Patents Examined by Ashley I. Pezzner
  • Patent number: 5124240
    Abstract: An optical recording medium consists essentially of a base material and a light-absorbing layer which contains a thermoplastic binder and at least one dye, wherein the thermoplastic binder is a polycyclic hydrocarbon which has a glass transition temperature Tg of greater than 150.degree. C. and is soluble to more than 3% by weight in an aliphatic or aromatic hydrocarbon.
    Type: Grant
    Filed: March 16, 1990
    Date of Patent: June 23, 1992
    Inventors: Sibylle Brosius, Bernhard Albert, Michael Schmitt, Klaus D. Schomann, Harald Kuppelmaier, Ulrich Harten
  • Patent number: 5098815
    Abstract: Apertures with inclined sidewalls are produced in a dielectric layer by exposing a photoformable dielectric layer through a mask having a section without a sharp line of demarcation between opaque and transparent areas.
    Type: Grant
    Filed: June 16, 1989
    Date of Patent: March 24, 1992
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Andrzej Adamczyk, William E. Delaney
  • Patent number: 5094936
    Abstract: A process for silylation of positive or negative photosensitive resist layer on a semiconductor wafer after the resist layer has been exposed to radiant energy through a mask which includes introducing a silylating agent to the wafer at high pressure over 760 torr and, usually, at temperatures less than 180.degree. C. Increased pressure increases the rate of silylation, allows practical use of lower process temperatures, and, therefore, allows better process control. Also an apparatus is disclosed for applying the high pressure silylation process to a wafer.
    Type: Grant
    Filed: June 26, 1990
    Date of Patent: March 10, 1992
    Assignee: Texas Instruments Incorporated
    Inventors: George R. Misium, Cesar M. Garza, Cecil J. Davis
  • Patent number: 5081002
    Abstract: The sensitivity of localized photochemical etching to the optical and electrical properties of multilayered semiconductor materials is utilized for selectively etching a laterally extending undercut in a buried layer. The semiconductor body is immersed in a suitable etching solution and a beam of light of appropriate wavelength and intensity is directed onto the semiconductor solution interface. The buried layer has a longer diffusion length for photogenerated carriers than the layers adjacent thereto, casuing carriers to diffuse away from the illuminated region within the buried layer and thereby etch the buried layer laterally, undercutting the adjacent layers.
    Type: Grant
    Filed: April 24, 1989
    Date of Patent: January 14, 1992
    Assignee: The Trustees of Columbia University in the City of New York
    Inventors: Mark N. Ruberto, Alan E. Willner, Richard M. Osgood, Jr., Dragan V. Podlesnik
  • Patent number: 5079135
    Abstract: An optical recording medium is disclosed, in which an optical recording layer and a reflective layer are formed on a transparent substrate. The recording layer contains a first compound having absorption or a recording laser light having a predetermined wavelength, and a second compound having substantially no absorption for a laser light having the predetermined wavelength and decomposable upon heat generation by the laser light in the optical recording layer.
    Type: Grant
    Filed: December 28, 1989
    Date of Patent: January 7, 1992
    Assignee: Sony Corporation
    Inventors: Nobuyuki Matsuzawa, Nobutoshi Asai, Shinichiro Tamura, Noriyuki Kishii, Seiichi Arakawa
  • Patent number: 5075200
    Abstract: A process of forming a superconductive wiring strip incorporates a deposition of a raw material on a mask layer followed by a lift-off stage for patterning the wiring strip, and the mask layer is formed for the miniature wiring strip by using lithographic techniques.
    Type: Grant
    Filed: August 24, 1989
    Date of Patent: December 24, 1991
    Assignee: Mitsubishi Metal Corporation
    Inventors: Tadashi Sugihara, Yoshio Murakami, Takuo Takeshita
  • Patent number: 5075203
    Abstract: A naphthalocyanine derivative having at least one substituent of the formula: SO.sub.2 R.sup.1, wherein R.sup.1 is an alkyl group, a substituted alkyl group or an aryl group is excellent in ability to absorb diode laser beams and suitable for use in an optical recording medium.
    Type: Grant
    Filed: August 22, 1989
    Date of Patent: December 24, 1991
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Mitsuo Katayose, Nobuyuki Hayashi, Seiji Tai, Takayuki Akimoto, Koichi Kamijima, Hideo Hagiwara
  • Patent number: 5064743
    Abstract: A thermal transfer recording medium having a support and provided thereon, plural heat softening layers is disclosed.
