Abstract: Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.
Abstract: Dispersion-based ready-to-use grout formulations, methods of making such dispersion-based ready-to-use grout formulations, and the resultant grout products that perform as reactive resin grout products. The grout formulations of the invention at least include a water-based acrylic polymer dispersion binder and a water-based acrylate copolymer dispersion binder, in combination with one or more of an alkaline cross-linker, one or more silane adhesion promoters and/or a micro-fiber filler, along with various other constituents, to provide one-part ready-to-use grout formulations that require no mixing prior to use thereof. The resultant grout products of the invention meet performance standards of epoxy grout products, without requiring mixing of composition parts and without any adverse side effects.
Abstract: A composition is described herein that includes a fluorosilicone, a silicon-based crosslinker, a reinforcement filler, a curing catalyst, a first non-reactive spacer filler, and a second filler comprising one or more silanol groups. Methods of using such a composition are also described.
Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline polypropylene and the like, an elastomer, and an inorganic filler.
Type:
Grant
Filed:
July 6, 2022
Date of Patent:
January 30, 2024
Assignees:
HYUNDAI MOTOR COMPANY, KIA CORPORATION, HDC HYUNDAI ENGINEERING PLASTICS CO., LTD.
Inventors:
Jin Young Yoon, Hee Joon Lee, Dong Eun Cha, Sun Jun Kwon, Chun Ho Park, Seung Ryong Jeong, Jin Bo Chae
Abstract: Disclosed is a rubber composition including a copolymer including polyethylene, ?-olefin, and non-conjugated polyene; natural rubber; a filler; and a coupling agent, a vehicle part including the same, and a vehicle including the same. The rubber bushing composition includes the components uniformly dispersed such that compatibility and physical properties thereof can be improved. Further, a product (e.g., vehicle part) obtained from the rubber bushing composition can have superior heat resistance, fatigue resistance, and compression set resistance.
Abstract: The claimed invention refers to the development of rubber recipes to improve essential properties related to correlated rubber compounds. Silica gel is added to the rubber compound as a reinforcing agent, partially replacing some of the precipitated silica. The use of silica gel for the pneumatic market provides improved tear resistance, elongation and adhesion performance, and improves adhesion of the tire on wet surfaces.
Type:
Grant
Filed:
February 7, 2022
Date of Patent:
October 3, 2023
Assignee:
PQ, LLC
Inventors:
Flavio Ernesto Ribeiro, Ronaldo dos Santos Flor