Abstract: The invention provides a packaging structure applied to an automotive component having semiconductors and electronic parts mounted on a ceramic base, characterized in that the semiconductors and electronic parts are partly or entirely sealed with a thixotropic silicone gel which has a thixotropy index of about 1.5-3.6 and a penetration depth of about 6-10 mm and a rate of change in viscosity of less than 10% of the initial value.

Abstract: A composition comprises a curable epoxy-containing material, a first thermoplastic polyurethane component, a curative for the epoxy-containing material, and optionally, a second thermoplastic polyurethane component that is different than the first thermoplastic polyurethane component. The compositions are useful for sealing discontinuities in a substrate surface, especially those found in motor vehicles. Sealant articles and methods of sealing discontinuities are also disclosed.

Abstract: The present invention provides a primer composition comprising (A) a vinyl polymer having a main chain substantially comprising vinyl copolymer chain and at least one silicon-containing group having a hydroxy group or a hydrolyzable group bonded to a silicon atom and capable of crosslinking by forming a siloxane bond at the terminal end of the main chain and/or side chain, and (B) (a) a saturated hydrocarbon polymer having at least one silicon-containing group having a hydroxy group or a hydrolyzable group bonded to a silicon atom and capable of crosslinking by forming a siloxane bond, and/or (b) a polybutadiene polymer having at least one silicon containing group having a hydroxy group or a hydrolyzable group bonded to a silicon atom and capable of crosslinking by forming a siloxane bond, which can remarkably improve the adhesion to various kinds of substrates, and which is particularly useful when applied to the isobutylene series sealing material.

Abstract: A solid material for recovering metal ions from aqueous streams, and methods of making and using the solid material, are disclosed. The solid material is made by covalently bonding a chelating agent to a silica-based solid, or in-situ condensing ceramic precursors along with the chelating agent to accomplish the covalent bonding. The chelating agent preferably comprises a oxime type chelating head, preferably a salicylaldoxime-type molecule, with an organic tail covalently bonded to the head. The hydrocarbon tail includes a carbon-carbon double bond, which is instrumental in the step of covalently bonding the tail to the silica-based solid or the in-situ condensation. The invented solid material may be contacted directly with aqueous streams containing metal ions, and is selective to ions such as copper (II) even in the presence of such ions as iron (III) and other materials that are present in earthen materials.

Abstract: Aqueous binders comprising organic bismuth compounds and reaction products, having a number-average molar mass Mn of at least 5000 g/mol, of epoxy resins, optionally fatty acids and amines are obtained by reacting epoxide compounds containing at least two epoxide groups per molecule and reaction products of epoxide compounds, optionally fatty acids and amines, and are suitable as binders for aqueous systems for corrosion protection.

Abstract: In an insulating film having improved adhesive strength and a multilayer printed circuit board having the same, the insulating film made of an epoxy resin, a rubber and a filler, for use in an insulating layer of a multilayer printed circuit board, is composed of a first coating layer and a second coating layer. The first coating layer has a greater amount of rubber and filler and a smaller amount of epoxy resin than the second coating layer.

Abstract: The invention concerns a coating composition capable of being cold vulcanised (EVF), characterised in that it comprises, in a mixture: (1) at least one polyorganosiloxane having, per molecule, at least two C2-C6 alkenyl groups bound to silicon; (2) at least one polyorganosiloxane having, per molecule, at least two hydrogen atoms bound to silicon; (3) a catalytically effective amount of at least one catalyst, consisting of at least one metal belonging to the platinum group; (4) an adherence promoter; (5) optionally a reinforcing system which can be at least a polyorganosiloxane resin and/or a reinforcing filler; (6) optionally at least one cross-linkage inhibitor; (7) and mineral or organic hollow microspheres.

