Patents Examined by Carlos Gamino
  • Patent number: 8181846
    Abstract: A method and apparatus are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: May 22, 2012
    Assignee: International Business Machines Corporation
    Inventors: Russell A. Budd, John P. Karidis, Mark D. Schultz
  • Patent number: 8177114
    Abstract: In the formation of sheet material from molten glass, molten glass is formed in a melting furnace and transported through a precious metal delivery system to the forming apparatus. Disclosed herein is a method to mitigate carbon contamination of individual components of the precious metal delivery system prior to and/or during their use. The method involves coating portions of the precious metal with an oxygen generating material prior to assembly of the component, and may comprise one or more heat treating steps of the component in an oxygen-containing atmosphere.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: May 15, 2012
    Assignee: Corning Incorporated
    Inventors: William G. Dorfeld, Susan L. Schiefelbein
  • Patent number: 8162201
    Abstract: The present invention consists in a system and a method for installation of duct lines and/or pipelines comprising a pipe shop, supporting, rolling and guiding elements previously provided along a path of duct line/pipeline designed to be formed, the quantity of elements varying according to the length and the characteristics of the path, the said pipe shop comprising within the same a facility for welding, inspection and finishing of the pipes for forming the duct line/pipeline, the elements comprising a supporting base and a roller.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: April 24, 2012
    Inventor: Paulo Roberto Gomes Fernandes
  • Patent number: 8132707
    Abstract: The present invention provides a flow soldering apparatus that can suppress the occurrence of soldering defects, even if VOC-free flux or low-VOC flux is applied to an electronic circuit substrate. In other words, the flow soldering apparatus according to the present invention includes: a water content sensor for measuring a residual water content of a surface of a substrate; and a monitoring device for judging whether soldering quality is satisfactory or not by using a residual water content value of the surface of the substrate acquired from the residual water content measured by the water content sensor, on the basis of a correlation between a residual water content value of a surface of a sample substrate and a residual water content value of through holes of the sample substrate, as acquired previously by using a plurality of substrate samples.
    Type: Grant
    Filed: April 10, 2009
    Date of Patent: March 13, 2012
    Assignee: Panasonic Corporation
    Inventors: Kimiaki Nakaya, Kenichiro Suetsugu, Arata Kishi
  • Patent number: 8118211
    Abstract: A method for the low-temperature pressure sintering of at least one electronic unit to be contacted thermally, firmly connected mechanically, and located on a substrate, comprising the following steps: pressing the electronic unit using a mold enveloping matrix while sparing a connecting surface of the substrate for a heat sink connection, providing a heat sink plate, applying a sintering connecting layer onto the spared region of the connecting surface and/or onto to the region of the heat sink plate provided for contacting, and bonding of the heat sink plate to the substrate of the electronic unit in the region of the connecting surface using silver low-temperature pressure sintering technology.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: February 21, 2012
    Assignee: Danfoss Silicon Power GmbH
    Inventors: Ronald Eisele, Mathias Kock
  • Patent number: 8109431
    Abstract: A method of joining a first article to a second article using adjustment features located in an assigned scrap portion of the first article. The first article can be a casing for a turbine engine the first article being the casing skin and the second article a flange. The adjustment features are springs that can be stretched to increase the circumference of the skin. Following the correct sizing of the skin and joining to the flange the attachment features are removed along with the assigned scrap portion of the skin.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: February 7, 2012
    Assignee: Rolls-Royce PLC
    Inventors: Ian M. Garry, Michael N. Wybrow
  • Patent number: 8104665
    Abstract: A composite substrate manufacturing method including the steps of grinding a sapphire substrate to uniform the thickness of the sapphire substrate, next forming an optical device layer on the front side of the sapphire substrate, next bonding the front side of a heat sink substrate through a bonding metal layer to the front side of the optical device layer formed on the front side of the sapphire substrate to thereby form a composite substrate, next grinding the back side of the heat sink substrate of the composite substrate to uniform the thickness of the composite substrate, and finally grinding the back side of the sapphire substrate of the composite substrate to reduce the thickness of the sapphire substrate to a predetermined thickness.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: January 31, 2012
    Assignee: Disco Corporation
    Inventor: Kazuma Sekiya
  • Patent number: 8104661
    Abstract: A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.
