Abstract: An electronic device includes: a first light modulation assembly, including: a first substrate; a second substrate opposite to the first substrate; a first conductive layer disposed on the first substrate; a second conductive layer disposed on the second substrate; a first insulating layer disposed on the first substrate; and a first light modulation layer disposed between the first conductive layer and the second conductive layer.

Abstract: The cholesteric liquid crystal display (CLCD) device includes first and second cholesteric liquid crystal panels that reflect light within different wavelength ranges. Both panels have gate lines that extend from one side to the other. A gate driver is electrically connected to the first panel's gate lines. Additionally, a flexible printed circuit is electrically connected to both the first and second panels' gate lines.

Abstract: Terminals of a plurality of types of components to be mounted on a circuit board are provided beforehand with a joining material corresponding to the type of component. A basic joining material is applied to the circuit board all at one time. The basic joining material is commonly usable for joining all of the types of components to the circuit board. An individual joining material is applied to certain locations on the circuit board, to which locations components of a particular type are to be mounted. The individual joining material matches properties of the joining material provided beforehand to the components of the particular type. The second step may be performed before the first step to yield the same results.

Abstract: A method of making a wire connection in a semiconductor device, the method comprising: (a) forming an under bump metallurgy (UBM) over a chip including the bonding pad formed thereon; (b) forming a gold bump on the UBM at a location corresponding to the bonding pad; (c) etching the UBM with the gold bump as a mask; and (d) connecting one end of a bonding wire to a conductive lead by ball bonding and the other end thereof to the gold bump on the bonding pad of the chip by stitch bonding. The conductive lead is located external to the chip as a part of a lead frame or a substrate. Alternatively, the semiconductor chip having bumps may be formed by electroless plating a nickel layer on the bonding pads of the chip, and followed by electroless plating a gold layer on the nickel layer. It is noted that the semiconductor chip having metal bumps is formed by wafer bumping process.

Abstract: The invention relates to a method and device for producing printed circuit boards and electric conductors. The inventive device comprises a station where a conductive layer is fixed to a support material, a cutting station, connected to the first station so that the conductive layer can be cut to form a conductor and a station where cuttings are removed.

Abstract: A method and device for providing a gate blocking material. Specifically, a method for molding a substrate having known good and bad sites thereon, by blocking the gate area of the bad sites during the molding process. A blocking material or an injection pin are used to interrupt the flow of molding compound through an injection molding system, and thereby prevent molding compound from flowing onto the known bad substrate sites.