; and laminating the plurality of PCB daughter boards together to form the PCB, and drilling and electroplating the formed PCB to form a through hole for mounting a connector, wherein a blind hole for mounting a connector is formed by the via hole, and a depth of the blind hole is greater than or equal to the length of a signal pin of the connector. By virtue of the technical scheme of the present disclosure, a space between wafers of the lower layer of PCBs may be doubled, and the space for layout between wafers may be doubled.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: August 28, 2018
    Assignee: ZTE CORPORATION
    Inventors: Bi Yi, Fengchao Ma, Yonghui Ren, Wang Xiong, Yingxin Wang
  • Patent number: 10045436
    Abstract: A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: August 7, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Hyeon Cho, Hyo Seung Nam, Yong Sam Lee, Seok Hwan Ahn