Abstract: Systems and methods of providing a three-dimensional electronic module having high component density are disclosed. In some cases, the module has improved heat dissipation, reduced weight and size, and increased protection against electromagnetic radiation. In some cases, the module includes a printed circuit board configured to be folded into a convex polyhedron, with the polyhedron's faces formed by sections of the printed circuit board. In some cases, the electronic components face the interior of the circuit board and fall into gaps between the components installed on the other sections.

Abstract: A disconnect device includes: a conductor connectable to an external conductive path; a housing that has an internal space and accommodates at least a part of the conductor; and a cooling body that is disposed in the internal space and cools an arc generated in the internal space. The cooling body includes a porous body configured with at least one of a metal oxide and an inorganic oxide.

Abstract: A cooling plate includes an inlet port to receive two-phase fluid, a base plate to be attached to server electronics for cooling, a number of heat spreading structures disposed and spaced apart on the base plate to extend a heat exchange area from the base plate, and a number of fluid channels disposed on the base plate, where each of the fluid channels is situated between a pair of adjacent heat spreading structures. Each of the fluid channels include a channel inlet to receive at least a portion of the two-phase fluid from the inlet port, a channel outlet to allow the received portion of the two-phase fluid to flow through and exit the corresponding fluid channel, and one or more intermediate outlets disposed between the channel inlet and the channel outlet to allow at least a portion of the received two-phase fluid to exit in vapor or liquid form.

Abstract: A cable connection structure includes: cables, each including a jacket and a core wire exposed at an end portion by removing the jacket; a first fixing member configured to fix distal end portions of exposed core wires while holding the cables at predetermined intervals; a second fixing member configured to fix proximal end portions of the exposed core wires while holding the cables at predetermined intervals; and a substrate including a core wire connection electrode configured to electrically connect the core wire at a position between the first fixing member and the second fixing member, wherein the first fixing member and the second fixing member are different members.

Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a cutting-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.

Abstract: Provided is an electronic module including a housing case for housing a relay, a heat transfer sheet placed on an inner surface of a bottom plate of the housing case, a terminal provided on one surface of the relay opposing a bottom plate, and a crank portion in which a first flat plate portion electrically connected to the terminal and a second flat plate portion that is in contact with the heat transfer sheet are coupled in a crank shape.

Abstract: A cooling apparatus for a medium voltage or high voltage switchgear includes an evaporator, a fluid conduit, and a condenser. The evaporator is configured to surround at least part of a current carrying contact. The fluid conduit fluidly connects the evaporator to the condenser. A section of the fluid conduit is formed within the evaporator and is electrically insulating and is configured such that fluid can contact an outer surface of the current carrying contact. The cooling apparatus is configured such that in use a working fluid in the evaporator is heated to a vapour state, and the vapour is transferred by the fluid conduit to the condenser. The vapour in the condenser is condensed to the working fluid. The condensed working fluid is passively returned via the fluid conduit to the evaporator.

Abstract: An energy-moving device (EMD) transfers heat between a low-temperature-rated device (LTRD) and a high-temperature-rated device (HTRD), wherein the LTRD is thermally separated from the HTRD such that the LTRD is not stacked above the HTRD. A temperature-controlling device (TCD) actively transfers heat between the LTRD and the EMD. An air-moving device (AMD) generates an air stream for transferring heat from the EMD to ambient air. A controller receives temperature information about the ambient air, the LTRD, and the HTRD; determines when heat should be removed from the LTRD, when heat should be added to the LTRD, and when no heat needs to be transferred to or from the LTRD; and determines a first voltage for the TCD and a second voltage for the AMD based on the received temperature information. And a neural network updates the voltage values based on how effectively the voltage values have performed.

Abstract: An arc flash mitigation system includes a main circuit protector such as a high amperage overcurrent protection fuse, and an arc flash mitigation network connected in parallel to the main circuit protector. The arc flash mitigation network includes at least one semiconductor switch operable to provide a shunt current path to a low amperage arc mitigation fuse for a faster response time to certain circuit conditions than the main circuit protector otherwise provides. The semiconductor switch may be a silicon controller rectifier operatively responsive to a voltage drop across the main circuit protector in use.

Abstract: One general aspect includes a hybrid thermal management system for vehicle electronics. The hybrid thermal management system also includes a bottom piece being injection molded and may include of polymer, the bottom piece may include a plurality of coolant channels, an input port and an output port. The hybrid thermal management system also includes a thermal plate covering the bottom piece and the plurality of coolant channels and configured to dissipate thermal energy from a vehicle high performance computing (HPC) to a coolant within the plurality of coolant channels. The hybrid thermal management system also includes the input port configured to supply the coolant to the plurality of coolant channels. The hybrid thermal management system also includes the output port configured to collect coolant from the plurality of coolant channels and convey thermal energy away from the system.

Abstract: Provided is a gas-insulated switchgear having a circuit breaker tank with a reduced size. The gas-insulated switchgear includes: a connection conductor connected to two or more power cables, for each phase, inside the circuit breaker tank; a solid-insulated bus placed outside the circuit breaker tank and connected to the connection conductor via a connection bushing; and an instrument current transformer attached to the solid-insulated bus.