    Type: Grant
    Filed: May 15, 1989
    Date of Patent: November 12, 1991
    Assignee: Konica Corporation
    Inventors: Kunihiro Koshizuka, Toshiaki Tezuka, Takao Abe
  • Patent number: 5053323
    Abstract: Provided is an optical information medium containing an information layer comprised of a 1-phenyl substituted naphthalocyanine. Also provided is a method for easily synthesizing the naphthalocyanine chromophore used in the information layer. The use of such naphthalocyanine chromophores in the information layer of an optical information medium provides one with many advantages. In the manufacture of the medium, these advantages arise due to the increased solubility exhibited by the chromophore in conventional organic solvents. As well, the chromophores exhibit excellent and unique optical properties useful in the recording of optical information.
    Type: Grant
    Filed: February 27, 1990
    Date of Patent: October 1, 1991
    Inventors: James P. Shepherd, Palaiyur S. Kalyanaraman
  • Patent number: 5051339
    Abstract: A method for the immersion application of solder to printed wiring boards, including the steps of producing a printed wiring board with electrically conductive regions, which are to be provided with a solder deposit, surrounding the regions with a limiting layer of defined layer thickness for preventing an application of solder, which thickness substantially corresponds to the height of the solder deposit to be produced thus forming voids, immersing the thus-prepared printing wiring board into a soldering bath containing a suitable soldering alloy, covering the voids, filled in the soldering bath with liquid solder and located above the regions to which solder is to be appled, with at least one closure element at a defined contact pressure, removing the covered printed wiring board from the soldering bath, dropping the temperature of the solder trapped in the voids below the setting temperature of the solder alloy, removing the closure element, and optionally, removing the limiting layer.
    Type: Grant
    Filed: March 29, 1989
    Date of Patent: September 24, 1991
    Inventors: Dieter Friedrich, Gitta Friedrich
  • Patent number: 5049462
    Abstract: Information stored in a thin polymer layer is read out in a process wherein information introduced into a thin polymer layer on a metallic or semiconductor layer by electromagnetic or particle rays which produce a permanent change in the properties of the polymer layer in the irradiated areas is read out using surface plasmons.
    Type: Grant
    Filed: February 20, 1990
    Date of Patent: September 17, 1991
    Assignee: BASF Aktiengesellschaft
    Inventors: Dirk Funhoff, Harald Fuchs, Ulrike Licht, Wolfgang Schrepp, Werner Hickel, Wolfgang Knoll, Gerhard Wegner, Gisela Duda
  • Patent number: 5045440
    Abstract: Provided is a method for stabilizing an optical information medium by incorporating an effective amount of a specific nitrogen containing compound into the medium. The specific nitrogen containing compounds are poly(2-vinyl pyridine), poly(4-vinyl pyridine), pentaethylene hexamine and acridine orange base. Incorporation of one of the nitrogen compounds into the optical information medium prolongs the useful life of the medium.
    Type: Grant
    Filed: February 7, 1990
    Date of Patent: September 3, 1991
    Assignee: Hoechst Celanese Corp.
    Inventors: Frank J. Onorato, David E. Nikles, Rachel S. Kohn, Susan C. Castles, Harris A. Goldberg
  • Patent number: 5045419
    Abstract: According to a pattern exposure/transfer method disclosed in the present invention, an optical modulating mask whose optical contrast can be changed by electrical control is used and an optical pattern image of the optical modulating mask is exposed/transferred to an object to be exposed. The present invention also discloses a pattern exposure/transfer mask apparatus whose optical contrast can be changed by electrical control. According to the pattern exposure/transfer method of the present invention, an arbitrary pattern image can be easily formed by the optical modulating mask. The pattern exposure/transfer mask apparatus of the present invention is able to change optical contrast by electrical control, and allows easy formation of an arbitrary pattern image.
    Type: Grant
    Filed: December 26, 1989
    Date of Patent: September 3, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Katsuya Okumura
  • Patent number: 5041361
    Abstract: A method of providing and developing a resist on a substrate for constructing integrated circuit (IC) chips includes the following steps: of depositing a thin film of amorphous silicon or hydrogenated amorphous silicon on the substrate and exposing portions of the amorphous silicon to low-energy oxygen ion beams to oxidize the amorphous silicon at those selected portions. The nonoxidized portions are then removed by etching with RF-excited hydrogen plasma. Components of the IC chip can then be constructed through the removed portions of the resist. The entire process can be performed in an in-line vacuum production system having several vacuum chambers. Nitrogen or carbon ion beams can also be used.
