Abstract: A self-assembly process is disclosed for integrating free standing microcomponents onto a template having a plurality of binding sites, an interconnect network, and trapping structures disposed downstream of the binding sites. The self-assembly is accomplished by flowing a fluid medium containing the microcomponents over the template such that some of the microcomponents are trapped at binding sites. The template may be simultaneously (or subsequently) heated to melt a binder such as a solder spot at each of the binding sites, and then cooled to connect the trapped microcomponents to the interconnect network. In one embodiment, removable blocking elements are disposed upstream of some of the binding sites, for example formed from photoresist. After assembling a first set of microcomponents, the blocking elements are removed, and a second set of microcomponents in a fluid medium are flowed over the template for assembly into the newly unblocked binding sites.

Abstract: A method of producing standoffs in an injection molded solder (IMS) mold, which possesses cavities, each of which is filled with a solder paste using standard techniques, such as screening or IMS. This solder paste is heated to a reflow temperature at which the solder melts and forms a ball or sphere. Since solder pastes are known to reduce in volume due to the therein contained organic material burning off, the remaining solder ball will be significantly lower in volume than that of the cavity. A solder material having a lower melting point is then filled into the cavities about the solder balls. The mold and solder metal are then allowed to cool, resulting in the formation of a solid sphere of metal in the cavity surrounded by solder material of a lower melting point, which, upon transfer to a wafer, form the standoffs.

Abstract: A process and braze paste suitable for filling and closing voids in relatively thin wall sections of high temperature components, such as an impingement plate of a combustor of a gas turbine engine. The process entails applying at least a first braze paste to the crack to form a braze paste patch comprising powders of first and second alloys and an organic binder. The first alloy has a higher melting temperature than the second alloy, and the powders of the first and second alloys are present in the braze paste patch at a weight ratio of about 30:70 to about 70:30 weight percent. The braze paste patch is then heated to burn off the binder and melt at least the powder of the second alloy to form a brazement within the crack that contains particles of the first alloy dispersed in a matrix formed by the second alloy.

Abstract: A practical bonding technique is provided for solid-phase room-temperature bonding which does not require a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. Since an adhering substance layer is thin immediately after a surface activating treatment using an energy wave, a bonding interface is spread by crushing the adhering substance layer to perform bonding, so that a new surface appears on a bonding surface, and objects to be bonded are bonded together. In order to crush the adhering substance layer more easily, a bonding metal of a bonding portion of the object to be bonded needs to have a low hardness. According to the results of various experiments conducted by the present inventors, it was found that the hardness of the bonding portion which is a Vickers hardness of 200 Hv or less is particularly effective for room-temperature bonding.

Abstract: A method for producing hydrogen gas is provided and comprises reducing a metal oxide in a reduction reaction between a carbon-based fuel and a metal oxide to provide a reduced metal or metal oxide having a lower oxidation state, and oxidizing the reduced metal or metal oxide to produce hydrogen and a metal oxide having a higher oxidation state. The metal or metal oxide is provided in the form of a porous composite of a ceramic material containing the metal or metal oxide. The porous composite may comprise either a monolith, pellets, or particles.

Abstract: A die-casting die having a plurality of laterally movable slides is provided with a plurality of hydraulic cylinders located and carried internally within the die and connected with the plurality of slides to move the slides between cavity-open and cavity-closed positions.

Abstract: A composite body which can withstand high thermal stresses is formed by high-temperature soldering at least a part of a high-temperature-resistant, metallic or nonmetallic component and at least a part of a high-temperature-resistant, nonmetallic component. Prior to soldering, a metallic barrier layer, which is impervious to the solder melt, of one or more elements selected from the group consisting of V, Nb, Ta, Cr, Mo, W, Ti, Zr, Hf and alloys thereof, is deposited on that surface of each nonmetallic component which is to be soldered. Solder material, barrier layer and soldering conditions are adapted to one another in such a manner that during the soldering operation the metallic barrier layer remains at least partially in the solid state, so that after the soldering operation it is still present in a thickness of at least 10 ?m at least over the majority of the soldering surface.

Abstract: The invention provides a process for soldering in the vapor phase in which after the solder has melted onto the item to be soldered a vacuum is generated around the item to be soldered in the vapor phase. Also provided is a device for soldering in the vapor phase comprising a first chamber containing the vapor phase and, inside the first chamber within the vapor phase, a second chamber in which a vacuum can be generated and into which the item to be soldered can be introduced. A third chamber communicates with the first chamber to allow the item to be soldered to be transferred into the first chamber by means of a transporting system. The process and device according to the invention are advantageous in that they ensure soldered joints having a higher quality than those of the prior art.

