Abstract: The present invention relates to a powder coating composition containing a low temperature curable epoxy resin, and more particularly to a powder coating composition containing a low temperature curable epoxy resin, which can be readily cured at a low temperature, thereby capable of being applied to coating objects that are noneconomic al in terms of workability at an elevated temperature, or are thermally sensitive. The present invention provides a powder coating composition comprising 100 parts by weight of a low temperature curable epoxy resin; 30 to 500 parts by weight of curing.

Abstract: A tire comprising a tread, where said tread includes a vulcanized rubber, where said vulcanized rubber includes from about 0.5 to about 40 weight percent epoxidized rubber; from about 1 to about 35 parts by weight of a functionalized polyolefin per 100 parts by weight of said vulcanized rubber; and from about 1 to about 100 parts by weight silica per 100 parts by weight of said vulcanized rubber.

Abstract: An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. The epoxy resin composition for encapsulating semiconductors contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.

Abstract: Use of compositions prepared with organic coupling agents carrying epoxy groups for preparing applications requiring simultaneously improved mechanical properties and low viscosity.

Abstract: The object of the present invention is to provide an epoxy resin and epoxy resin composition having a low viscosity which can afford a cured product having an excellent heat resistance. The present invention is characterized by using an epoxy resin which is obtained by reacting 5-methylresorcin with epihalohydrin in the presence of alkali metal hydroxide.

Abstract: A radiation curable resin composition for a Fresnel lens is provided, which exhibits a high elastic modulus and a high refractive index and is superior in adhesion to the plastic substrate and is superior in transparency. A lens layer exhibits excellent shape retention over a wide temperature range and is less likely to chip and crack due to an external force. A Fresnel lens sheet using the radiation curable resin composition is also provided. The resin composition comprises, as an essential component, an epoxy (meth)acrylate (a) having an epoxy equivalent per weight of 450 g/eq or more, which has a cyclic structure and two or more (meth)acryloyl groups; a specific trifunctional (meth)acrylate (b); a (meth)acrylate (c) having a molecular weight of 700 or less from an aliphatic polyhydric alcohol having an oxypropylene structure; and a monofunctional (meth)acrylate (d) having a cyclic structure.

Abstract: A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.

Abstract: A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.

Abstract: The present invention discloses an active-hydrogen-containing phosphorus compound for cross-linking a resin and for imparting flame-retardancy to the cured resin, and in particular to a cured frame-retardant epoxy resin prepared by reacting the hardener with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group. The present invention also discloses an epoxy resin made from the active-hydrogen-containing phosphorus compound and epihalohydrin.

Abstract: The present invention has an object to provide a flame-retardant epoxy resin composition excellent in heat resistance and moisture resistance. A flame-retardant epoxy resin composition relating to the present invention contains an epoxy resin (A), a phosphazene compound (B), an epoxy hardener (C) and an inorganic filler (D), wherein the phosphazene compound (B) and the epoxy hardener (C) are included in the range of 0.

Abstract: A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising (A) an epoxy resin having the following general formula (i):  wherein n is 0 or a positive number, (B) a curing accelerator, and (C) an amorphous silica-titania co-melt as at least one of inorganic fillers, said composition satisfying the relationship of the following formula (1): [ { 2 ⁢ ( n A 2 + n C 2

Abstract: A printed circuit board or card having plated through-holes is provided wherein plated through-holes are filled with a photocured polymerized composition. Also, a method for fabricating these printed circuit boards or cards is provided. Also provided are compositions and methods of providing carrier films coated with the compositions for use in filling vias or plated through-holes.

Abstract: Low VOC aqueous coatings having excellent wetting ability are disclosed. The compositions comprise a film-forming resin in conjunction with an additive comprising a carboxylic acid, an amine, and an alcohol. Methods for making and using these compositions are also disclosed, as are the additives themselves.

Abstract: A coating composition comprises a polycondensate obtained by reacting a prehydrolysate based on at least on epoxide-containing hydrolysable silane; at least one amine component selected from a prehydrolysate based on at least one amino-containing hydrolysable silane and an amine compound containing at least two amino groups; and an amino group protective reagent. The coating composition is particulary suitable for coating glass, glass ceramic, ceramic, and plastic, and permits an increase in strength and protection against damage.

Abstract: The present invention relates to an epoxy resin composition a cure article thereof, a novel epoxy resin used therein, a polyhydric phenol compound suited for used as an intermediate thereof, and a process for preparing the same. One of the objects to be achieved by the present invention is to exert the heat resistance, the moisture resistance, the dielectric performances and the flame-resistant effect required of electric or electronic materials such as semiconductor encapsulating materials and varnishes for circuit boards in the epoxy resin composition.

Abstract: The present invention provides an aqueous coating composition comprising a carboxyl-containing, acrylic-modified polyester resin (B) neutralized and dispersed in an aqueous medium, the polyester resin (B) being obtainable by reacting a carboxyl-containing acrylic resin (c) with an epoxy-modified polyester resin (A) prepared by esterification of a carboxyl-containing polyester resin (a) having a number average molecular weight of 1,000 to 30,000 and an acid value of 5 to 200 mg KOH/g with a 1,2-epoxy-containing low-molecular-weight epoxy compound (b) having a number average molecular weight of 1,200 or less.

Abstract: The present invention provides UV curable coating powders comprising a blend of one or more than one free radical curable resin and one or more than one cationic curable resin, at least one free radical photoinitiator and at least one cationic photoinitiator, including suitable cross-linking agents and additives to enhance the chemical and physical properties of the coating appearance. The coating powder, preferably finely ground to between 5 and 30 microns in average particle size, is applied to a substrate, heat fused, and cured for an amount of time sufficient to form a powder coating having a low gloss finish.

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract: A high strength adhesive having a good impact strength at low temperatures, below 0° C., and at temperatures of 90° C. is provided. The adhesive comprises a copolymer having at least one glass transition temperature of −30° C. or lower having epoxy reactive end groups or a reaction product of the copolymer with a polyepoxide, a reaction product of a polyurethane prepolymer and a polyphenol or polyaminophenol and at least one epoxy resin.

Abstract: A thermoplastic elastomer composition for powder slush molding made up of a polypropylene resin, hydrogenated styrene/butadiene rubber, a process oil and an elastomer excellent in oil absorbing power. A process for making that thermoplastic elastomer composition may include the addition of an organic peroxide to the above components and kneading the obtained mixture while heating.