Abstract: Heat curable compositions comprising: (A) at least one compound which is capable of undergoing cationic polymerization; (B) at least one quaternary ammonium salt of an aromatic-N-heterocyclic cation and of a non-nucleophilic anion; (C) at least one 1,1,2,2-substituted-1,2-ethane-diol and/or a derivative thereof, and (D) optionally further additives; and wherein said component (C) is a compound of formula (I), wherein each of R1, R2, and R3 independently of the other is unsubstituted phenyl or has one of the meanings of R4; R4 is substituted phenyl optionally substituted &agr;-naphthyl or &bgr;-naphthyl, or an optionally substituted aromatic heterocyclic ring system or each of R1 and R2 and/or R3 and R4 independently of the other form a residue of formula (II), wherein each of R5 and R6 independently of the other is hydrogen or (C1-C4)alkyl; R7 is —(CH2)n— or —S— or —O—; and n is 0, 1, 2, or 3.

Abstract: A coating composition comprising a silicone resin having at least two types of fluorinated organic substituent groups and hydroxyl or monovalent hydrolyzable groups forms, through brief curing at low temperature, a uniform transparent coating having a low refractive index (e.g., below 1.42) and a high hardness as well as excellent water repellency, oil repellency, and antifouling property. Stacking the coating on a high refractive index layer results in an antireflection article having an improved reflectance.

Abstract: A coating composition for producing electrically conductive coatings, containing one or more electrically conductive pigments and an organic binder, as well as, optionally, additives and auxiliary agents, in an aqueous solvent, which organic binder contains a copolymer dispersible in water and based on (meth)acrylate- and silylated, unsaturated monomers. The total content of organic solvents in the composition does not exceed 0.5% by weight. The coatings thus obtained are especially well-bonded and resistant to mechanical influences and to solvents, and exhibit suitable conductivity (sheet resistivity) values.

Abstract: A method of forming an insulating film which includes the steps of: dissolving in a solvent a first and second polymer which each comprise methylpolysiloxane as the main component and one of which has a weight average molecular weight at least 10 times that of the other to thereby prepare a chemical solution; applying the chemical solution to a semiconductor substrate to form a coating film; and heat-treating the coating film to thereby form an organosilicon oxide film. The weight-average molecular weight of the first polymer is preferably at least 100 times that of the second polymer. Thus, an insulating organosilicon oxide film having a low dielectric constant and high cracking resistance is formed from a coating fluid.

Abstract: A process for producing an article having a fine uneven surface, coated with a film which has high heat resistance, does not crack and does not peel off from a substrate. The process for producing the article comprises disposing a film-forming solution between a substrate and a mold in the form of a film so as to make the solution closely contact with the substrate and the mold, said solution being prepared by carrying out the hydrolysis and dehydration polycondensation reaction of a stock solution containing a specific silane compound (A) having an unhydrolyzable organic group and a hydrolyzable group, a specific silane compound (B) having a hydrolyzable group and a catalyst, and heating to form an article having an uneven film having a surface shape which is the inversion of the surface shape of the mold on the surface of the substrate. The film-forming solution contains the above silane compounds (A) and (B) in the form of unhydrolysates in amounts of 0.5 to 40 wt % and 0.

Abstract: A reinforcing tape for a slide fastener comprises a polyamide elastomer film manifesting a modulus of elasticity in bending in the range of 6,000 to 9,000 kg/cm2 and an adhesive layer. In a preferred embodiment, a polyester hot-melt adhesive is used for the adhesive layer. Preferably an intermediate layer having a thickness thinner than the thickness of the polyamide elastomer film and that of the adhesive layer is interposed between the polyamide elastomer film and the adhesive layer. In this case, a polyester anchor coat agent is used for the intermediate layer.

Abstract: The invention relates to a pressure sensitive adhesive composition comprising a poly(1-alkene) elastomer and a multifunctional (meth)acrylate component. The invention also relates to articles comprising the composition and a method of making the composition.