    Type: Grant
    Filed: March 22, 2006
    Date of Patent: January 31, 2012
    Assignee: Tamura Corporation
    Inventors: Junichi Onozaki, Masahiko Furuno, Hiroshi Saito, Isao Sakamoto, Masaru Shirai
  • Patent number: 8087564
    Abstract: A method of forming a metallic container by placing body and lid portions together, keeping parts of the body and lid portions in contact with one another, and vibrating the lid with respect to the body, thereby generating frictional heat to form a friction metallic weld therebetween. Apparatus for attaching the lid and body portions of the metallic container includes a body supporting base, an assembly to support a flange of the body, a sonotrode to contact a flange of the lid so that wherein the flanges of the lid and body are held together between the support assembly and the sonotrode. A motor vibrates the sonotrode relative to the support assembly to thereby move the flanges relative to one another generating sufficient frictional heat to create a friction metallic weld therebetween.
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: January 3, 2012
    Assignee: New Sonic Technologies, LLC
    Inventor: James T. Williamson
  • Patent number: 8084710
    Abstract: A laser, aimed at a flyer plate tab, causes optical energy to be directed at the tab, specifically, at a top surface thereof. Energy impacting the tab accelerates the tab out of an initial bent position, straightening it into an impact with a target sheet. The impact occurs in excess of 100 m/s, resulting in a metallurgical bond between the tab and the target sheet. The laser preferably strikes the top surface in a normal direction, based upon an initial angularity of the tab relative to the target. The laser emission, preferably in the range of 1 to 100 Joules delivered in a microsecond, may be augmented by an ablative layer on the top surface or a transparent covering on the top surface that reacts against the expanding gas from ablative activity on the top surface. The weld is formed without physical contact between the welding device and the tab.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: December 27, 2011
    Assignee: The Ohio State University
    Inventors: Glenn S. Daehn, John C. Lippold
  • Patent number: 8079506
    Abstract: A stud welding apparatus comprises a feeder to receive a plurality of studs and feed the stud one by one with the stud being fed in advance of a weld portion thereof from an outlet of the feeder; and a welding gun to receive the stud as fed from the feeder through a feeding pipe to hold the stud and to weld the stud to a workpiece. The outlet of the feeder is provided with a shuttle loader wherein a hollow shuttle is loaded to a rod body of the stud to extend the length of a short stud, so that the shuttle loaded stud is lengthened as a whole to prevent the shuttle loaded stud from tumbling in the feeding pipe and/or a stud path in the welding gun.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: December 20, 2011
    Assignee: Newfrey LLC
    Inventors: Kazushige Sano, Daisuke Miura
  • Patent number: 8074866
    Abstract: A system and method for repairing turbine vane attachment systems in a turbine engine. In at least one embodiment, the invention may be directed to a system and method for repairing wear on a diaphragm hook fit configured to attach diaphragm airfoils, such as stationary turbine vanes, to a combustion turbine case. The restoration system may be formed from a carriage assembly having an assortment of material processing implements usable to build up material in the worn locations of the turbine vane attachment system to reestablish a diaphragm hook fit within the specified tolerances. The restoration system may be configured so that the restoration process may occur without removing a rotor assembly, which can reduce the repair time by about two weeks. Thus, use of the restoration system can result in a significant time and cost savings.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: December 13, 2011
    Assignee: Siemens Energy, Inc.
    Inventor: Derek Bird
  • Patent number: 8061581
    Abstract: The invention relates to a method of connecting of strips to an endless strip with a clamping arrangement (110, 120) with a clamping device (110-r, 120-r) on the inlet side and a clamping device (110-1, 120-1) on the outlet side, a cutting arrangement (155) with an upper cutter (150) and a lower cutter (130) and with a joining arrangement, wherein in a first step the clamping devices are opened and two strip ends are introduced, and in a subsequent step in the next step the strip ends are introduced, and in a subsequent step in the next step the strip ends are cut by means of the cutting arrangement, before they are moved into a joining position and are joined there.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: November 22, 2011
    Assignee: SMS Siemag AG
    Inventors: Holger Behrens, Robert Berg, Lutz Kuemmel, Manuel Bendler, Ralf-Hartmut Sohl, Peter De Kock, Michael Tomzig
  • Patent number: 8056795
    Abstract: A fluxometer system and method is provided. The fluxometer comprises a frame, a simulated circuit board disposed in the frame and having a plurality of holes formed therein extending generally transverse to a plane of the board and a cover. The cover is received on the frame over the simulated circuit board and includes several protrusions simulating leads that extend into the holes of the simulated circuit board. The fluxometer further includes an indicator sheet disposed between the simulated circuit board and the cover, the protrusions extending through the indicator sheet.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: November 15, 2011
    Assignee: Rockwell Automation Technologies, Inc.
