Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A) and a compound (B) represented by the following formula (1), and wherein the content of the component (B) based on 100 parts by mass of the component (A) is from 0.01 to 2.0 parts by mass, an epoxy resin composition, and use of an amine composition for an epoxy resin curing agent, wherein R1 represents an alkyl group having 1 to 6 carbon atoms, and p is a number of 1 to 3.

Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A), a compound (B) represented by the specific formula (1), and a compound (C) represented by the specific formula (2), and wherein a mass ratio of the component (B) to the component (C) [(B)/(C)] is from 0.01 to 5.0, an epoxy resin composition, and use of an amine composition for an epoxy resin curing agent.

Abstract: The present invention provides a germ-repellent silicone rubber comprising: a silicone rubber substrate and a germ-repellent active ingredient incorporated therein; wherein, the silicone rubber substrate includes polydimethylsiloxane; the germ-repellent active ingredients include poly(ethylene oxide) and silicone oil or their derivatives. The disclosed germ-repellent silicone rubber reduces the bacterial growth by inhibiting their adherence to the surface instead of killing them, does not contribute to super bacteria formation nor cause skin irritation.

Abstract: A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.

Abstract: Polyphosphate compositions are produced by a process that includes the steps of continuously introducing a phosphate compound into a polymerization vessel, polymerizing the phosphate compound at a temperature of 250-450° C. for a time period sufficient to form the polyphosphate composition, and continuously discharging the polyphosphate composition from the polymerization vessel. The phosphate compound can be fed to the polymerization vessel in the form of an aqueous slurry containing 5-50 wt. % of the phosphate compound. Resulting polyphosphate compositions often contain at least 8 wt. % of a polyphosphate and less than 35 wt. % of the phosphate compound.

Abstract: A prepreg having high processability and laminating performance and a method to produce such a prepreg is described, the prepreg comprising at least the components [A] to [E] shown below, and having a structure incorporating a first layer composed mainly of the component [A] and a first epoxy resin composition that contains the components [B] to [D] but which is substantially free of the component [E], and a second layer composed mainly of a second epoxy resin composition that contains the components [B] to [E], [A] carbon fiber, [B] epoxy resin, [C] curing agent, [D] thermoplastic resin, and [E] particles containing a thermoplastic resin as primary component and having a volume-average particle diameter of 5 to 50 ?m.

Abstract: A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1. E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2??Formula 1 In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.

Abstract: A composition comprising (a) a cationically polymerisable epoxy resin, (b) an initiator for the cationic polymerisation, (c) a microparticle filler, and (d) a nanoparticle filler can be used for the production of thermally stable insulating material for electrical and electronic components.

Abstract: The present disclosure belongs to polymercaptan compounds and application fields thereof, and particularly relates to a polymercaptan compound and a preparation method thereof, a curing agent, a resin composition, an adhesive and a sealant. The polymercaptan compound is represented by formula (I), wherein R1, R2, R3, R5, R7 and R8 are each independently selected from one of a hydrogen atom, an alkyl group with 1-5 carbon atoms and an alkoxy group with 1-5 carbon atoms, R4 and R6 are each independently selected from an alkylene group with 1-5 carbon atoms, and m and n are each independently 0, 1, 2 or 3.

Abstract: The purpose of the present invention is to provide: an epoxy resin composition capable of giving cured resins which combine flexural modulus with flexural strain on a high level and have excellent heat resistance; a prepreg comprising the epoxy resin composition and reinforcing fibers; and a fiber-reinforced composite material obtained by curing the prepreg and excellent especially in terms of 0° and 90° bending strength. An embodiment of the epoxy resin composition of the present invention for achieving such purpose is an epoxy resin composition which comprises the following components [A], [B], and [C] and satisfies a specific requirement. Component [A]: a trifunctional amine type epoxy resin. Component [B]: a bisphenol F type epoxy resin which is solid at 25° C. Component [C]: an aromatic amine compound.

Abstract: A composition, method, and article of manufacture are disclosed. The composition is formed by polymerizing monomers, and includes at least one flame-retardant bis(triketone) monomer and at least one amine monomer. The method includes obtaining at least one flame-retardant bis(triketone) monomer, obtaining at least one amine monomer, and polymerizing the monomers to form a flame-retardant polydiketoenamine. The article of manufacture includes a polymer formed by polymerizing at least one flame-retardant bis(triketone) monomer and at least one amine monomer.

Abstract: An oxymethylene copolymer resin composition, which includes (i) an oxymethylene copolymer, (ii) a derivative of an aryl boron fluoride compound, and (iii) a layered double hydroxide; and a method for producing the same.