Abstract: Inert nitrogen-containing compounds, such as melamine, urea, dicyandiamide, and benzoguanamine and derivatives of such compounds are added to thermosetting resin powder coatings to enhance the electrostatic charge of the powders. Such enhancement improves coating processes for non-conductive and conductive substrates.

Abstract: In accordance with the foregoing, the present invention comprises a polyester epoxy resin powder coating exhibiting improved impact resistance and flexibility, without the loss of other key properties and where the 1,3-PDO modified polyester has lower melt viscosity than polyesters made with 100% neopentyl glycol, which is formed by reacting: a) A carboxyl functional polyester resin formed by reacting one or more aliphatic glycols and one or more polycarboxylic acids and/or anhydrides, wherein 5 to 90% (on a molar basis) of the aliphatic glycol is 1,3-propanediol, in the presence of an esterification catalyst and then endcapping the polyester with an endcapping agent to ensure that the polyester has carboxyl chain ends; and b) An epoxy resin crosslinking agent.

Abstract: A resin blend that includes a copolymer of styrene and maleic anhydride (SMA), an epoxy resin (brominated, phosphonated, or bromine-free), and a multifunctional amine cross-linking agent is disclosed. The cross-linking agent generally contains at least two primary amino groups to promote formation of imide functionalities upon reaction with the anhydride moieties of the SMA copolymer. Particularly useful cross-linking agents include triazine-centered diamino and triamino compounds such as benzoguanamine, acetoguanamine, and melamine. The disclosed resin blend finds use as a polymer matrix in composite materials and as an impregnating resin in laminates. Compared to conventional SMA copolymer/epoxy resin blends, the disclosed resin exhibits lower dielectric constant and dissipation factor, as well as higher thermal and moisture resistance, making it especially useful in high-speed, low-loss printed wire board applications.

Abstract: A substrate that is substantially non-wettable to adhesive resin is disclosed. The substrate is coated with a fluorinated silane composition. Preferable fluorosilane compositions include perfluoroalkyl alkylsilanes of Formula III: R5nR6mSiX4−(n+m)  III wherein R5 is a perfluoroalkyl alkyl radical; R6 is alkyl or alkenyl; X is acetoxy, halogen or alkoxy; n is 1 or 2; and m is 0 or 1. The composition is preferably applied in solution and upon evaporation of the solvent, forms a durable, non-wetting, yet well-adhering surface. In a preferred embodiment, the substrate is a chip carrier with enhanced wire bondability for use in the manufacture of a semiconductor device.

Abstract: A halogen-free dielectric resin mixture is described for use in microvia and other similar applications. The resin mixture contains a cyanate ester monomer or prepolymer a bismaleimide, an epoxy and a flame inhibiting compound selected from the group consisting of a phosphinic acid anhydride, a phosphonic acid andydride and a phosphonic acid half-ester. The flame inhibitor is present in an amount wherein the elemental phosphorus content is between about 2% and about 20% by weight, based on the weight of the resin mixture. The resin mixture can also include one or more coloring, fluorescent and UV absorbing agents. Prepregs based on the resin mixture with inorganic or organic reinforcing agents, as well as circuit boards and chip carriers made from the prepregs are also described. A resin coated article for use in microvia laser applications is likewise included.

Abstract: To provide a transparent resin which is suitable in the process of producing a coating for electronic materials, a glass having both of the scattering-preventing function and the antireflective function, an adhesive agent, a shock-absorbing material, an ultraviolet-cutting sheet for televisions, a filter for VDTs and a high refractive index primer composition as well as the process for the production of primer-coated lenses using said primer composition, is excellent in a coatability, adhesive property, storage stability, durability, shock resistance and the like, and is particularly excellent in a transparency and adhesive property after curing of the same. A transparent resin having an adhesive property characterized by comprising a cured product of the polymerizing composition which comprises at least one of diallyl phthalate, diallyl isophthalate and diallyl terephthalate, and pentaerythritol tetra(3-mercaptopropionate).