Abstract: An electronic assembly may include a chassis having electronic module mounting positions, each having a chassis cooling gas passageway and an electronic module received in each electronic module mounting position. A sealing retainer may be coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with the chassis cooling gas passageway and a module cooling gas passageway of a respective electronic module. The sealing retainer may include a retainer body, and a gas seal body coupled to the retainer body and movable between retracted and extended positions. The gas seal body in the retracted position permits insertion and removal of the electronic module, and in the extended position seals against the electronic module.

Abstract: A module according to the present disclosure includes a circuit board, an electronic component on one of two principal surfaces of the circuit board, a connection conductor on the principal surface of the circuit board, and sealing resin on the principal surface of the circuit board. The electronic component and the connection conductor are covered with the sealing resin. The connection conductor includes a plate-shaped conductor and terminal sections. The plate-shaped conductor is disposed upright on the principal surface of the circuit board. The terminal sections extend from the plate-shaped conductor and away from the principal surface of the circuit board and are arranged side by side. Tip portions of the terminal sections are exposed at a surface of the sealing resin.

Abstract: A vehicle power module assembly including first and second power modules is provided. The first power module may include a first lock feature extending from a lower portion of a first minor side at a first central axis. The second power module may include a second lock feature at an upper portion of a second minor side at a second central axis. The lock features may be sized for interlock with one another to secure the power modules to one another. The first lock feature may be a loop element defining a through-hole and the second lock feature may be a wedge. The through-hole may be sized for the wedge to extend therein and to interlock the first power module and the second power module to one another. The first lock feature may be a flexible hook element and the second lock feature may be a slot.

Abstract: A temperature-dependent switch comprising first and second stationary contacts and a temperature-dependent switching mechanism having a movable contact member. The switching mechanism, in its first switching position, presses the contact member against the first contact and thereby produces an electrically conductive connection and, in its second switching position, keeps the contact member spaced apart from the first contact and thereby disconnects the electrically conductive connection. The switch further comprises a closing lock that, as soon as it is activated, prevents the switch once having opened from closing again. The closing lock comprises a locking element having a shape-memory alloy and an opening through which the movable contact member protrudes. The locking element is configured to change its shape upon exceeding a locking element switching temperature and activate the closing lock, which holds the switching mechanism in its second switching position.

Abstract: A USB memory according to a present embodiment is the USB memory capable of data transfer by being connected with a receptacle, and includes a wiring board, a semiconductor chip, a connector, and an adhesive film. The wiring board includes wiring. The semiconductor chip is electrically connected with the wiring. The connector includes a first connection, a second connection, and a holder. The first connection is electrically connected with the semiconductor chip via the wiring. The second connection is electrically connected with the first connection and is connectable with the receptacle. The holder holds the first connection and the second connection. The adhesive film is provided at least between the wiring board and the holder.

Abstract: In some examples, a tool-less electronic component retention apparatus includes a bracket to affix to a circuit board, and a spring-loaded arm attached to the bracket. The spring-loaded arm has an engagement tab that is angled downwardly to engage an upper surface of an electronic component to mount the electronic component to the circuit board. The spring-loaded arm is pivotable between an engaged position and a release position by a user without use of a tool.

Abstract: A memory cooler includes a unitary thermal transfer device and a pair of endcaps. The unitary thermal transfer device includes heat transfer tubes, a first end block, a second end block, an inlet chamber, an outlet chamber, an inlet, and an outlet. The first and second end blocks are structurally integrated with each of the heat transfer tubes. The inlet and outlet chambers are partially defined by either the first end block or the second end block. Each of the inlet and outlet chambers are fluidly coupled with the respective liquid flow channel of the at least one heat transfer tube. The respective flow channels to which the inlet and outlet chambers are coupled may be the same or different to define either a direct or a serpentine flow path. Each endcap is affixed to a respective one of the first end block and the second end block to define, in conjunction with the first end block and second end block, the inlet chamber and the outlet chamber.

Abstract: Inverters for direct current (DC) to alternating current (AC) conversion may comprise switching elements which produce harmonic overtones. Inductive elements may be added into the inverters, such as to attenuate effects of harmonic overtones. Methods and systems for a casing suitable for reduced potting over its inductive elements is described. One or more heat dispersing elements may be disposed in the casing. Related systems and methods are also described.

Abstract: An electrical power distribution module for a vehicle. The electrical power distribution module provided with an upper module and a lower module. The upper module provided with circuit boards for various vehicle components and a temperature control system. The lower module provided with a plurality of isolated busbars, isolated from the surrounding structure. Each isolated busbar is one of a positive busbar, a negative busbar, and a ground busbar. The plurality of isolated busbars are arranged on opposite sides of the lower module and are arranged in an alternating fashion based on polarity. The plurality of isolated busbars are electrically connected to the circuit boards. The plurality of electrical connectors are spaced apart from each other and are configured to provide power and ground connections for the vehicle components. The plurality of isolated busbars are configured to carry different voltages.