Patents Examined by Courtney Smith
  • Patent number: 10159161
    Abstract: A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: December 18, 2018
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Martin Brokner Christiansen, Leonard George Chorosinski, H. Craig Heffner, Stanley Katsuyoshi Wakamiya
  • Patent number: 10158220
    Abstract: Provided are a triple redundant digital protective relay and an operating method therefor. The triple redundant digital protective relay according to the present invention includes: three power monitoring control devices which have a triple redundant structure and control a circuit breaker for separating a failed power system based on a 2 out of 3 voting using real-time mutual data communication; and a central communication device which acquires data related to an operating state of the power system from the three power monitoring control devices and manages the acquired data related to the operating state of the power system.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: December 18, 2018
    Assignee: YPP CO., LTD.
    Inventors: Jong Han Shin, Yong Gil Kim, Jae Hyun Kim
  • Patent number: 10153565
    Abstract: A battery distribution unit (BDU) for holding a first electronic device having a first blade terminal extending therefrom and a second electronic device having a second blade terminal extending therefrom includes a BDU housing, a strip busbar received in the BDU housing, and first and second cross terminals received in the BDU housing. The first cross terminal receives the strip busbar at a first end thereof and is configured to receive the first blade terminal at a second end thereof. The second cross terminal receives the strip busbar at a first end thereof and is configured to receive the second blade terminal at a second end thereof.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: December 11, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventor: Weiping Zhao
  • Patent number: 10146266
    Abstract: The present invention provides an electronic apparatus for reducing the load on mechanism parts and thickness, including a main unit chassis having keytops; a display chassis pivotably connected with the main unit chassis by hinge mechanisms; rubber domes urging the keytops in a direction to cause the keytops to project from an upper surface; an X slider sliding in the main unit chassis in synchronization with the pivoting movements of the main unit chassis and the display chassis; a key depressing mechanism and a link mechanism, causing the keytops to retract from the upper surface when the X slider slides in one direction, and causing the keytops to project from the upper surface when the X slider slides in the opposite direction; and an auxiliary elastic member urging the X slider in a direction to cause the X slider to slide in the one direction.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: December 4, 2018
    Assignee: LENOVO (SINGAPORE) PTE. LTD.
    Inventors: Yoshiyuki Shibayama, Hiroaki Agata, Shigeki Mori, Kimio Kumada, Takane Fujino
  • Patent number: 10147666
    Abstract: A method and apparatus are provided that includes an electronic device, a chip package and a method for cooling a chip package in an electronic device. In one example, the chip package includes an interposer or package substrate having a first IC die and a second IC die mounted thereon. The second IC die has a maximum safe operating temperature that is greater than a maximum safe operating temperature of the first IC die. An indicia is disposed on the chip package. The indicia designates an installation orientation of the interposer or package substrate which positions the first IC die upstream of the second IC die relative to a direction of cooling fluid flow.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: December 4, 2018
    Assignee: XILINX, INC.
    Inventors: Stephen M. Trimberger, Austin H. Lesea
  • Patent number: 10143115
    Abstract: Disclosed herein is an apparatus for cooling an inverter of a vehicle which receives power supplied from a vehicle battery and controls the rotation speed of a motor. The apparatus includes an inverter housing configured to support the inverter, and a heat dissipation unit provided at a predetermined position in the inverter housing and configured to come into contact with an outer circumferential surface of the capacitor so that heat of the capacitor is transferred to the inverter housing.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: November 27, 2018
    Assignee: HANON SYSTEMS
    Inventors: Sung Jun Park, Young Hun Lee, Seung Hwan Shin, Hee Kwon Park, Sae Won Oh, Kyung Hun Jung
  • Patent number: 10141859
    Abstract: A series module assembly particularly for drive technology includes a bus system and series modules arranged in side by side in a row on a mounting base. The series modules each have an electronics housing in which at least one electronic element is arranged. The bus system includes busbars that extend outside of the electronics housing, wherein at least one of the busbars can be electrically connected to the electronic element of one of the series modules via a plug assembly. The series module assembly is designed for wall mounting. The bus bars are pre-assembled with a mounting and bus rail and anchored to the wall. The mounting and bus rail is configured so that the series modules can be mounted on the mounting and bus rail in a direction parallel to the wall in order to establish contact with the busbars. The mounting and bus rail can be adjustably mounted at a selected distance from the wall.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: November 27, 2018
    Assignee: Weidmüller Interface GmbH & Co. KG
    Inventors: Stefan Aporius, Wolfgang Sichmann
  • Patent number: 10136551
    Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: November 20, 2018
    Assignee: Asetek Danmark A/S
    Inventor: Steven B. Branton
  • Patent number: 10133328
    Abstract: A device may include multiple power supplies that are cooled by a system fan. The power supplies may be cross-connected to supply power to one another and the device may monitor temperatures of the power supplies. Based on the temperatures of the power supplies, the device may determine whether any of the power supplies are likely to be on fire. The device may shut off the fan when a power supply is determined to be likely to be on fire.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: November 20, 2018
    Assignee: Juniper Networks, Inc.
