Abstract: An adhesive composition of at least one ethylene polymer or copolymer, wherein at least one first polymer or copolymer including the unsaturated carboxylic acid ester type comonomer is copolymerized in a continuous high-pressure tubular reactor, while a second polymer or copolymer including the functional comonomer is copolymerized by either autoclave or tubular continuous high-pressure radical means; the first and second polymer or copolymer possibly being of one and the same polymer/copolymer. Also, a multilayer structure that incorporates the adhesive composition and a particular process for obtaining this composition.

Abstract: A pressure-sensitive adhesive tape comprising or consisting of a radiation-activatable polymerizable composition comprising or consisting of: A 5 to 60 parts by weight of at least one film former component; B 40 to 95 parts by weight of at least one epoxy component; C 0.1 to 10 parts by weight of at least one photoinitiator, and D optionally 0.1 to 200 parts by weight of at least one additive, based in each case on the radiation-activatable polymerizable composition, where the parts by weight of components A and B add up to 100, wherein the film former component A comprises or consists of at least one polyurethane polymer and method of joining two components with the pressure-sensitive adhesive tape.

Abstract: The air and water barrier article includes a polymer-coated inelastic porous layer including a water-vapor permeable polymeric coating disposed on at least one major surface of the inelastic porous layer and an adhesive disposed on a major surface of the polymer-coated inelastic porous layer. The inelastic porous layer can include at least one of surface-modified fibers or natural cellulose fibers. The polymer-coated inelastic porous layer can at least one of a water strike through time of not more than 180 seconds or an absorbance capacity of at least one-half gram per 116 square centimeters. The adhesive may be exposed, in contact with a release surface, or adhered to a surface of a building component. A method of applying the air and water barrier article to a surface of a building component is also disclosed.

Abstract: The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.

Abstract: The an adhesive composition characterized in that the kisstack, which is defined as the force measured when a sheet coated with the adhesive composition is instantaneously peeled off after being attached, is about 6 N/inch or higher. The composition not only has excellent loop tack but also exhibits high kisstack characteristics, and thus can be widely used for various substrates.

Abstract: Described are adhesive compositions that contain adhesive polymer and carbon nanotubes; devices (e.g., electronic devices and electronic device enclosures) and compositions that include one of these adhesive compositions; and uses of such adhesive compositions as part of an electronic device.

Abstract: Systems and methods for the detection of one or more target molecules emitted from microbial sources are described. The systems and methods may include a molecularly imprinted polymer film; a strain sensitive surface, wherein the molecularly imprinted polymer film comprises a polymer host with one or more binding sites for one or more target molecules. The molecularly imprinted polymer film may be coated upon the strain sensitive surface.

Abstract: Provided are an adhesive composition and an organic electronic device (OED) including the same, and particularly, an adhesive composition, which may form a structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, realize a top-emission OED, and exhibit excellent adhesive durability and reliability, and an OED including the same.

Abstract: Hot melt adhesives comprising (i) styrene butadiene copolymer, (ii) olefin block copolymer (OBC), and (iii) water white hydrogenated hydrocarbon resin are described. The adhesives exhibit high optical clarity and are relatively clear over a wide range of temperatures. The adhesives also exhibit good adhesion at cold temperatures. Also described are laminates of the adhesive with polymeric films, such as adhesive labels that can be used in labeling containers. In addition, various goods such as containers labeled using the adhesives are described.

Abstract: Provided is a facial patch including a support, a pressure-sensitive adhesive layer, and a release layer in this order, in which (a) the pressure-sensitive adhesive layer satisfies the following conditions (a-1) to (a-3): (a-1) the pressure-sensitive adhesive layer contains a styrene-isoprene-styrene block copolymer, a tackifier resin, and a softening agent; (a-2) the ratio (mass ratio) of the styrene-isoprene-styrene block copolymer and the tackifier resin is 1:2 to 1:4; and (a-3) the content of the softening agent is 40% to 60% by mass; and (b) the support has elastic moduli with a Young's modulus of 0.01 GPa to 0.5 GPa, and also provided is a method for producing the facial patch, the method including a step of forming a pressure-sensitive adhesive layer on the upper surface of the release layer.

