Abstract: A method for high rate assembly of nanoelements into two-dimensional void patterns on a non-conductive substrate surface utilizes an applied electric field to stabilize against forces resulting from pulling the substrate through the surface of a nanoelement suspension. The electric field contours emanating from a conductive layer in the substrate, covered by an insulating layer, are modified by a patterned photoresist layer, resulting in an increased driving force for nanoelements to migrate from a liquid suspension to voids on a patterned substrate having a non-conductive surface. The method can be used for the production of microscale and nanoscale circuits, sensors, and other electronic devices.

Abstract: An acousto-optic audio signal cable includes an audio wire cluster, a light emitting diode marquee light wire or a light emitting diodes light-emitting light string or an electroluminescent cable, a transparent or light-transmitting insulating layer, and an acousto-optic controller. The light emitting diode marquee light wire and the audio wire cluster, or the light emitting diodes light-emitting light string and the audio wire cluster, or the electroluminescent cable and the audio wire cluster are integrated into a wire cluster. The transparent or light-transmitting insulating layer wraps the integrated wire cluster. The acousto-optic controller includes a sampling amplifier circuit component, an A/D conversion circuit component, a microprocessor, and an output driver coupled in sequence. An input terminal of the sampling amplifier circuit component is coupled to the audio wire cluster. The output driver is coupled to the light emitting diode marquee light wire.

Abstract: An exterior member having a tubular shape so as to accommodate and protect one conduction path or a plurality of conduction paths includes a resin portion. The resin portion includes a flexible tube portion having flexibility and a straight tube portion so as to linearly route the conduction path. The flexible tube portion and the straight tube portion are continuously formed. The flexible tube portion includes a spiral projection portion in which a first projection having a projecting shape as seen from a tube outer surface side spirally extends in a circumferential direction of the tube outer surface. The straight tube portion includes a straight projection portion in which a second projection continuously extends from an end portion of the spiral projection portion extends in a tube axis direction as the straight tube portion.

Abstract: A display device is disclosed. The display device includes a body, a housing separated from the body and configured to transmit/receive signals to/from the body, and a cable coupling the housing and the body, wherein the cable includes a flat cable located in at least part of the cable and having a flat shape, and a round cable located in at least another part of the cable and having a round shape. According to the present invention, the flat cable has a narrow width by including a plurality of layers, and thus wiring of signal terminals and power terminals can be easily changed between the flat cable and the round cable.

Abstract: A flanged vapor box for mounting an electrical component in a wall or similar structure while preventing air infiltration around or through the box. The vapor box includes a flange with an integral face gasket and one or more cable gaskets at cable entry points into the box. The face gasket prevents seepage of air between the drywall and the box. The cable gaskets seal around any inserted electrical cables to prevent infiltration into the inside environment. Captive fasteners include end portions integral with the box and can be rapidly tightened to secure the box to a stud or similar support. Thin tabs on the flanged vapor box provide a means for rapidly and accurately positioning and aligning the box against a stud or similar support. The alignment tabs are substantially thin to avoid creating a bulge in the drywall surrounding the box.

Abstract: A seal mold divided structure for combination cable is characterized in that it comprises the following structures: a first cable and a second cable separated from the combination cable; a connector provided at the end of said first cable; a division molding portion that molds the division part between said first cable and second cable and keeps said first cable and second cable separated from each other; a connector molding portion that molds the connection part between said connector and said first cable; a protection tube that protects said first cable, with its ends respectively fixed to said division molding portion and said connector molding portion; and isolation portions, which are respectively inserted from the inner sides of both ends of said protection tube and wrap the exterior of said first cable, capable of preventing inflow of a molding compound.

Abstract: An integral, unitary pre-expanded cover assembly unit for covering an electrical connection between first and second electrical cables each having a primary conductor and a neutral conductor includes a cover assembly, a holdout and a holdout support. The cover assembly includes an elastomeric sleeve and a duct. The elastomeric sleeve defines a cable passage to receive the electrical connection and the primary conductors of the first and second cables. The duct overlies the elastomeric sleeve. The duct defines a duct passage configured to receive at least one of the neutral conductors therethrough. The holdout is removably mounted within the cable passage of the elastomeric sleeve. The holdout defines a holdout passage. The holdout maintains the elastomeric sleeve in an expanded state. The holdout support is removably mounted within the holdout passage. The holdout support reinforces the holdout.

Abstract: A microelectronic system includes a base and a semiconductor package mounted on the base. The base includes an internal conductive layer and a build-up layer on the internal conductive layer. The build-up layer includes a top conductive layer. A plurality of microvias is disposed in the build-up layer to electrically connect the top conductive layer with the internal conductive layer. A power/ground ball pad array is disposed in the top conductive layer. The power/ground ball pad array includes power ball pads and ground ball pads arranged in an array with a fixed ball pad pitch P, and the power/ground ball pad array includes a 4-ball pad unit area comprised of only one ground ball pad and three power ball pads, or comprised of only one power ball pad and three ground ball pads. The 4-ball pad unit area has a rectangular shape and a dimension of about 2P×2P.

