Abstract: A compact tile saw which is especially adaptable for cutting of large-sized tiles wherein the table supporting the tile is movable towards the cutting saw, while at the same time the cutting saw is positionable in one of two positions of either being stationary or in moving in unison towards the table supporting the tile to be cut.
Abstract: An apparatus for the chemical-mechanical polishing of wafers has a rotating disk provided with a polishing body, a supply device for a polishing fluid and a holding device for the wafer. An axis of the disk runs parallel to the surface of the wafer. A cylindrical edge surface of the disk is provided with the polishing body in such a way that a trench with a specific cross section can be made in the wafer.