Abstract: A land grid array package or a ball grid array package is electrically connected by an elastomeric type layer (containing alternating elements of conductive and non-conductive silicone) to a printed wire board or motherboard. A hold-down collar engages the peripheral edges of the package and snaps into holes in the board in such manner as to create pressure on the elastomeric layer, causing the layer to compress and create through-going electrical paths between exposed lands or conductive elements on the bottom of the package and exposed conductive elements on the wiring board. In one embodiment, solder balls adhere to the exposed conductive elements on the bottom of the package. In this embodiment the collar is initially in two pieces which are fitted together to engage both the top and bottom edges of the substrate.