    Inventor: Corey A. Peterson
  • Patent number: 8056792
    Abstract: An ergonomic horn for use in an ultrasonic welder having a base structure defining a first longitudinal axis, where the base structuring is connectable to the ultrasonic welder, and a tip mounting head defining a second longitudinal axis. The second longitudinal axis is angled relative to the first longitudinal axis to permit an ergonomic positioning of the item to be welded. The tip mounting head is operable to support a removable ultrasonic welding tip member. The ergonomic horn further having a reduced thickness neck portion interconnecting the base structure and the tip mounting head, such that the base structure, tip mounting head, and reduced thickness neck portion together transmit ultrasonic energy in the range of approximately 10 kHz to approximately 60 kHz for ultrasonic welding.
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: November 15, 2011
    Assignee: Branson Ultrasonics Corporation
    Inventors: Guillermo Coto, Richard R. Hansen
  • Patent number: 8052027
    Abstract: An apparatus for attaching the lid and body portions of a metallic container includes a base to support the body, a support assembly to support a flange of the body, and a sonotrode for contacting a flange of the lid, wherein the flanges of the lid and body are held together between the support assembly and the sonotrode. A motor reciprocally rotates the sonotrode relative to the support assembly, thereby moving the flanges relative one another to generate frictional heat and create a friction weld therebetween.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: November 8, 2011
    Assignee: New Sonic Technologies, LLC
    Inventor: James T. Williamson
  • Patent number: 8047418
    Abstract: A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor physically integrated with the casing for movement therewith and operable for transferring a printed circuit board through the soldering chamber, actuators and for vertically moving the casing, inert gas feeders for feeding an inert gas to the soldering chamber, and a controller for controlling the operation of the actuators and, so that the printed circuit board is contacted with the surface of the flat overflowing wave in an atmosphere of the inert gas during its passage through the soldering chamber.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: November 1, 2011
    Assignees: Fujitsu Ten Limited, Sensbey Co., Ltd.
    Inventors: Nobuyuki Aoyama, Kenshi Ikedo, Akira Okuno, Masato Arita
  • Patent number: 8033444
    Abstract: A method for an explosion welding process to form composite pipes, such as for nuclear power equipment. The explosive welding process includes: (1) An explosives preparation method in which low detonation velocity explosives are produced by using powdery emulsion explosives as a base. The base is mixed completely and evenly with a certain amount of powdered pearl salt, wherein the size of the pearl salt particle is 100-200 mesh, and the ratio of emulsion explosives versus pearl salt is between about 3-5:1. (2) A method of inhibiting the negative influence on welding quality caused by the gap between a base tube and a mold, wherein: the roughness of the base tube outer surface is kept less than that of the mold's inner surface, with the difference in surface roughness being maintained within two-grades. In certain cases, a layer of 1.0.±.0.1 mm copper may be added between the outer wall of a base tube and the inner wall of the mold.
    Type: Grant
    Filed: February 15, 2010
    Date of Patent: October 11, 2011
    Inventors: YaoHua Wang, Hui Wang
  • Patent number: 8028887
    Abstract: A portable soldering system has a caddy collar atop the rim of a bucket and a torch, the flame end of which may heat the tip of a soldering iron. A gas canister, connected to the torch, protrudes from the bucket through a seating opening in the side wall of the bucket. A torch mount positions the torch and the gas canister. The caddy collar has a cradle that may seat the soldering iron.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: October 4, 2011
    Inventors: Joseph M. Martin, Albert L. Cook
  • Patent number: 8016181
    Abstract: A method of producing an electro-optical device for electrically connecting a first terminal portion provided on an electro-optical panel to a second terminal portion of a substrate includes applying an anisotropic conductive adhesive containing conductive particles made of a low-melting-point material onto either the first terminal portion or the second terminal portion, and electrically connecting the first terminal portion to the second terminal portion by eutectic bonding by melting the conductive particles by application of heat in thermocompression bonding of the second terminal portion to the first terminal portion with the anisotropic conductive adhesive therebetween.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: September 13, 2011
    Assignee: Seiko Epson Corporation
    Inventor: Munehide Saimen