Patents Examined by Dean Reichard
  • Thin module system and method
    Patent number: 7602613
    Abstract: A flexible circuit has contacts for mounting in a socket or card edge connector. The flexible circuit includes integrated circuit devices mounted on both sides of the edge connector contacts. Preferably, the flexible circuit is wrapped about an edge of a rigid substrate and presents contacts on both sides of the substrate for mounting in a socket. Multiple flexible circuits may be overlaid with the same strategy. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers.
    Type: Grant
    Filed: January 18, 2007
    Date of Patent: October 13, 2009
    Assignee: Entorian Technologies, LP
    Inventors: Paul Goodwin, James W. Cady, Douglas Wehrly
  • Printed circuit boards for high-speed communication
    Patent number: 7601919
    Abstract: Apparatus and method for communicating high-speed signals between a primary printed circuit board and one or more secondary printed circuit boards. The high-speed signals are communicated between the primary printed circuit boards and the secondary printed circuit boards through multi-layer flexible conductors.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: October 13, 2009
    Assignee: NeoPhotonics Corporation
    Inventors: Chinh Q. Phan, Robert P. Lombaerde, Jignesh H. Shah
  • In-grid decoupling for ball grid array (BGA) devices
    Patent number: 7602615
    Abstract: A ball grid array (BGA) having an array of BGA pads on one side and at least a pair of contiguous through board vias, at least a pair of conductive pads surrounding the through hole vias, wherein the conductive pads have octagonal shapes and four sides of each octagonal pad are mutually parallel.
    Type: Grant
    Filed: February 23, 2007
    Date of Patent: October 13, 2009
    Assignee: Alcatel Lucent
    Inventors: Alex Chan, Paul James Brown
  • Electronic module and method for the production thereof
    Patent number: 7602614
    Abstract: An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: October 13, 2009
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Wolfram Eurskens, Rudolf Kerler, Heinz Pape, Peter Strobel, Stephan Stoeckl
  • Board-housing case and fluid pressure control device including thereof
    Patent number: 7599189
    Abstract: A resin case main body includes a connector housing, a component housing, and a joint portion. A busbar includes a reinforcement plate portion which is orthogonal to a plane of a board and is parallel to an alignment direction of the connector housing, the joint portion, and the component housing. The reinforcement plate portion is formed by insert molding in the joint portion.
    Type: Grant
    Filed: January 3, 2008
    Date of Patent: October 6, 2009
    Assignee: Advics Co., Ltd.
    Inventors: Kosei Nishimoto, Koji Yanai, Takahiro Naganuma
  • Shock absorber assembly and portable computer utilizing the same
    Patent number: 7599195
    Abstract: A portable computer and a shock absorber assembly thereof. The portable computer includes a body, a hard disc drive, a supporting member, an isolator, a frame, and a damper. The hard disc drive is disposed in the body. The supporting member is disposed on the hard disc drive. The isolator is disposed on the supporting member. The frame is disposed on the hard disc drive. The damper is disposed on the frame. Thus, the hard disc drive is connected to the body by the isolator, and connected to the frame by the damper. As a result, the vibration generated by the hard disc drive is isolated to avoid affecting the other portions of the portable computer.
    Type: Grant
    Filed: November 22, 2006
    Date of Patent: October 6, 2009
    Assignee: ASUSTeK Computer Inc.
