Patents Examined by Bo Jin Jang
  • Patent number: 9905607
    Abstract: The present approach relates to the fabrication of radiation detectors. In certain embodiments, additive manufacture techniques, such as 3D metallic printing techniques are employed to fabricate one or more parts of a detector. In an example of one such printing embodiment, amorphous silicon may be initially disposed onto a substrate and a laser may be employed to melt some or all of the amorphous silicon so as to form crystalline silicon circuitry of a light imager panel. Such printing techniques may also be employed to fabricate other aspects of a radiation detector, such as a scintillator layer.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: February 27, 2018
    Assignee: GENERAL ELECTRIC COMPANY
    Inventor: James Zhengshe Liu