    Inventors: Thuan Khac Che, Jaspal S. Gill, Frank Krippendorf
  • Patent number: 10133305
    Abstract: A detachable head-mounted-display cushion may include a cushion layer having a user-side surface dimensioned to abut a facial portion of a user and a display-side surface dimensioned to abut a mounting surface of a facial-interface system for a head-mounted display. The detachable head-mounted-display cushion may also include a magnetic-coupling mechanism configured to removably attach the cushion layer to the mounting surface of the facial-interface system. A corresponding head-mounted-display system may include a head-mounted display, a facial-interface mounting member for the head-mounted display, a cushion layer abutting the facial-interface mounting member, and a magnetic-coupling mechanism removably attaching the cushion layer to the facial-interface mounting member. A method may include positioning a cushion layer abutting a facial-interface mounting member for a head-mounted display and removably attaching the cushion layer to the facial-interface mounting member with a magnetic-coupling mechanism.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: November 20, 2018
    Assignee: Oculus VR, LLC
    Inventors: Joseph Patrick Sullivan, Shane Michael Ellis
  • Patent number: 10127949
    Abstract: A computing device caddy for housing a computing device is provided. The caddy includes a first caddy component. The first caddy component includes a first end wall including a first plurality of fins coupled to an outer surface of the first end wall. The first plurality of fins are configured relative to each other to create eddies within a flow. The caddy also includes a second caddy component. The second caddy component includes a second end wall. The second end wall is opposite the first end wall. The second caddy component is coupled to the first caddy component, thereby defining a cavity for housing the computing device.
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: November 13, 2018
    Inventor: Andrew William Mayhall
  • Patent number: 10123645
    Abstract: Described is a hanger device and key holder. The key holder is coupled to the hanger device and includes a key ring for holding keys. The hanger device is configured for office use by coupling to the top of an office divider wall. The hanger device is both a coat hanger for hanging apparel and a key holder for holding keys. The hanger device has several common office use electronic devices integrated into the hanger device, such as a laser pointer, a remote access device, and a portable memory device. The hanger device has a battery to feed the included electronic devices and a display to provide data and information related to the electronic devices. The hanger device provides functions needed by office workers and helps keep items used by office workers from getting lost.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: November 13, 2018
    Assignee: WALMART APOLLO, LLC
    Inventor: Yurgis Mauro Bacallao
  • Patent number: 10128723
    Abstract: A power tool and a printed circuit board assembly (“PCBA”) for the power tool. The PCBA includes, for example, a printed circuit board (“PCB”), a heat sink, a spacer between the PCB and the heat sink, and a gap pad. The PCB and the heat sink are fastened to one another via fasteners so the spacer absorbs excess forces torsional forces from torques applied to the fasteners. The gap pad is placed within an opening or recess of the spacer to contact one or more FETs on the PCB. In some embodiments, the PCBA includes a second heat sink or rigid member on the opposite side of the PCB than the spacer to further distribute excess torsional forces from torques applied to the fasteners.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: November 13, 2018
    Assignee: MILWAUKEE ELECTRIC TOOL CORPORATION
    Inventors: Matthew J. Mergener, Daniel R. Ertl
  • Patent number: 10123460
    Abstract: A thermal management system and method for electronic devices is provided. The system includes an electronic device, a heat sink, and a thermally conducting and electrically insulating thermal bridge that is interposed between the electronic device and the heat sink. The thermal bridge thermally couples the electronic device to the heat sink and electrically isolates the electronic device from the heat sink. The electronic device, the heat sink, and the thermal bridge are mounted on a same planar surface of a printed circuit board.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: November 6, 2018
    Assignee: COVIDIEN LLP
    Inventors: Steven C. Rupp, Daniel A. Friedrichs, Robert B. Smith
  • Patent number: 10114488