    Inventor: Yi-Jen Chen
  • Electronic board, method of manufacturing the same, and electronic device
    Patent number: 7598459
    Abstract: An electronic board includes: a substrate on which is formed an electronic circuit having a connection terminal; a stress-relaxation layer formed on the substrate; rearrangement wiring for the connection terminal disposed at a top side of the stress-relaxation layer; and a capacitor that has a first electrode that is disposed between the substrate and the stress-relaxation layer, a second electrode that is disposed at the top side of the stress-relaxation layer, and a dielectric material that is disposed between the first electrode and the second electrode.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: October 6, 2009
    Assignee: Seiko Epson Corporation
    Inventor: Nobuaki Hashimoto
  • Signal transmitting apparatus using flexible flat cable for an optical disc drive
    Patent number: 7596000
    Abstract: The disclosure relates to a signal transmitting apparatus. The signal transmitting apparatus includes a conductor, a first and a second circuit boards, and a signal transmitting medium that is electrically interconnected between the first circuit board and the second circuit board. The signal transmitting medium includes a ground wire and an insulating layer wrapping the ground wire, wherein at least an end portion of the ground wire is not wrapped by the insulating layer and is bent to overlap the insulating layer and electrically connected to the conductor via a conductive adhesive material so as to conduct the electrostatic charges accumulated in the signal transmitting medium to the conductor as a ground.
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: September 29, 2009
    Assignee: Lite-On It Corp.
    Inventors: Shih-Lin Yeh, Jung-Fu Chen, Min-Cheng Yang
  • Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate
    Patent number: 7595454
    Abstract: A method of making a circuitized substrate in which pairs of vertically oriented though holes are formed such that at least one of the through holes is partially embedded within a lower one, thus assuring a sound connection following subsequent lamination or other steps the substrate including such holes is subjected to during manufacture. An electrical assembly including a substrate with such features is also provided.
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: September 29, 2009
    Assignee: Endicott Interconnect Technologies, Inc.
    Inventors: John S. Kresge, Cheryl L. Palomaki
  • Support tray with fold-away handles
    Patent number: 7595984
    Abstract: A support tray with fold-away handles is disclosed. When the support tray (which may be used to support a printed circuit board) is installed into a computer chassis, the handles are put into an upright position in which the handles extend above the support tray. In this position, the handles can be held by a user to easily lower the support tray into the chassis. When the support tray is not installed in a chassis (e.g. when the support tray is being shipped), the handles are put into a fold-away position in which the handles are situated underneath the support tray. This enables the support tray to maintain a low profile when the handles are not in use.
    Type: Grant
    Filed: May 4, 2006
    Date of Patent: September 29, 2009
    Assignee: Sun Microsystems, Inc.
    Inventors: Brett C. Ong, Andrew P. Tosh, William A. De Meulenaere
  • Circuit board and method for its production
    Patent number: 7595452
    Abstract: The invention relates to a circuit board and a method for its production. The highly flexible circuit board includes electrically non-conductive threads and electrically conductive threads. These threads form a fabric with a regular mesh structure. In the latter at least electrically conductive threads are used as warp threads and weft threads.
    Type: Grant
    Filed: May 11, 2006
    Date of Patent: September 29, 2009
    Assignee: Sefar AG
    Inventors: Tünde Kirstein, Ivo Locher, Christoph Maurer
  • Surface mount package
    Patent number: 7595453
    Abstract: A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further includes a ceramic layer between the first and second metal layers. The ceramic layer has an opening therethrough.
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: September 29, 2009
    Assignee: M/A-COM Technology Solutions Holdings, Inc.
    Inventor: William Palmteer
  • Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
    Patent number: 7593234
    Abstract: Disclosed herein is an electro-optical device including a substrate for the electro-optical device connected with a flexible circuit board, wherein the flexible circuit board partially faces one surface of the substrate for the electro-optical device, is folded to face the other surface of the substrate for the electro-optical device at a position which does not overlap the substrate for the electro-optical device, and has a region extending to overlap the substrate for the electro-optical device, and wherein a reinforcement plate is interposed between the substrate for the electro-optical device and the folded flexible circuit board in a region in which at least the substrate for the electro-optical device and the flexible circuit board overlap each other.
    Type: Grant
    Filed: September 17, 2007
    Date of Patent: September 22, 2009
    Assignee: Epson Imaging Devices Corporation
    Inventor: Tatsumi Okuda
  • Wired circuit board assembly sheet
    Patent number: 7592551
    Abstract: A wired circuit board assembly sheet having a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified wired circuit board.
