Patents Examined by Dameon E. Levi
  • Patent number: 11183751
    Abstract: An illustrative example transmission device, which is useful for an automated vehicle, includes a substrate having a metal layer near one surface of the substrate and a waveguide area. The metal layer includes a slot that at least partially overlaps the waveguide area. A source of radiation includes a first radiation output situated on a first side of the slot and a second radiation output situated on a second, opposite side of the slot.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: November 23, 2021
    Assignee: APTIV TECHNOLOGIES LIMITED
    Inventors: George J. Purden, Shawn Shi, David W. Zimmerman
  • Patent number: 11177574
    Abstract: A method includes determining an operating frequency of an antenna at a component of the antenna. The method includes determining, at the component of the antenna, a filter node of a plurality of filter nodes to activate to tune the antenna to the operating frequency. The method includes transmitting power to the filter node, wherein the power is transmitted via a first optical fiber. The method also includes sending a signal from the component to a light source. The activation of the light source sends an optical signal to the filter node. The filter node adjusts a characteristic of a radiating element coupled to the filter node using the power responsive to the optical signal. Adjustment of the characteristic facilitates tuning the antenna to the operating frequency.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: November 16, 2021
    Assignee: AT&T INTELLECTUAL PROPERTY I, L.P.
    Inventor: Robert R. Miller, II
  • Patent number: 11165154
    Abstract: A coil antenna having a capacitor that is not separated from a metal terminal or an electrode of a mounting substrate even when a root portion of a bobbin around which a coil is wound is bent by an external force. The coil antenna includes a bobbin; a coil wound around the bobbin; a capacitor connected to the coil; a base made of an insulating material formed integrally with the bobbin; and a mounting substrate having a plate shape with a pair of electrodes formed on a surface of the mounting substrate extended from the base for mounting the capacitor, such that the mounting substrate is held in a cantilevered manner in a winding direction of the coil.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: November 2, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yusuke Suzuki, Kenji Naito, Minoru Sunahara
  • Patent number: 11165140
    Abstract: Aspects of the present disclosure may be directed to a wrap-around antenna capable of being wrapped around a support structure to provide antenna patterns for a communication system. Such an assembly may be aesthetically pleasing and, because the antenna assembly allows for radiation away from the support structure, scattering effects due to interference from the support structure may be eliminated.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: November 2, 2021
    Assignee: CommScope Technologies LLC
    Inventors: Gregory J. Maley, Jonathon C. Veihl, Charles J. Buondelmonte, Ed Bradley
  • Patent number: 11139577
    Abstract: A wireless electronic device includes a ground plane, a first antenna element, a first extension element, a first switching element and a plurality of impedance elements. The ground plane includes a first edge and a second edge opposite to each other. The first antenna element is adjacent to the first edge. The first extension element is adjacent to the second edge. The first switching element is electrically connected to the first extension element. The plurality of impedance elements are electrically connected between the first switching element and a ground. The first switching element connects the first extension element to one of the plurality of impedance elements in response to an operation frequency band of the first antenna element.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: October 5, 2021
    Assignee: Acer Incorporated
    Inventors: Yung-Sheng Tseng, Huei-Chun Yang, Chung-Hsuan Tsai
  • Patent number: 11133601
    Abstract: Various examples are provided that are related to fractal-based reactive impedance surfaces. These surfaces allow for miniaturization of antennas. In one example, a fractal rectangular reactive impedance surface (FR-RIS) includes a plurality of fractal rectangular (FR) patches having an outer edge defined by a fractal rectangular pattern that is repeated along each side of inner FR patches of the plurality of FR patches. The fractal rectangular pattern of a FR patch matches with the fractal rectangular pattern of an adjacent FR patch. An antenna can include a planar antenna disposed over the FR-RIS.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: September 28, 2021
    Assignees: University of Florida Research Foundation, Incorporated, Electronics and Telecommunications Research Institute (ETRI)
    Inventors: Yong Kyu Yoon, Seahee Hwangbo, Hae Yong Yang
  • Patent number: 11128037
    Abstract: A radome (10) for vehicles defining a proximal side and a distal side, comprising a base layer (1) formed of a radio transmissive resin, the base layer (1) defining a proximal face and a distal face; a decoration layer (2) applied to the proximal face of the base layer (1), the decoration layer (2) comprising a metalloid or a metalloid alloy; characterized in that the radome (10) also comprises an anti-reflective coating (4) placed proximal with respect to the decoration layer (2). The anti-reflection layer will eliminate the high reflecting disturbances introduced by the top coat, which will significantly improve radome aesthetics.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: September 21, 2021
    Assignee: Zanini Auto Grup, S.A.
