Patents Examined by David W. Shumaker
  • Patent number: 5098656
    Abstract: A unique class of bonding alloys and methods for their use are provided which enable the user to electrically join superconductive materials to themselves, to normal conductive materials, or to semi-conductors. The bonding alloys have enhanced wetting properties and a melting point less than 100.degree. C. in all instances. The bonding alloys are unusual and advantageous in that they create an intimate, direct, mechanical and electrical contact between the superconductive material and any other electrical conductor while minimizing mechanical and chemical stresses and avoiding alterations to the superconductive material itself.
    Type: Grant
    Filed: August 1, 1990
    Date of Patent: March 24, 1992
    Assignee: Trustees of Boston University
    Inventors: George O. Zimmerman, Alvaro Kaplan
  • Patent number: 5075076
    Abstract: The invention relates to a novel palladium-based alloy.This palladium-based alloy comprises tin in an amount, preferably of 5 to 20% by weight, which is sufficient to impart an acceptable resistance to corrosion by molten glass, preferably being essentially equivalent to that of platinum-rhodium 10% alloys.An alloy of this type can be used in the glass industry for making components which come into contact with molten glass, which preferably essentially contains no oxides less stable than tin oxide, such as lead oxide, because it has an excellent resistance to corrosion by molten glass and is much less expensive than the platinum-rhodium 10% alloy normally used. Moreover, by the addition of at least one element selected from platinum (0-50% by weight), rhodium (0-20% by weight), iridium (0-20% by weight) and ruthenium 0-20% by weight), the mechanical strength at high temperature, especially the creep strength, is significantly improved.
    Type: Grant
    Filed: January 8, 1990
    Date of Patent: December 24, 1991
    Assignee: Comptoir Lyon-Alemand-Louyot, Societe Anonyme
    Inventors: Jean-Paul Guerlet, Jean-Pierre Hilger