Abstract: A mask-integrated surface protective tape with a release liner, containing: a base film, a temporary-adhesive layer, a release film, a mask material layer, and a release liner, in this order, wherein the release film and the release liner each have one release-treated surface, and the release-treated surfaces of the release film and the release liner each are in contact with the mask material layer, and wherein the peeling strength between the release liner and the mask material layer is smaller than the peeling strength between the release film and the mask material layer.

Abstract: Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.

Abstract: The present invention provides an optically clear adhesive sheet that has excellent flexibility and prevents delay bubbles in high temperature and high humidity environments. The optically clear adhesive sheet of the present invention sequentially includes a first surface-adhesive layer, an intermediate adhesive layer, and a second surface-adhesive layer. The first surface-adhesive layer and the second surface-adhesive layer each have a higher storage elastic modulus at 85° C. than the intermediate adhesive layer. The first surface-adhesive layer and the second surface-adhesive layer each have a storage elastic modulus at 85° C. of 3.0×104 Pa or higher and 30.0×104 Pa or lower. The intermediate adhesive layer has a storage elastic modulus at 85° C. of 1.0×104 Pa or higher and 15.0×104 Pa or lower. The intermediate adhesive layer contains polyurethane.

Abstract: Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.

Abstract: Provided is a pressure-sensitive adhesive tape for protecting a semiconductor that can satisfactorily fill an uneven surface and is prevented from an adhesive residue. The pressure-sensitive adhesive tape for protecting a semiconductor includes: a base material; a pressure-sensitive adhesive layer arranged on at least one side of the base material; and an intermediate layer arranged between the base material and the pressure-sensitive adhesive layer, wherein a storage modulus of elasticity A (MPa) of the pressure-sensitive adhesive layer, a thickness B (?m) of the intermediate layer, a thickness C (?m) of the pressure-sensitive adhesive layer, and a tack value D (N) of the pressure-sensitive adhesive layer satisfy the formula A×(B/C)×D?20 (MPa·N).

Abstract: Provided are an adhesive resin laminate having an excellent adhesive force to two adherends, a laminate in which this adhesive resin laminate is laminated with two adherends, and a method of producing them. An adhesive resin laminate having at least a first adhesive layer and a second adhesive layer, in which the first adhesive layer includes a base resin and a crosslinking agent, the base resin is a modified polyolefin resin, the crosslinking agent is an epoxy-based compound, the second adhesive layer includes a polyolefin-based resin, and when an adhesion initiation temperature of the first adhesive layer is set to T1, and an adhesion initiation temperature of the second adhesive layer is set to T2, T2 is higher than T1 by 30° C. or more.

Abstract: Provided are an adhesive resin composition having high adhesiveness and high strength in acid resistance, and a laminate including the same. Provided is an adhesive resin composition including an acid-modified polyolefin resin component (A) having a weight average molecular weight of 30,000 or more and 150,000 or less, a resin component (B) having an epoxy group in a molecule, a resin component (C) having an amino group at a molecular end, and a solvent (S), in which a content of the resin component (B) is 1 part by mass or more and 30 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A), and a content of the resin component (C) is 0.5 parts by mass or more and 15 parts by mass or less based on 100 parts by mass of the acid-modified polyolefin resin component (A).

Abstract: A separator containing a substrate and a release layer formed on at least one side of the substrate wherein the separator shows a strain of not more than 7% when a load of 5N/20 mm is applied for one minute in the pulling direction, and when the substrate is cut in half in the thickness direction to divide the separator into two, an apparent elastic modulus in the pulling direction of one of the divided separators is larger than an apparent elastic modulus in the pulling direction of the other divided separator.

Abstract: Provided herein are stabilized underfill film-containing assemblies which extend the work-life of underfill films. In accordance with certain aspects of the present invention, there are also provided stabilized underfill film-containing assemblies which extend the shelf-life of underfill films. In certain aspects of the present invention, there are also provided methods for extending the work-life of underfill films. In another aspect of the present invention, there are also provided methods for extending the shelf-life of underfill films.

Abstract: A light shielding tape includes a first adhesive layer, a textile base layer disposed on the first adhesive layer, a resin base layer disposed on the textile base layer, and a first light shielding layer disposed on the resin base layer. The first light shielding layer includes black pigment.