    Type: Grant
    Filed: April 13, 2007
    Date of Patent: September 22, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Toshiki Naito, Tetsuya Ohsawa, Kouji Kataoka
  • Wiring board and a semiconductor device using the same
    Patent number: 7589282
    Abstract: A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.
    Type: Grant
    Filed: July 27, 2004
    Date of Patent: September 15, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroshi Yamada, Keiji Takaoka, Hideto Furuyama
  • Protecting casing for transducer
    Patent number: 7586749
    Abstract: A protecting casing for a transducer has an outer casing, an inner casing, a circuit board and a connector. The inner casing is detachably mounted in the outer casing and has a mounting hole and a cap detachably mounted on the inner casing to cover the mounting hole in a watertight manner. The circuit board is detachably mounted in the inner casing and has a surface, a circuit formed on the surface and a plug with terminals extends out of the inner casing. The connector is detachably mounted to the outer casing and is electrically connected between the circuit board and an external functional accessory component. Within such an arrangement to facilitate maintenance, assembly of the transducer, and effectively avoid intrusion of water, foreign object and the like.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: September 8, 2009
    Assignee: Finetek Co., Ltd.
    Inventor: Dick Wu
  • Portable electronic device with single printed circuit board
    Patent number: 7586753
    Abstract: A portable electronic device (100) includes an upper housing (40), a circuit board (10), a display (12), a battery (14), and a lower housing (20). The upper housing defines a display section (424) therein. The circuit board has a top surface (11) and a bottom surface (13) at an opposite side of the top surface. The display is seen outwardly through the display section. The battery and the display are formed adjacent to each other on the top surface of the circuit board. The circuit board, the battery and the display are placed in-between the lower housing and the upper housing. The upper housing is detachably mounted to the lower housing for detachably holding the battery.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: September 8, 2009
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Chi-Chung Lu
  • Transceiver cage assembly with grounding device
    Patent number: 7583510
    Abstract: A transceiver cage assembly includes a housing (10) and a grounding device (20). The housing includes at least one receiving space for receiving at least one transceiver module. The grounding device mounted on the housing includes a flat main member (200), and at least one resilient member (220) protruding from the main member. The grounding device provides electrical connection between the housing and bezels.
    Type: Grant
    Filed: September 1, 2006
    Date of Patent: September 1, 2009
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Wan-Cheng Wang
  • Transparent substrate provided with electroconductive strips
    Patent number: 7582833
    Abstract: The present invention relates to a method of manufacturing electrically conducting tracks on a transparent substrate, by screen printing with an electrically conducting paste, and to the transparent substrate provided with said tracks. According to the invention, conducting tracks are formed with a width less than or equal to 0.3 mm by applying, by screen printing, a thixotropic electrically conducting paste having a ratio of the viscosity without shear stress to the viscosity under shear stress under screen-printing conditions of at least 50 and having a silver content greater than 35% and of which at least 98% of the particles which form it have a size less than 25 ?m, by means of a screen having at least 90 threads per cm, the coating of said screen being provided with slots, the narrowest width of which is equal to 0.25 mm±0.05 mm, and by subjecting said tracks to baking.
    Type: Grant
    Filed: October 25, 2005
    Date of Patent: September 1, 2009
    Assignee: Saint-Gobain Glass France
    Inventors: Dieter Hahn, Josef Switalla, Rainer Kummutat, Andre Beyrle, Yannick Lebail
  • Portable terminal having sliding module
    Patent number: 7580267
    Abstract: A portable terminal includes a first housing, a second housing, and a sliding module. The second housing is slidably connected to the first housing such that the second housing slides longitudinally on the first housing to open or close a face of the first housing. The sliding module is interposed between the first housing and the second housing to slidably combine the second housing to the first housing. The sliding module includes a pair of guide rods and a guide plate. The guide rods are mounted spaced apart on the rear face of the second housing along a sliding direction of the second housing. The guide plate is fixed to a face of the first housing. The guide plate is slidably connected to the guide rods.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: August 25, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Yong-Kyu Kim