Abstract: A power panel and modules for use in a power panel are disclosed. One disclosed chassis includes a top, a bottom, a front, a rear, and left and right sides, and an input power bus having a plurality of connection apertures therethrough. A plurality of circuit modules are mounted within the chassis. Each circuit module includes a circuit protection element including first and second bullet-nosed connectors, and a body element having first and second holes positioned to receive the first and second bullet-nosed connectors. The body element includes a bullet-nosed input connector sized to be received by one of the plurality of connection apertures. Each circuit element also includes an output terminal extending rearwardly from the body element.

Abstract: A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately disposed therein and a dielectric layer interposed therebetween, and having first to sixth surfaces, opposing each other, respectively; a plurality of external electrodes connected to the first and second internal electrodes; an insulating layer disposed on the first surface; first and second terminal electrodes spaced apart from each other in a direction in which the third and fourth surfaces are connected, on the insulating layer; and a connecting member electrically connecting the first and second terminal electrodes and the external electrodes.

Abstract: An insulated busbar includes a plate conductor and insulating films which cover the plate conductor. The insulated busbar further includes conductive films which are formed on inside surfaces of the insulating films so as to be in contact with the plate conductor and which cover a vacant space between an end portion of the plate conductor and the insulating films.

Abstract: A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.

Abstract: A wiring attachment assembly includes a stud having at least one channel, a gripping washer engaging the stud in the at least one channel and a wiring conduit including a receiver engaging and holding the stud. A wiring system, incorporating the wiring attachment assembly and an insulator element, as well as a method of wiring for a power folding seat are also disclosed.

Abstract: Method and apparatus are disclosed for interlocking wire conduits for vehicles. An example vehicle includes wiring and conduits. The conduits include a first conduit and a second conduit that each include an inner surface defining a pathway for the wiring, an outer surface, annular ribs extending from the outer surface and defining annular grooves, flanges protruding from distal ends of the annular ribs and configured to interlock with the flanges of the other of the conduits.

Abstract: A wire harness WH is provided with a pipe, through which wires are passed. The pipe has multiple split portions split in the longitudinal direction. The wires are branched in the longitudinal direction. The locations of branching of the wires are defined by locations corresponding to the split portions.

Abstract: A reconfigurable electronic component comprising a channel having first and second ends and outer walls defining a lumen; a liquid phosphonic acid within the lumen; and a liquid metal within the lumen. A first electrical contact at the first end of the channel and a second electrical contact in communication with the lumen at the second end of the channel. A predetermined amount of a solvent and a liquid metal may be within the lumen, and the solvent may comprise ethanol. The liquid metal may be selected from the group consisting of eutectic gallium indium (EGaIn) and eutectic gallium-indium-tin alloys. The phosphonic acid may be selected from the group consisting of decylphosphonic acid (DPA), fluorobenzylphosphonic acid (FPA), and difluorobenzylphosphonic acid (DFPA). The first and second electrical contacts comprise copper. An overflow channel and a reservoir for the liquid metal and phosphonic acid may be in fluid communication with the lumen.

Abstract: The tube (1) has a multi-layered tube body (3), with a tube liner (19) enclosed by a seamless tube shell (21). An electronic device (17) having an energy store for the delivery of the requisite service voltage for operation is protectively arranged between the tube liner (19) and the tube shell (21), and is not visible from the exterior.

Abstract: A cable includes electric wires, an outer cover, a first cover, and a second cover. Each of the electric wires includes a conductive core and an insulator covering the conductive core. The outer cover covers the electric wires and extends from a first atmosphere to a second atmosphere less explosive than the first atmosphere. An outer surface of the outer cover is supported by a partition separating the first atmosphere from the second atmosphere. The first cover includes a thermosetting resin and covers an exposed portion of the electric wires, which is not covered by the outer cover in the second atmosphere. The second cover covers the first cover and includes a material higher in fracture strength than the thermosetting resin.

Abstract: A tap off box (22) for use with a busbar trunking system (24) comprising at least one conducting bar (26), the tap off box (22) comprising: an inlet contact (34); a movable sheath (36) for the inlet contact (34); and an electrical outlet (50) in electrical communication with the inlet contact (34), wherein, when the tap off box (22) is in a mounted position on the busbar trunking system (24), movement of the sheath (36) to a first position breaks an electrical connection between a conducting bar (26) and the electrical outlet (50).

Abstract: Provided are a printed circuit board configured to achieve reduction in impedance of a differential transmission line extending in a stacking direction, and an optical module. The printed circuit board includes a stacking-direction differential transmission line extending in the stacking direction, including: a differential signal via pair including a first signal via and a second signal via; and a plurality of conductor plate pairs each including a first conductor plate expanding outward from the first signal via, and a second conductor plate expanding outward from the second signal via. With respect to a perpendicular bisector of a center-of-gravity line segment connecting centers of gravity of the first and second signal vias, in each of the plurality of conductor plate pairs, centers of gravity of contours of the first and second conductor plates are located on inner sides of the centers of gravity.