    Type: Grant
    Filed: December 27, 1989
    Date of Patent: August 20, 1991
    Assignee: Midwest Research Institute
    Inventor: Y. Simon Tsuo
  • Patent number: 5041356
    Abstract: An optical recording material comprising (I) a substrate, (II) a recording layer provided on said substrate, the recording layer consisting of light transmissive portions and light screening portions, and (III) a reflective metallic thin film layer provided on the recording layer; as well as a process therefor. The invention also includes an optical card comprising the optical recording material provided on a card substrate. In the cases of the optical recording material and the optical card, it is possible to readily carry out high density recording, the alternation of written informaton is difficult, and the written information can be read out on a basis of the difference in light reflectivity.
    Type: Grant
    Filed: August 28, 1989
    Date of Patent: August 20, 1991
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Mitsuru Takeda, Wataru Kuramochi
  • Patent number: 5039598
    Abstract: Processes for preparing ionographic imaging member including providing a flexible, shrinkable tube containing a dielectric film forming polymer having a T.sub.g of at least about -40.degree. C., charge decay of less than about 2 nonocoulombs per cm.sup.2 per second and elastic memory, providing a cylindrical support member having an outer diameter that is less than the inner diameter of the flexible tube, applying a continuous coating on the interior of the tube or on the exterior of the cylindrical support member, the coating comprising a material selected from the group consisting of an electrically conductive material, an adhesive material and mixture thereof, shrinking the tube to bring the inner surface of the tube and the outer surface of the cylindrical support member into intimate physical contact with the continuous coating. This imaging member may be employed in an ionographic imaging process.
    Type: Grant
    Filed: December 29, 1989
    Date of Patent: August 13, 1991
    Assignee: Xerox Corporation
    Inventors: Dennis A. Abramsohn, John A. Frank, Joseph Mammino, Brendan C. Casey, Donald S. Sypula
  • Patent number: 5039600
    Abstract: A naphthalocyanine derivative having as substituents at least one group of a formula: SR.sup.1 wherein R.sup.1 is --(CR.sup.2 R.sup.3).sub.x SiR.sup.4 R.sup.5 R.sup.6, in which R.sup.2 to R.sup.6 are H, alkyl groups, etc. is excellent in solubility in saturated hydrocarbon solvents and in absorption of semiconductor laser lights and thus, is suitable for producing optical recording media.
    Type: Grant
    Filed: January 4, 1990
    Date of Patent: August 13, 1991
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Seiji Tai, Nobuyuki Hayashi, Koichi Kamijima, Takayuki Akimoto, Mitsuo Katayose, Hideo Hagiwara
  • Patent number: 5039593
    Abstract: Poly(silyl silanes) have been prepared. They have high photosensitivity and excellent resistance to oxygen-reactive ion etching processes. They are useful as photodepolymerizable photoresists, barrier layers, etc.
    Type: Grant
    Filed: March 31, 1989
    Date of Patent: August 13, 1991
    Inventor: John K. Zeigler
  • Patent number: 5039583
    Abstract: An erasable optical information storage apparatus is disclosed and the process for making such an apparatus is disclosed. The apparatus utilizes the photoabsorption and electrochemical absorption characteristics of the polyaniline class to polymers to provide an easily accessible and erasable information storage unit.
    Type: Grant
    Filed: February 2, 1989
    Date of Patent: August 13, 1991
    Assignee: Ohio State University Research Foundation
    Inventors: Arthur J. Epstein, John M. Ginder, Richard P. McCall
  • Patent number: 5037722
    Abstract: A photoresist exposure method in which a photoresist that is coated by electrodeposition on the surface of a printed circuit board having been subjected to through-hole plating and on the inner wall surfaces of through-holes therein is exposed to light through a film, comprises the first step of exposing the resist electro-deposited on the inner wall surfaces of the through-hole with a light source positioned adjacent to the board and rotated horizontally along the board surface, and the second step of exposing the resist on the board through a film for forming a precise pattern with a light source positioned remote from the board surface.
    Type: Grant
    Filed: December 6, 1989
    Date of Patent: August 6, 1991
    Assignee: ORC Manufacturing Co., Ltd.
    Inventor: Minoru Watanuki