    Abstract: An interface module is provided. The interface module includes a substrate and a flexible print circuit board. The substrate includes a first side, a second side, a plurality of column electrodes and a plurality of row electrodes, wherein the first side is perpendicular to the second side, the column electrodes are formed on the substrate and arranged along the first side, and the row electrodes are formed on the substrate and arranged along the second side. The flexible print circuit board includes a first connection portion and a second connection portion, wherein the first connection portion is electrically connected to the column electrodes at the first side, and the second connection portion is electrically connected to at least a portion of the row electrodes at the second side.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: October 30, 2018
    Assignees: INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD., INNOLUX CORPORATION
    Inventor: Kung-Chieh Huang
  • Patent number: 10114426
    Abstract: An expansion card includes a mounting bracket with a full height I/O panel with a top mounting panel attached thereto extending orthogonally away. A low profile printed circuit board assembly (PCBA) is physically attached to at least one of the top mounting panel and the full height I/O panel, and the mounting bracket and low profile PCBA define a full height expansion card. The low profile PCBA has a card edge that is insertably connectable to an I/O connector of an information handling system (IHS) to communicate with other components of the IHS. A full height heat sink is attached to the low profile PCBA and extends across a portion of the top mounting panel, providing increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA. A battery compartment is mounted on the mounting panel and supplies power to the functional components.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: October 30, 2018
    Assignee: Dell Products, L.P.
    Inventors: Chih-Hsiang Lee, Yao-Chien Lien, Hsien-Chih Wu, Chien Hung Chou, Kuo-Chih Lin, Martin Hardis
  • Patent number: 10117346
    Abstract: Disclosed are a supporting structure having a variable form and an electronic device having the same. A supporting structure may include a fixing module, a tail end module, and a flexible module connecting the fixing module and the tail end module. The flexible module may include multiple chain units. The chain unit may include a support plate having a support surface and a lower surface opposite to the support surface, and a driving portion extending along from a side of the support plate away from the lower surface of the support plate. The chain units are hingedly connected in series. Adjacent chain units may drive the support surfaces to construct different forms through interaction between the driving portions, thereby forming the supporting structure whose form can be flexibly changed.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: October 30, 2018
    Assignee: SHENZHEN ROYOLE TECHNOLOGIES CO., LTD.
    Inventors: Songling Yang, Songya Chen, Dan Ni, Zihong Liu
  • Patent number: 10114353
    Abstract: A modular data center includes a controller; a data center control system configured to collect data center data associated with the modular data center via communication with one of the controller and a plurality of sensors; and a data module connected to a power supply source. The power supply source includes at least one of a power grid, a backup power source and a power module. The power module includes electronics equipment for conditioning and distributing power to the one or more data modules. The data module includes a first enclosure defining a first internal space; and a first sensor in the plurality of sensors. The first sensor is in communication with at least one of the controller and the data center control system. A second sensor in the plurality of sensors is in communication with the power supply source.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: October 30, 2018
    Assignee: BASELAYER TECHNOLOGY, LLC
    Inventor: George Slessman
  • Patent number: 10114423
    Abstract: Embodiments of an apparatus and system are described for a hybrid computing device. Some embodiments may comprise a computing device having an enclosure arranged to support a display on a front of the enclosure and a cover mechanically coupled to a side of the enclosure, the cover comprising a first portion having at least one integrated input device and a second portion having at least one flexible seam arranged to allow the second portion to adjustably pivot around the seam. Other embodiments are described and claimed.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: October 30, 2018
    Assignee: INTEL CORPORATION
    Inventors: Sameer Sharma, Gadi Amit, Yoshikuzu Hoshino, Chadwick Harber, Daniel Clifton, Kenneth Jasinski
  • Patent number: 10111350
    Abstract: An opening is formed in a top plate, and an opening is formed in a side plate which is approximately orthogonal to the top plate. A wall extending from a part of an edge part of the opening part and recessed toward the internal side of a casing includes an inclined surface inclined radially from the internal side of the casing to an edge part of the opening part and facing the opening part and the opening part.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: October 23, 2018
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takafumi Morihara, Satoru Yamamoto