Patents Examined by Chen When Jiang
  • Cooling device for semiconductor elements
    Patent number: 6826923
    Abstract: A cooling device for cooling a semiconductor element includes at least one cold plate utilizing a copper plate for cooling a semiconductor element, a condenser utilizing a plurality of flat micro-tubes, a refrigerant pump for circulating a refrigerant, and a fan for cooling the condenser. The cold plate, the condenser, and the refrigerant pump are fluid connected to define a refrigerant circulating circuit.
    Type: Grant
    Filed: April 3, 2003
    Date of Patent: December 7, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masao Nakano, Hiromasa Ashitani, Masafumi Fukushima