Abstract: A cooling cabinet is configured to cool a to-be-cooled device and includes a cabinet body, a first diversion assembly, and a second diversion assembly. The cabinet body can contain a cooling medium for at least partially immersing the to-be-cooled device, and the cabinet body has a first diversion inlet for introducing the cooling medium and also has a first diversion outlet for discharging the cooling medium. The first diversion assembly is coupled to the first diversion inlet, and the first diversion assembly has a second diversion outlet for discharging the cooling medium into the cabinet body. The second diversion assembly is coupled to the first diversion outlet, and the second diversion assembly has a second diversion inlet for introducing the cooling medium to flow through the to-be-cooled device.

Abstract: A liquid cooling device is configured to be in fluid communication with a heat absorbing component. The liquid cooling device includes a first tank, a second tank, a third tank, and a channel structure. The second tank has a first connector, the third tank has a second connector, and the first connector and the second connector are configured to be in fluid communication with the heat absorbing component via pipes. The second tank and the third tank are in fluid communication with the first tank via the channel structure. Orthogonal projections of the second tank and the third tank onto the first tank do not overlap with each other.

Abstract: A cooling tower for evaporative cooling of water is contained within an ISO-compliant shipping container frame, permitting stacking of cooling towers for transport and for certain industrial applications. A volume of fill media is contained within the frame. Spaced apart troughs underlie the fill media, running substantially the length of the fill media and connecting to a basin. Baffles are connected to one upper edge of the troughs, while an air flow space is positioned over the other upper trough edge. A water distribution system, with variable flow nozzles positioned closely above the fill media, sprays water over the upper surface of the fill media, where it moves by gravity down into the troughs. Fans atop the fill media move air vertically upward through the fill media.

Abstract: A liquid cooling heat exchange apparatus for memory modules comprising a thermal conduction assembly, fastening assembly, and first and second working fluid splitters is provided. The thermal conduction assembly, mounted on the memory nodules via the fastening assembly, comprises a pair of flat flexible conduits, each having at least one fluid passageway communicating with the first and second working fluid splitters, and a pair of cooling spreaders. The pair of flat flexible conduits is in thermal contact with heat producing chips of the memory modules, thermally coupling the first and second working fluid splitters together for transferring heat from the heat producing chips. The pair of cooling spreaders is in thermal contact with the pair of flat flexible conduits for transferring heat from the heat producing chips to the thermal conduction assembly. Each of the at least one fluid passageway is expandable.

Abstract: An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.

Abstract: Embodiments are disclosed of an apparatus including a cooling loop and a heating loop. The cooling loop includes a temperature control plate having a fluid inlet and a fluid outlet, the temperature control plate being adapted to be thermally coupled to one or more heat-generating electronic components. An inlet control is fluidly coupled to the fluid inlet of the temperature control plate and an outlet control fluidly coupled to the fluid outlet of the temperature control plate. A cooling fluid source is fluidly coupled the inlet control and a cooling fluid return fluidly coupled to the outlet control. The heating loop contains less fluid than the cooling loop and includes a heating fluid source fluidly coupled the inlet control and a heating fluid return fluidly coupled to the outlet control. A pump can circulate heating fluid through at least the heating fluid supply, the temperature control plate, and the heating fluid return.

Abstract: A cold plate is provided and includes a casing, a guiding baffle, a base, a first inlet passage, an outlet passage and a pump. The guiding baffle is disposed in the casing and defines a fluid storage chamber together with the casing. The fluid storage chamber is filled with a working medium. The guiding baffle includes a communication opening. The base, the casing and guiding baffle together define a working space. The working medium flows into the working space through the communication opening, and the base is used for absorbing thermal energy and transfers the thermal energy to the working medium. The first inlet passage communicates with the fluid storage chamber and allows the cooled working medium to flow into the fluid storage chamber. The outlet passage communicates with the working space to allow the heated working medium to be discharged from the working space.

Abstract: A heat dissipation fin includes a body and an airflow guiding structure. The body has a first surface and a second surface opposite to each other and an airflow hole penetrating the first surface and the second surface. The airflow guiding structure is obliquely joined on the first surface of the body and covers part of the airflow hole. An airflow passage is formed between the airflow guiding structure and the first surface. Part of an airflow is adapted to pass along the first surface through the airflow passage to flow away. Part of the airflow passes in a direction from the second surface through the airflow hole to flow away.

Abstract: Pierced thermal interface constructions including a thermal interface material (TIM) structure comprising: a TIM sheet comprising a plurality of piercings, where each of the plurality of piercings comprises a cavity and displaced material, and where the displaced material from each of the plurality of piercings protrudes away from the TIM sheet.

Abstract: A heat exchanger can be configured to utilize multiple sections of hardway fins that can be configured so that an upper first section of the fins can build up liquid head and a second lower section of the fins can be configured to distribute liquid in an even, or uniform, manner. The first section of fins can utilize a different type of hole arrangement than the second section of fins. For instance, the diameter or width of the holes in the first section may differ from the diameter or width of the holes of the second section. In addition (or as an alternative), fin frequency and/or spacing between immediately adjacent holes in the first section of fins may be different from the spacing between immediately adjacent holes in the second section of fins.

