Abstract: When irradiating laser beam from the side face of the capillary array, an optical axis of the laser beam is inclined in vertical direction with respect to a plane face formed by the capillary array, thus, reflection light by the capillary array and returning light is prevented from entering into a laser beam source, thereby, instability of laser oscillation is eliminated.

Abstract: A solar power generation system having a solar cell provided therein and which is provided with a cooling mechanism, characterized in that the cooling mechanism has a cooling system for cooling the solar cell and a memory and operation for memorizing or operating an optimum cooling and driving state of the cooling system with respect to an output of the solar cell, wherein the cooling system is driven based on an output of the memory and operation system.

Abstract: Methods used in semiconductor electroplating systems, such as for plating copper, onto a semiconductor wafer or other semiconductor workpiece. The methods apply to patterned metal layers plated onto a seed layer which is partially protected by an overlying photoresist or other coating. The methods employ an electrode assembly which has a boot which seals about a contact face of the electrode. The sealing is performed by engaging the seal against photoresist to prevent corrosion of the seal layer. The area enclosed by the sealing includes a via which is surrounded by the seal. The electrode contact extends through the via to provide electrical contact with the metallic seed layer. Plating of copper or other metal proceeds at exposed seed layer areas.

Abstract: A device and method for pumping an electrolyte solution includes a conduit having a first end, a second end and a lumen for containing the electrolyte solution. An opening at each end of the conduit allows electrolyte solution to enter and exit the lumen of the conduit. The device further includes a ferroelectric member that is positioned along a portion of the conduit. The ferroelectric member is formed with a contact surface for interaction with the electrolyte solution. An electrode is positioned adjacent to the ferroelectric member to polarize the ferroelectric member and charge the contact surface. Driving electrodes are positioned to establish a potential difference in the electrolyte solution across the portion of the conduit containing the ferroelectric member.

Abstract: An apparatus which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate is provided. The apparatus has an anode which can be contacted by the electrolyte during deposition of the conductive material, a cathode assembly including a carrier adapted to carry the substrate for movement during deposition, and a conductive element permitting electrolyte flow therethrough. A mask lies over the conductive element and has openings permitting electrolyte flow. The openings define active regions of the conductive element by which a rate of conductive material deposition onto the surface can be varied. A power source can provide a potential between the anode and the cathode assembly so as to produce the deposition. A deposition process is also disclosed, and uniform electroetching of conductive material on the semiconductor substrate surface can additionally be performed.

Abstract: An elastomeric cell is used as the disposable part of an apparatus for isoelectric focusing in free solution (without gels) in the 0.5 to 5 ml volume range. An inlet port is used for priming the cell and end-connectors for coupling with electrodes. A grid of parallel rods compresses the cell against a cold plate, thereby causing swelling of the skin of the cell between pairs of rods and forming contiguous fluid bubble-compartments for IEF separation. Before collection of separated fractions, the gap between the rods and the plate is further reduced so as to create distinct fluid compartments which now contain discrete products of separation. The separated fractions are collected by syringe-like devices by puncturing the elastomer skin. The plate, rods and deformable cell are capable of rotation or gentle rocking motion around the cell's main axis to avoid gravitational convection during the focusing process.

Abstract: A method is disclosed for electrolytically forming conductor structures from highly pure copper on surfaces of semiconductor substrates, which surfaces are provided with recesses, when producing integrated circuits. The method includes the steps of coating the surfaces of the semiconductor substrates with a full-surface basic metal layer in order to achieve sufficient conductance for the electrolytic depositions, depositing full-surface deposition of copper layers of uniform layer thickness on the basic metal layer by an electrolytic metal deposition method, and structuring the copper layer.

Abstract: A method for creating a mandrel for electroforming orifice sheets with tapered bores is described. The method uses photo-imagable polymer or photoresist to create the desired profile. This is followed by electroforming a parent mandrel over which a mandrel-quality sheet of glass is melted. An array of pillars with defined location and shape is formed with a desired profile for the mandrel to be used for the electroforming process. The glass is then metalized. A photoresist mask is formed on the metalized glass and a dielectric is deposited onto the pillars.

Abstract: An extruder includes a barrel having a die attached to one end and at least one material inlet with a feeder for providing material to the material inlet. At least one screw is rotatively mounted in the barrel, and a motor is provided for driving the screw. A plurality of sensors is mounted in the barrel for sensing passage of screw thread edges as the screw rotates. A controller for controlling operation of the extruder receives signals from the sensors and determines local torsional deformations of the screw based on the signals. The controller slows down the extruder if any one of the local torsional deformations falls outside of an optimal range.

Abstract: The capillary electrophoresis system includes a wafer-shaped part having passages filled with a buffer solution for introducing sample solutions; a body having a configuration suitable to removably hold and to move the wafer-shaped part. The body includes first and second electrodes for applying a voltage across both ends of passages of the wafer-shaped part to separate and remove the sample solution. The body also includes first and second buffer reservoirs conductive to passages of the wafer-shaped part at specific positions for filling buffer solution around the first and second electrodes. The system according to the present invention facilitates washing of electrophoresis passages and reduces the time and labor costs required for replacement of the fused-silica wafers and simplifies operation by allowing a plurality of sample solutions to be analyzed more quickly.

