Abstract: A substrate includes, two first through-holes to which high-frequency signals are transmitted and which are arranged side by side so as to have a predetermined distance, and at least three reference potential second through-holes arranged side by side so as to have an distance smaller than the predetermined distance with respect to the two first through-holes. Among three of the second through-holes, one of the second through-holes is arranged in a region between the two first through-holes, and other two of the second through-holes are arranged in a region other than the region between the first through-holes such that one of the other two second through-holes is arranged side by side with respect to one of the two first through-holes, and the other of other two second through-holes is arranged side by side with respect to the other of the two first through-holes.

Abstract: An electronic device is provided. The electronic device includes a front plate disposed on a display, a back plate disposed on a back surface of the electronic device, a side member placed between the front plate and the back plate and forming an outer appearance of the electronic device together with the front plate and the back plate, and first, second, and third antenna modules including a plurality of conductive plates configured to transmit/receive a signal in a specified first frequency band and disposed between the front plate and the back plate so as to be adjacent to the side member. At least a portion of the side member is able to be used as an antenna of a signal in a specified second frequency band different from the specified first frequency band.

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.

Abstract: An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit that includes a first radiator, and an intermediate circuit board coupled to the antenna device to be electrically connected to the antenna unit. The intermediate circuit board includes a core layer, a first feeding wiring formed on one surface of the core layer and electrically connected to the antenna unit, and a second radiator formed on the one surface of the core layer. A radiation coverage is expanded using an antenna included in the intermediate circuit board.

Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.

Abstract: A microstrip electrical antenna (1) and its respective method of manufacturing, wherein the antenna (1) is of the electrically small kind being configured based on at least one wave parameter with which it will be operated. The present disclosure also refers to an equipment endowed with the electrical antenna (1).

Abstract: A microstrip antenna array including: a thin substrate; two or more microstrip radiating patches placed on a first side of the substrate, each radiating patch including: an input port; a radiating patch width (WRP) extending in a longitudinal direction; a radiating patch length (LRP) extending in a transverse direction, wherein the transverse direction is perpendicular to the longitudinal direction, and wherein the longitudinal and transverse directions are in the plane of the radiating patch; a radiating patch transverse axis (TRP) along the midpoint of the radiating patch width; and a radiating patch longitudinal axis along the midpoint of the radiating patch length, wherein the two or more radiating patches are spaced in the longitudinal direction such that the radiating patch longitudinal axis of each radiating patch is aligned along a common longitudinal axis (C); and one or more parasitic patches placed on the first side of the substrate.

Abstract: A structure includes: a first conductor that extends in a second direction; a second conductor that faces the first conductor in a first direction and that extends along the second direction; a third conductor configured to capacitively connect the first conductor and the second conductor; a fourth conductor that is electrically connected to the first conductor and the second conductor, and that extends along a first plane; and a first resist layer that covers the fourth conductor. The fourth conductor includes a plurality of first areas exposed to outside via a plurality of through holes of the first resist layer. Each of the first conductor and the second conductor includes one or more second areas. The first resist layer extends on the first conductor and the second conductor to cover the fourth conductor, excluding the second areas. The first areas and the second areas are arranged along the first plane.

Abstract: The invention relates to a high-frequency-transparent component comprising: a main body (2) and a coating (3) consisting of metal-doped Al2O3 sputtered thereon, and to a method for producing said component.

Abstract: An antenna positioner provided on a deployable vehicle. The antenna positioner includes a base and a frame having a plurality of plates oriented at an angle relative to one another. Each plate may include a low band antenna and a high band antenna. The base is located inside a chamber of the deployable vehicle. The frame is movable relative to the base between a collapsed position, where the entire frame is positioned within the chamber, and an extended position wherein at least a portion of the frame extends outwardly through an opening in the deployable vehicle's exterior wall. The frame is pivotally engaged with the base and a gearing mechanism pivots the frame between the collapsed position and the extended position to arrange the antennas at a desired orientation relative to the deployable vehicle's exterior wall so as to maximize the antenna's near-vertical Field of View (FoV).

Abstract: One example method includes transmitting a test signal through the transmit channel n, where the test signal is radiated by a service antenna element n corresponding to the transmit channel n and is received by a calibration antenna element in the phased array antenna. N coupling signals received by N calibration antenna elements coupled to the service antenna element n can then be obtained. Delay weighting can then be performed on the N coupling signals based on relative positions of the service antenna element n and each of the N calibration antenna elements to obtain N calibration signals. The N calibration signals can then be combined into the calibration signal corresponding to the transmit channel n. Calibration signals corresponding to all transmit channels in the phased array antenna can then be obtained. At least one of amplitudes or phases of the transmit channels can then be compensated for.