    Inventors: Augusto Mayer Pujadas, Jerson Jair Peralta, Josep Maria Armengol Rocaspana
  • Patent number: 11108160
    Abstract: An antenna module of a wireless communication system is provided. The antenna module includes a radiator comprising a top face to which a radio wave is radiated, a dielectric material disposed on a bottom face of the radiator, the bottom face of the radiator being opposite to the top face of the radiator, a feeding unit disposed on a bottom face of the dielectric material, the feeding unit being configured to supply an electric signal to the radiator through the dielectric material, and a support unit disposed on the bottom face of the dielectric material, the support unit comprising a metallic material.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: August 31, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoongeon Kim, Seungtae Ko, Hyunjin Kim, Jungmin Park, Junsig Kum, Youngju Lee
  • Patent number: 11101546
    Abstract: The present disclosure discloses an electronic device having a first slot disposed along a side surface of the electronic device; and a first metal portion disposed on the side surface corresponding to the first slot being used as a radiator of a first antenna of the electronic device.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: August 24, 2021
    Assignee: LENOVO (BEIJING) CO., LTD.
    Inventor: Shichao Li
  • Patent number: 11095034
    Abstract: The antenna in the embodiments provided includes: a first-layer antenna, a second-layer antenna, a first probe, a second probe, a first connector, and a second connector. An annular microstrip patch is attached to each of main bodies of the first-layer antenna and the second-layer antenna. The annular microstrip patch attached to the first-layer antenna is provided with a first feeding network and a second feeding network therein. The first-layer antenna is connected to the first probe and the second probe by using the first feeding network and the second feeding network respectively. The first-layer antenna is connected to the first connector and the second connector. A position of the first connector corresponds to a position where the first probe is connected to the first-layer antenna. A position of the second connector corresponds to a position where the second probe is connected to the first-layer antenna.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: August 17, 2021
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Huaizhi Zhang, Sunjie Wang, Daniele Inserra, Guangjun Wen
  • Patent number: 11095021
    Abstract: A wearable device including an outer housing including first, second, and side surfaces, wherein a metal frame is formed on at least a portion of the side surface, a display, a printed circuit board (PCB), a communication circuit disposed on the PCB, and a ground area provided in the PCB, wherein a metal frame is electrically connected to the communication circuit at a first point of the metal frame and is selectively connected to the ground area at a second point of the metal frame, and wherein the communication circuit is configured to transmit and/or receive a signal in a first frequency band by a first electrical path formed if the second point is not connected to the ground area, and transmit and/or receive a signal in a second frequency band by a second electrical path formed if the second point is connected to the ground area.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: August 17, 2021
    Inventors: Sang Bong Sung, Woo Suk Kang, Se Woong Kim, Chae Up Yoo, Jae Bong Chun
  • Patent number: 11081804
    Abstract: A multilayer substrate includes a first dielectric layer and a conductor pattern disposed in at least an interior of the first dielectric layer. A second dielectric layer formed of a different material from a material of the first dielectric layer is disposed on the multilayer substrate. At least one radiation element is formed on the second dielectric layer. A feeding wire connects the radiation element and the conductor pattern. The feeding wire includes a conductor pin that is conductive and extends in a thickness direction of the second dielectric layer. The conductor pin electrically connects the radiation element and the conductor pattern. Provided is an antenna-integrated type communication module having such a structure that the accuracy of circuit simulation is easily enhanced and the degree of freedom in selection of dielectric materials is large.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: August 3, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryuken Mizunuma, Shinichiro Banba, Michiharu Yokoyama, Hideki Ueda, Hideaki Yamada, Noboru Morioka
  • Patent number: 11081800
    Abstract: The present disclosure relates to a dual-polarized antenna comprising a dipole radiator, a resonant cavity radiator and a reflector. The resonant cavity radiator is arranged below the reflector and radiates through a slot in the reflector, and the dipole radiator is arranged above the reflector, with a signal line and/or a carrier of the dipole radiator extending through the slot.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: August 3, 2021
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Andreas Vollmer, Maximilian Goettl, Dan Fleancu
  • Patent number: 11069633
    Abstract: The disclosure provides an electronic package, including a carrier, an electronic component disposed on the carrier, a buffer, and an antenna structure, wherein the antenna structure includes a metal frame disposed on the carrier and a wire disposed on the carrier and electrically connected to the metal frame, and the buffer covers the wire so as to reduce the emission wave speed of the wire and thus the wavelength is shorten, thereby satisfying the length requirement of the antenna within the limited space of the carrier and achieving an operating frequency radiated as required.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: July 20, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Ming-Fan Tsai, Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