Abstract: This invention is a photovoltaic device comprising an intrinsic or i-layer of amorphous silicon and where the photovoltaic device is more efficient at converting light energy to electric energy at high operating temperatures than at low operating temperatures. The photovoltaic devices of this invention are suitable for use in high temperature operating environments.

Abstract: Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system carried by the support member. The support member, for example, can be a ring or another structure that has an opening configured to receive the workpiece. In one embodiment, the support member is a conductive ring. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member. The contact members can comprise electrically conductive biasing elements that have contact sites and the contact members can also have a dielectric coating covering at least a portion of the biasing elements. The contact system can also have a shield carried by the support member and a seal on the lip of the shield.

Abstract: Although there are several inventions disclosed herein, the present application is directed to a reactor for electrochemically processing a microelectronic workpiece. The reactor comprises a movable electrode assembly that is disposed for movement along a motion path. The motion path includes at least a portion thereof over which the electrode assembly is positioned for processing at least one surface of the microelectronic workpiece. A cleaning electrode is located along the motion path of the movable electrode assembly. In one embodiment, a programmable controller is connected to direct the movable electrode assembly to move to the cleaning electrode during a cleaning cycle. At that time, the programmable controller connects the movable electrode assembly as an anode and the cleaning electrode as a cathode for cleaning of the movable electrode assembly.

Abstract: The present invention improves the performance of microchannel systems for chemical and biological synthesis and analysis by providing a method and apparatus for producing a thin band of a species sample. Thin sample bands improve the resolution of microchannel separation processes, as well as many other processes requiring precise control of sample size and volume. The new method comprises a series of steps in which a species sample is manipulated by controlled transport through a junction formed at the intersection of four or more channels. A sample is first inserted into the end of one of these channels in the vicinity of the junction. Next, this sample is thinned by transport across the junction one or more times. During these thinning steps, flow enters the junction through one of the channels and exists through those remaining, providing a divergent flow field that progressively stretches and thins the band with each traverse of the junction.

Abstract: A method of processing a wafer includes placing a wafer atop a wafer chuck, wherein the chuck has a base and an upper body in which the upper body is coupled to the base by a flexible coupling that allows the upper body to tilt relative to the base. The wafer is engaged to a hollow sleeve and forms a floor creating an enclosed vessel to retain a processing fluid. Once the vessel is filled, the wafer is then processed utilizing the processing fluid. Further, the wafer tilts allowing for a compliant engagement of the wafer and the sleeve to prevent or reduce leakage of the processing fluid.

Abstract: A solar cell module includes a connecting member to be passed through a coating of a cable for electrically connecting a plurality of solar cell modules and to be electrically connected to a core wire of the cable. The solar cell module is connected to the cable by pressing the connecting member of the solar cell module to pass through the coating of the cable and come into contact with the core wire of the cable. An electrical connection of the solar cell module with a ground wire is made by a similar technique.

Abstract: The present invention provides a method of plating an electrical contact on an integrated circuit (IC) substrate manufactured from a rigid double-sided or multi-layered printed wiring board core with dielectric layers on both sides of the core. The method may include forming electrically connected plating layers on first and second opposing sides of a substrate and electroplating a contact layer over each of the plating layers using the plating layers. The method further includes removing a portion of the plating layers from the first and second opposing sides while leaving the plating layers under the contact layer.

Abstract: A differential response light-receiving device comprising: a semiconductor electrode comprising an electrically conductive layer and a photosensitive layer containing a semiconductor sensitized by a dye; an ion-conductive electrolyte layer; and a counter electrode, the differential response light-receiving device making time-differential response to quantity of light to output a photoelectric current. A composite light-receiving device comprising the differential response light-receiving device and a stationary response light-receiving device, and an image sensor using the differential response light-receiving device or the composite light-receiving device are also provided.

Abstract: Bonding pad(s) formed on a printed circuit board with circuit patterns. The bonding pad(s) include a plurality of copper patterns formed on the PCB and electrically connected to the circuit patterns, a filler filled between the copper patterns such that an upper surface of the copper pattern is exposed, and a plating layer applied at an upper surface of the copper patterns. An interval between wire bonding pad(s) is reduced by preventing a nickel plating layer and a gold plating layer from protruding at a lower portion of a copper pattern when they are formed on the copper patterns.

Abstract: A wafer plating apparatus includes a wafer clamp for holding a wafer, a wafer support member for supporting the peripheral edge of the surface to be plated, and a plating tank which circulates a plating solution while making the plating solution overflow from an upper opening of the tank. The wafer plating apparatus is arranged to perform plating, while the surface to be plated is laid face down, being in contact with the surface of the plating solution, in a state in which the wafer is clamped by the wafer clamp and the wafer support member. The wafer support member is equipped with air-vent grooves for discharging the air which remains on the peripheral edge of the surface to be plated while the surface of the plating solution and the wafer make contact. The air-vent grooves are formed at the lower end of the wafer support portion.