Abstract: In a continuous thermic cutting operation, assist gas is supplied to a thermic cutter in the form of pulses at a predetermined frequency. The pulse effect can be achieved by means of a solenoid valve, mechanical rotary valve, cam driven valve or a self propelled valve.

Abstract: Apparatus for the cutting of garment patterns from one or more layers of fabric. A laser capable of producing laser light at an ultraviolet wavelength is utilized to shine light through a pattern, such as a holographic phase filter, and through a lens onto the one or more layers of fabric. The ultraviolet laser light causes rapid photochemical decomposition of the one or more layers of fabric, but only along the pattern. The balance of the fabric of the one or more layers of fabric is undamaged.

Abstract: In a method of controlling the air permeability of the hole portion of chip paper in which holes are formed by a laser, the flow rate of permeating air from an air permeable portion of a dummy prepared in advance and the flow rate of permeating air from the hole portion are respectively converted to pressures. An output from the laser is controlled such that the pressure difference between the two pressures becomes zero. Then, an influence caused by variations in suction pressure can be prevented. Accordingly, the air permeability can be detected without being influenced by variations in suction pressure.

Abstract: A laser beam is irradiated and scanned on a substrate of a liquid crystal display device of an active matrix type. Pairs of electrons and holes caused by the known internal photoelectric effect are produced by irradiation of the laser beam to electrical conductive thin films including silicon layered on the substrate, and pass through a defective part of short circuit in an intersection of the plural electrical conductive thin films, and thereby a current flowing through the intersection increases and a position of the defect determined on the basis of the scanning position of the laser beam and the increase of the current.

Abstract: A method of producing a multi-apertured component for providing a predetermined fluid flow includes the steps of dividing the component into regions in which the apertures are to be formed, forming a portion of the apertures in a first region in accordance with assumed parameters, measuring the fluid flow through the apertures and correcting, if necessary, the assumed parameters for the apertures in the first region to provide the fluid flow required through the first region and the assumed parameters for each of the other regions, and completing drilling of the apertures in the first region and in each of the other regions.

Abstract: A method of cutting by means of laser radiation wherein, particularly in order to increase the cutting efficiency in connection with composite materials, the laser radiation focused along a line extending transversely to the direction of radiation.

Abstract: The apparatus for machining and material processing includes an excimer laser and a Fresnel zone plate array (FZP) positioned parallel to the workpiece, with the distance between the FZP and the workpiece being the focal length of the FZP. For each hole to be formed on the workpiece a corresponding Fresnel zone is patterned onto the FZP. Each Fresnel zone may be patterned directly centered over the desired hole location or in high density patterns it may be located off-center from the hole with deflection being accomplished by the formation of finer circular arcs on the side of the Fresnel zone opposite the desired direction of deflection. A beam scanner is included to provide a more uniform illumination of the FZP by the laser beam. The scanning eliminates non-uniformity of intensity. The alignment mechanism uses a helium-neon laser, the beam from which is projected onto a surface relief grating on the workpiece.

Abstract: The current invention provides an apparatus and method of collecting waste materials produced during laser etching of a floptical medium without blocking access to the medium surface. The invention also improves collection efficiency by applying a uniform low-pressure air around the outer edge of the medium. Because the air pressure is applied around the edge, there is no necessity to coordinate a movement or timing of the current invention with respect to the laser etching unit.

Abstract: A monitoring system monitors a laser process which delivers energy from a laser source (10) to a workpiece (18) along a process path while producing plasma at a beam delivery point (22) along the path. A light detector (26) is positioned for receiving light emitted from the plasma. The detector (26) provides a light signal having a value which varies with changes in the intensity of the received light over a predetermined test interval. A plurality of light limits (1-6) are established with each limit having a different value. The light signal is compared with each light limit and a violation indication is provided each time the light signal violates one of the limits. The number of violation indications for each limit are counted over the predetermined test interval. The laser process is evaluated as a function of the number of violation indications during the test interval. An output indication is provided as to the result of the evaluation.

Abstract: An optics and environmental protection device for laser processing applications in which a laser processing assembly including a laser beam source is used to process a substrate. The laser processing assembly includes an optical focusing assembly including at least one lens located between the laser source and the substrate for focusing the laser beam on the substrate. The optics and environmental protection device includes a housing defining a chamber located between the optical focusing assembly and the substrate. The housing includes a first opening located adjacent to the optical focusing assembly for admitting the laser beam into the chamber, a second opening located adjacent to the substrate which allows the beam to exit the chamber, a third opening adjacent to which a source of pressurized gas is located, and a fourth opening adjacent to which a vacuum source is located.

Abstract: Laser machining system including a laser machine, a stack yard for storing pallets, a stacker crane for transferring pallets. Standard pallets and multi-pallets are stored in the stack yard. The standard pallet has a pallet base and plates are piled on the pallet base directly. The multi-pallet comprises a pallet base and pallet components stacked on the pallet base. Each pallet has pallet components which each store a single plate. A transfer device is provided for loading a blank plate (pre-worked plate) to the laser machine and unloading a post-worked plate from the laser machine. Returning devices are provided for returning post-worked plates to the stack yard.