Abstract: The invention relates to a curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) an epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a trisphenolmethane type epoxy compound, and (D) a curing agent, and optionally (E) an inorganic filler and (F) a curing accelerator; a cured product thereof; methods of producing the curable resin composition and the cured product; and a semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Abstract: Described herein are poloxamer compositions for use as a shear protectant in cell culture and methods for preparing and using such compositions.

Abstract: A preparation method of itaconate-butadiene bio-based engineering rubber belongs to the bio-based engineering rubber area. The bio-based engineering rubber of the present disclosure is formed through chemical crosslinking of copolymers, which are formed by polymerization of itaconate and butadiene emulsion. The number average molecular weight of the itaconate-butadiene copolymer is about 53000-1640000, and weight-average molecular weight is about 110000-2892000. Itaconate-butadiene copolymers are formed by polymerization of itaconate and butadiene emulsion, then and chemical crosslinking of the copolymer is performed to form bio-based engineering rubber using a traditional sulfur vulcanizing system. The bio-based engineering rubber has high molecular weights as well as lower glass-transition temperatures and can be vulcanized using the traditional sulfur vulcanizing system.

Abstract: The present invention relates to a new structural class of phenalkamine, phenalkamine curing agent compositions, methods of making such phenalkamine, and methods of making such compositions. The phenalkamine curing agent compositions of the present invention can be prepared by reacting cardanol with an aldehyde compound and a mixture of methylene bridged poly(cycloaliphatic-aromatic)amines. These curing-agent compositions may be used to cure, harden, and/or crosslink an epoxy resin.

Abstract: A first composition is disclosed that includes a fire-resistant thermoplastic resin. The fire-resistant thermoplastic resin includes 1-20 wt % of an aryl phosphate, includes 1-20 wt % of a phosphate polymer, and 60%-98% of a (meth)acrylic polymer, including units from at least one monomer, wherein the monomer is chosen from methyl methacrylate, acrylic acid, methacrylic acid, acrylic acid esters, methacrylic acid esters, acrylonitrile and maleic anhydride. The first composition may further include a fabric or a composite material that is embedded with the fire-resistant thermoplastic resin. In some instances, the aryl-phosphate and the phosphonate polymer synergistically reduce an effective heat of combustion, a peak heat release, or a flame time as compared to a second composition that contains only one of the aryl phosphate or the phosphonate polymer.

Abstract: Disclosed herein is a copolymer comprising first polymerized units of the formula (1); wherein: R1 is H or a substituted or unsubstituted C1-C6 alkyl group; and R2 is a substituted or unsubstituted C3-C20 alkyl group that optionally includes one or more of —O—, —S—, —N—, —C(O)—, or —C(O)O—, —N—C(O)—, —C(O)—NR—; wherein R is H or a substituted or unsubstituted C1-C6 alkyl group; and second polymerized units of the formula (2): wherein: R3 is a substituted or unsubstituted C1-C6 alkyl group that optionally includes one or more of —O—, —N—, —S—, —C(O)—, or —C(O)O—; wherein the first polymerized units and the second polymerized units are chemically different, and the copolymer is free of fluorine.

Abstract: An aliphatic epoxy-terminated polysulfide polymer has the formula R?—CHOH—CH2-S—R—(Sy-R)t-S—CH2-CHOH—R? and is formed by a process, where each R is independently chosen from branched alkanediyl or branched arenediyl groups and groups with the structure —(CH2)a-O—(CH2)b-O—(CH2)c- and about 0 to about 20% of the number of R-groups are branched alkanediyl or branched arenediyl groups and about 80 to about 100% of the number of R-groups have the structure —(CH2)a-O—(CH2)b-O—(CH2)c-, where t is from about 1 to about 60, y is an average value of from about 1.0 to about 2.5, b is an integer value of from about 1 to about 8, and a and c are independently integers from about 1 to about 10, and where each R? is independently a particular radical where, m, n, o, p, q and r independently have a value of from about 1 to about 10.

Abstract: The disclosure relates to methods for producing poly(cyclohexadiene) homopolymers (PCHD). The PCHD is formed by polymerizing a 1,3-cyclohexadiene monomer in the presence of a catalyst, in a hydrocarbon solvent, and at a temperature of ?100° C. to 120° C. The catalyst is selected from the group consisting of a Bronsted acid, a Lewis acid, and combinations thereof. PCHD produced under these conditions has good solubility in non-polar solvents, and a number average molecular weight of 300 to 5,000 Dalton; a weight average molecular weight of 5,000 to 15,000 Delton; and a polydispersity index of 3.0 to 8.0. The PCHD is useful for producing crosslinked materials having good physical properties. The crosslinked materials can be combined with a rubbery polymer to produce compositions valuable for further downstream uses.