  • Patent number: 11063364
    Abstract: An antenna module of a wireless communication system is provided. The antenna module includes a radiator comprising a top face to which a radio wave is radiated, a dielectric material disposed on a bottom face of the radiator, the bottom face of the radiator being opposite to the top face of the radiator, a feeding unit disposed on a bottom face of the dielectric material, the feeding unit being configured to supply an electric signal to the radiator through the dielectric material, and a support unit disposed on the bottom face of the dielectric material, the support unit comprising a metallic material.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: July 13, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoongeon Kim, Seungtae Ko, Hyunjin Kim, Jungmin Park, Junsig Kum, Youngju Lee
  • Patent number: 11056764
    Abstract: A phased array antenna panel includes a first plurality of antennas, a first radio frequency (RF) front end chip, a second plurality of antennas, a second RF front end chip, and a combiner RF chip. The first and second RE front end chips receive respective first and second input signals from the first and second pluralities of antennas, and produce respective first and second output signals based on the respective first and second input signals. The combiner RF chip can receive the first and second output signals and produce a power combined output signal that is a combination of powers of the first and second output signals. Alternatively, a power combiner can receive the first and second output signals and produce a power combined output signal, and the combiner RF chip can receive the power combined output signal.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: July 6, 2021
    Assignee: SILICON VALLEY BANK
    Inventors: Ahmadreza Rofougaran, Seunghwan Yoon, Alfred Grau Besoli, Farid Shirinfar, Sam Gharavi, Michael Boers, Maryam Rofougaran
  • Patent number: 11056791
    Abstract: Antenna devices are provided, including tightly coupled arrays, transmitarrays, and reflectarrays. An antenna device can include a plurality of substrates each having an antenna element. The substrates can be provided in connected series or in an array. The substrates can be part of an origami array such that the entire array is foldable. The substrates can optionally be attached to a framework that can actuate the substrates to different configurations. By bending, folding, or otherwise repositioning the substrates/array, the electromagnetic characteristics of the antenna device can be easily reconfigured for the desired task.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: July 6, 2021
    Assignee: The Florida International University Board of Trustees
    Inventors: Constantinos L. Zekios, Stavros Georgakopoulos, Muhammad Hamza
  • Patent number: 11056777
    Abstract: The present invention provides a millimeter wave LTCC filter including system ground layers, metallized vias, perturbation grounding posts, first and second probes, two adjacent layers of the system ground layers define one closed resonant cavity, each closed resonant cavity is provided with a plurality of metallized vias, the metallized vias of different closed resonant cavities form concentric hole structures, the perturbation grounding posts include first perturbation grounding posts penetrating a second closed resonant cavity and second perturbation grounding posts penetrating a third closed resonant cavity, the first perturbation grounding posts respectively face right to the second perturbation grounding posts, one end of the first probe is inserted into the first closed resonant cavity and electrically connected with the first system ground layer, and the second probe is arranged symmetrically with the first probe and inserted into the fourth closed resonant cavity and electrically connected with the s
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: July 6, 2021
    Assignee: AAC Technologies Pte. Ltd.
    Inventor: Jianchun Mai
  • Patent number: 11050148
    Abstract: An antenna structure includes a ground element, a feeding radiation element, a first radiation element, a second radiation element, a third radiation element, a first capacitor, and a second capacitor. The ground element has a notch region. The feeding radiation element has a feeding point. The first radiation element is coupled to the ground element. The first capacitor is coupled between the feeding radiation element and the first radiation element. The second radiation element is coupled to the ground element. The second capacitor is coupled between the first radiation element and the second radiation element. The third radiation element is coupled to the feeding radiation element. The feeding radiation element, the first radiation element, the second radiation element, the third radiation element, the first capacitor, and the second capacitor are all disposed inside the notch region of the ground element.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: June 29, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chung-Hung Lo, Yi-Ling Tseng, Chin-Lung Tsai, Ching-Hai Chiang, Kuan-Hsien Lee, Ying-Cong Deng, Chung-Ting Hung
  • Patent number: 11031702
    Abstract: A phased array antenna structure includes a carrier, a radiative layer and a circuit layer both disposed on the carrier, and a phase switch. The radiative layer includes two radiating portions. The circuit layer includes a phased antenna and a transmission circuit. The phased antenna including two end portions respectively connected to the two radiating portions. The transmission circuit includes a feeding end and an externally connecting end that is arranged adjacent to the phased antenna. The phase switch is connected to the externally connecting end of the transmission circuit, and the phase switch is configured to selectively connect only one of the two end portions of the phased antenna.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: June 8, 2021
    Assignee: AUDEN TECHNO CORP.
    Inventor: Chi-Ming Chiang