Abstract: The wall of a pressure vessel tube having stress-corrosion cracks or the like is repaired by localized melting using laser welding, for fusing over defects by melting and re-solidifying the metal. A high powered laser beam is focused at a limited area or spot on the internal wall of the tube. The welding head is operated at sufficient power and is relatively moved in the tube at a sufficient rate to melt the spot while advancing along a line on the internal surface of the wall. The wall is melted to a depth of part or all of the thickness of the wall. Points at which the tube has been melted by the focused beam cool following passage of the welding head. The welding head is also advanced laterally of the line, either continuously or stepwise. Localized melting and cooling of the tube material continues progressively, line by overlapping and/or adjacent line, to melt and reform the degraded area.

Abstract: Improved methods of modifying target surfaces through ablation are disclosed resulting in a reduction of debris redeposition on the target surface.

Abstract: The subject is an apparatus for consecutively marking a plurality of packaged semiconductor devices such as ICs by using a laser beam marker. A plurality of packaged semiconductor devices are put into a tubular holder so as to form a single file. The tubular holder is generally rectangular in cross-sectional shape and has a lengthwise opening in the upside wall. The tubular holder is placed on a conveyor belt and secured to the conveyor belt by guide belts each of which makes tight contact with the upside wall or one of the side walls of the tubular holder and advances in the same direction as the conveyor belt. On the conveyor belt the tubular holder passes a marking station where a laser beam is projected on the semiconductor devices in the holder one after another. The apparatus includes a computarized controller to automatically control the positions of the conveyor belt and the guide belts according to the width and height of the tubular holder.

Abstract: A laser working device for working a workpiece moving in one direction has a converging lens for focusing and directing approximately vertically a laser beam onto the workpiece, a gas injector for injecting and directing an inert gas forwardly with respect to the one direction and toward where the laser beam is focused, and an air injector for forming a pressurized air curtain between the converging lens and workpiece so that the air curtain crosses the vertical laser beam.

Abstract: This invention relates to an insulating material for a wiring substrate and to a method of producing a multi-layered wiring substrate, and is directed to put into practical application a multi-layered wiring substrate suitable for processing high speed signals. The production method of the multi-layered wiring substrate of this invention uses an insulating material prepared by allowing voids of a porous perfluorocarbon polymer film to be impregnated with a thermosetting resin containing a benzocyclobutene ring, and thermally setting the resin, and comprises laminating alternately a wiring layer and an insulating layer made of the insulating material for the wiring substrate on a rigid support substrate.

Abstract: The invention relates to a method of cutting an aperture in a device (1) by means of a laser beam (9), said device comprising a wall (2) having first (5) and second (6) opposing surfaces, and a third surface (7) separated from said wall (2) along the path (11) of said laser beam (9), said method comprising the steps of:(a) causing said laser beam (9) to be incident upon said first surface (10) so as to cut through said wall (2) and form said aperture, and(b) introducing fluid between said second (6) and third (7) surfaces in the path (11) of said laser beam (9) so as to thereby prevent damage to said third surface (7) when said laser beam has cut through said wall.The invention may be used to cut aperture in devices such as injector nozzles syringe needles, medical stents and fluid/air control valves.

Abstract: A laser beam machine for carrying out a machining operation by converging a laser beam emitted from a laser resonator and irradiating the converged laser beam onto a workpiece. A beam interceptor (21) is arranged across a light path extending from a total reflection mirror (2) of the laser resonator (1) to a surface of the workpiece (5) and has a small inertia, and the position thereof is controlled at a high speed to permit the passage of the laser beam and to intercept the laser beam. The beam interceptor (21) is controlled in such a manner that the laser beam is allowed to pass during a full-scale discharge and is intercepted during a seed discharge. Accordingly, even if a seed discharge exists while a high-reflectivity material, for example, is machined, a laser oscillation of a composite resonator including the workpiece (5) can be reliably prevented.

Abstract: The present invention is to provide a method for laser welding different kinds of metals by which at least two types of metal members having mutually different laser reflection factor, are put one upon another and welded when the metal members are irradiated with lasers emitted in the superposed direction, comprising a process to put the first metal member on the second metal member, wherein the first metal member has a first laser reflection factor and the second metal member has a second laser reflection factor which is lower than that of the aforementioned first laser reflection factor, and the first and the second metal member are put one upon another through a metal layer and when irradiated with lasers, the aforementioned metal layer is more difficult to melt than the aforementioned second metal member. The method of the present invention further comprises a process in which lasers are irradiated from the aforementioned first metal member side.

Abstract: A laser beam is directed toward a rotating metallic tube having a fin helically wound about and welded to its surface by a high frequency welding process. The laser beam generates heat in the tube to supplement the heat induced by resistance to electrical current flow to create a proper temperature in the tube for forge welding of the fin and tube.