Patents Examined by Carl W. Whiteheat, Jr.
  • Patent number: 5652465
    Abstract: A semiconductor device comprises a plurality of wiring formed on a lower insulating film to be spaced apart from each other, dummy patterns formed on the lower insulating layer between the plurality of wiring and spaced apart from each other, and an upper insulating layer formed to cover the plurality of wiring and the dummy patterns and having cavities formed in regions between the plurality of wiring and the dummy patterns.
    Type: Grant
    Filed: October 18, 1995
    Date of Patent: July 29, 1997
    Assignee: Fujitsu Limited
    Inventors: Yukio Hosoda, Masaaki Ichikawa