Abstract: A fin, comprising: multiple fin subunits arranged in multiple rows, the fin subunits in two adjacent rows being arranged in an offset fashion.

Abstract: The present disclosure provides a multi-purpose heat sink, a method of manufacturing the same, a board card, and a multi-purpose heat sink platform, where the multi-purpose heat sink is composed of a bracket (310) and heat dissipation components. The cost of the multi-purpose heat sink in the present disclosure is low.

Abstract: Disclosed is a heat dissipation device including a base, a plurality of heat pipes and a heat dissipation structure. The base includes a support plate, a plurality of through-pipe grooves are arranged in the support plate. Each heat pipe includes a heat absorption section and a heat transfer section connected to the heat absorption section, where the heat absorption section is arranged in the through-pipe grooves and at least one heat transfer section of the heat pipe is away from the support plate in the perpendicular direction to the support plate. The heat dissipation structure is arranged on the first surface of the support plate, and the heat transfer section of the plurality of heat pipes extends into the interior of the heat dissipation structure and thermally contacts the heat dissipation structure. The heat dissipation device of the present disclosure dissipates heat faster.

Abstract: A receiving box for a heat exchanger may include a box body delimiting at least one duct formed in the box body. The box body may include a plurality of receptacles configured to receive a plurality of tube bodies of the heat exchanger. The plurality of tube bodies may each be fluidically connected to the at least one duct. The box body may define an injection tube that extends along the at least one duct and is separated from the at least one duct via the box body. The injection tube may include at least one outlet opening fluidically connected to the at least one duct.

Abstract: The invention relates to a collector plate (11) for a heat exchanger (1), the collector plate (11) comprising: a peripheral groove (21) having a bottom (22), at least one upper step (25) protruding with respect to the bottom (22) of the said groove (21) over a predefined height (H1), and at at least one longitudinal end of the collector plate (11), an intermediate portion (27) between the upper step (25) and the said groove (21), According to the invention, at the said at least one longitudinal end of the collector plate (11), the said groove (21) has an inner wall (23), at least one section of which connects the intermediate portion (27) to the bottom (22) of the said groove (21) and extends over a height (H2) which is not zero and is less than the height (H1) of the upper step (25). The invention also relates to a corresponding header box (3) and a corresponding heat exchanger (1).

Abstract: A modular heat exchange assembly includes a cold plate defining a finned surface and a corresponding plurality of microchannels. Selected ones of the plurality of microchannel extend from a first end to an opposed second end. A fluid receiver unit defines an inlet port and a first fluid connector fluidically coupled with the inlet port. A fluid transfer unit defines an outlet port and a second fluid connector matingly engageable with and disengageable from the first fluid connector to fluidly couple the fluid receiver unit and the fluid transfer unit together. The fluid transfer unit defines a distribution manifold configured to distribute coolant among the selected microchannels at a position between the first ends and the second ends of the selected microchannels. The fluid transfer unit further defines a collection manifold configured to receive coolant from the selected microchannels. The collection manifold and the outlet port are fluidically coupled together.

Abstract: There is provided a heat exchanger system comprising a housing defining a heat exchange compartment in which are extending a plurality of circular flexible pipes including radially extending fins, the fins defining a helical pattern along the length of each of the circular flexible pipes. There is also provided a circular flexible pipe having radially extending fins, the fins defining a helical pattern along the length of the circular flexible pipe. There is further provided a method and an apparatus for manufacturing a circular flexible pipe having radially extending fins, the fins defining a helical pattern along the length of the circular flexible pipe.

Abstract: A heating, ventilation, and/or air condition (HVAC) controller assembly to reduce undesired air currents includes a front cover, a back plate configured to be removably secured to the front cover, HVAC controller circuitry, a plurality of wire openings, and an air intrusion barrier configured to extend across the wire openings. The HVAC controller circuitry is configured to be electrically coupled to a plurality of wires extending through a hole in the wall to adjust an environmental characteristic of in a controlled space. Each wire opening is configured to receive only a single wire and each wire is configured to extend through a different one of the wire openings. The air intrusion barrier is configured to receive the wires to generally form a plurality of seals against the wires. The wire openings are configured to substantially support the wires to reduce movement of the wires relative to the air intrusion barrier.

Abstract: An electronics enclosure can be a line replaceable unit for installation in a chassis having actively cooled cold plates. The electronics enclosure has a housing, heat spreaders, and moveable heat spreaders. The electronics enclosure can be positioned in the chassis with the moveable heat spreaders close to the housing and thereafter the moveable heat spreaders can be moved away from the housing to press against the cold plates. Heat from electronics within the electronics enclosure can pass from the housing, through the heat spreaders, through the moveable heat spreaders, and into the cold plates.

Abstract: An environmental control unit, such as an HVAC or heat pump unit, includes a housing which contains four main components: a blower which draws air into the housing via an air inlet and exhausts air from the housing via an air outlet; a first heat exchanger that exchanges heat through the air and is located between the air inlet and the blower; a second heat exchanger, which exchanges heat through water and is disposed in the second area of the housing; and a compressor. The environmental control unit having a predetermined set of parts can be arranged in multiple configurations to meet installation requirements, where configurations include air entering from the left side or, alternatively, from the right of the environmental control unit. The configurations utilize the same parts and provide front-facing access to fluid connections and the control board.