Abstract: Multi-sided antenna modules employing antennas on multiple sides of a package substrate for enhanced antenna coverage, and related antenna module fabrication methods. The multi-sided antenna module includes an integrated circuit (IC) die(s) disposed on a first side of the package substrate. The multi-sided antenna module further includes first and second substrate antenna layers disposed on respective first and second sides of the package substrate. The first substrate antenna layer includes a first antenna(s) disposed on the first side of the package substrate adjacent to the IC die(s). The second substrate antenna layer includes a second antenna(s) disposed on the second side of the package substrate opposite of the first side of the package substrate. In this manner, the multi-sided antenna module, including antennas on multiple sides of the package substrate, provides antenna coverage that extends from both sides of the package substrate to provide multiple directions of coverage.

Abstract: Disclosed herein is a coil component that includes a substrate, a coil pattern formed on one surface of the substrate, and a magnetic layer comprising a composite material obtained by dispersing magnetic particles in resin and formed on the one surface of the substrate so as to cover the coil pattern. The coil pattern has a flat shape in which a thickness thereof is smaller than a radial width. Each of the magnetic particles has a flat shape in which a thickness thereof in a direction perpendicular to the one surface of the substrate is smaller than a diameter in a direction parallel to the one surface of the substrate. Some of the magnetic particles exist within a height range of the coil pattern with respect to the one surface of the substrate.

Abstract: An antenna assembly includes one or more dielectrics having a first surface and a second surface opposite from the first surface. An antenna layer includes one or more antenna elements disposed on the first surface of the one or more dielectrics. A stripline feed network is disposed on or within the one or more dielectrics. One or more cavities are formed in the one or more dielectrics. The one or more cavities are disposed below the one more antenna elements.

Abstract: A keyboard module includes a housing, an antenna circuit board, a supporting bracket, an antenna, and a plurality of key caps. The housing includes a bottom wall and a side wall. The antenna circuit board is disposed above the bottom wall. The supporting bracket is disposed above the antenna circuit board, and a gap is formed between an edge of the supporting bracket and the side wall. The supporting bracket includes a notch recessed into the edge, and the notch faces the side wall. The antenna is disposed in the gap, extends into the notch, and is connected to the antenna circuit board. These key caps are disposed above the supporting bracket.

Abstract: Disclosed is a dual-band very low frequency antenna, which comprises positive and negative electrodes, silicon substrates, piezoelectric material units, stress-electromagnetic conversion material units and an insulator. The piezoelectric material units are arranged between the positive and negative electrodes; the stress-electromagnetic conversion material units and the silicon substrates are respectively arranged at both ends of the positive and negative electrodes. The positive and negative electrodes are used for driving the piezoelectric material units; the piezoelectric material units are used for generating flutter and conducting the flutter to the stress-electromagnetic conversion material units; the stress-electromagnetic conversion material units are used for converting vibration waves generated by flutter into electromagnetic wave radiation.

Abstract: Embodiments of a wireless communications antenna of a wearable electronic device, and method of its use are described herein. An apparatus can comprise a housing having top and bottom portions, a printed circuit board (PCB), a metal frame, and a band. The top portion of the housing can include an antenna element, which can be conductively coupled to the PCB. The metal frame can have a first coupler and a second coupler. The PCB can be disposed between, and not conductively coupled to, the housing and the metal frame. The band can have first and second end portions, which can be conductively coupled to the frame when removably coupled to the first coupler and second coupler, respectively. The antenna element, the metal frame, and the first and second end portions of the band can collectively define an antenna having an antenna profile when the antenna is operational.

Abstract: A slot antenna and a communication device including the slot antenna are provided. The slot antenna includes: a dielectric layer having a first surface and a second surface opposite to each other, a radiation layer on the first surface of the dielectric layer and having a plurality of slots therein, and a first shielding layer on the second surface of the dielectric layer and electrically connected to the radiation layer.

Abstract: A radio frequency coupling structure comprising (1) a substrate that forms a top side of a waveguide, (2) a first conductive layer disposed on a bottom side of the substrate, (3) a second conductive layer incorporated within the substrate, (4) a through via that is communicatively coupled to the first conductive layer and extends through an opening in the second conductive layer toward a top side of the substrate, and/or (5) a ring slot formed around the through via in the first conductive layer. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A light fixture includes a housing containing a light engine, and a wireless baffle module. The wireless baffle module includes a baffle coupled to the housing and used for focusing light emitted from the light engine. The wireless baffle module further includes a wireless printed circuit board assembly coupled to an antenna. The wireless printed circuit board assembly receives and processes wireless signals from the antenna, and sends control signals to the light engine based on the wireless signals. The wireless baffle module may be coupled to a lighting system with an existing non-wireless module, or be used to replace a wireless baffle module with the same or different wireless protocol.