Abstract: An ultrasonic welding apparatus having an extractable sonotrode. The sonotrode having a non-threaded outer peripheral surface and a tapered mating surface that meets with a correspondingly tapered aperture formed in the end of the reed of the ultrasonic welding apparatus. In the preferred embodiment the ultrasonic welding apparatus includes a sonotrode removal mechanism for extracting the sonotrode from the reed.

Abstract: A brazing product for fluxless brazing comprises a substrate and a filler metal-forming composition applied to the substrate. The substrate preferably comprises aluminum, an aluminum alloy or another metal and may include at least one layer of a ceramic, carbide or nitride. The filler metal-forming composition comprises a liquid-forming layer comprising silicon and a braze-promoting layer comprising one or more metals selected from the group comprising nickel, cobalt, palladium and iron. The liquid-forming layer comprises one or more material layers. Where the liquid-forming layer comprises a plurality of layers, it may include at least one layer consisting essentially of silicon.

Abstract: First components and second components in which bumps are formed on the lower surface thereof and laminate structures are formed by mounting them to stack with each other on a circuit board 13 are picked up from a component supply unit 1 using a placement head 16, and by lifting and lowering the placement head 16 holding the first components and the second components relative to a paste transfer device 5 supplying a flux 10 in the manner such as coating films having two types of different thicknesses, the flux 10 is supplied to the bumps of the plurality of components in a bundle using a transfer coating method. With such a configuration, it is possible to efficiently perform a component mounting with a satisfactory adhesiveness by ensuring an optimal amount of application quantity of a paste.

Abstract: An apparatus for performing thermowelding of, e.g., a battery module or the like. The surface of a heater of a thermowelding apparatus is subjected to surface treatment through coating of Teflon, fluoroplastics, or the like. Moreover, both side surfaces of the heater are folded. Surface treatment of the heater obviates thermowelding involving interposition of a Teflon tape, thereby improving a working efficiency. Folding both side surfaces of the heater prevents occurrence of warpage, which would otherwise arise during heating, whereby durability of the heater is also enhanced.

Abstract: A system, method, and device for applying conductive bonding material to a substrate are disclosed. The method includes providing conductive bonding material in a plurality of cavities of a mold. A total number of cavities in the plurality of cavities being greater than a total number of at least one conductive pad of a circuit supporting substrate corresponding to the mold. The conductive bonding material in the mold is heated to a reflow temperature of the conductive bonding material. At least one wettable surface is placed in substantial contact with the heated conductive bonding material in at least one cavity. The mold and the corresponding circuit supporting substrate are brought in close proximity to each other such that the heated conductive bonding material in at least one cavity comes in contact with at least one conductive pad of the corresponding circuit supporting substrate.

Abstract: Systems for coupling end portions of two elongated heater portions and methods of using such systems to treat a subsurface formation are described herein. A system may include a holding system configured to hold end portions of the two elongated heater portions so that the end portions are abutted together or located near each other; a shield for enclosing the end portions, and one or more inert gas inlets configured to provide at least one inert gas to flush the system with inert gas during welding of the end portions. The shield may be configured to inhibit oxidation during welding that joins the end portions together. The shield may include a hinged door that, when closed, is configured to at least partially isolate the interior of the shield from the atmosphere. The hinged door, when open, is configured to allow access to the interior of the shield.

Abstract: The invention relates to a device for the, (in particular continuous), oxidation of particulates from the exhaust gases of diesel motors. Said device consists of an open-pored body as a particle filter, on whose surface an oxidation catalyst is finely dispersed. The device is characterized in that from an exhaust gas temperature as low as 150° C., the catalyst causes the oxidation of particulates attached to the filter using the residual oxygen of the exhaust gas, thus keeping the filter body continuously free of particulates during almost all the operating conditions of the motor.

Abstract: The heating apparatus allows an outlet of a heating nozzle to get opposed to an electronic component during detachment of the electronic component from a printed wiring board. Hot air blown out of the outlet of the heating nozzle is utilized to heat the electronic component. Electrically-conductive terminals thus melt between the electronic component and the printed wiring board. An air discharge nozzle is located in the vicinity of the heating nozzle. The air discharge nozzle serve to generate airflow at a location distanced from the heating nozzle. The airflow serves to suppress rise in the temperature in the vicinity of the electronic component. Other electronic component in the vicinity of the electronic component is reliably prevented from rise in temperature. The other electronic component is thus prevented from destruction.

Abstract: A process for brazing components formed of superalloys that contain elements prone to oxidation during brazing. At least one braze tape is applied to at least one faying surface of at least a first of the components being joined by brazing. The braze tape comprises a braze tape alloy containing the base metal of the superalloys and a melting point suppressant, and is applied so as to substantially cover the faying surface. The braze tape is then bonded to the faying surface by heating the first component to a temperature not exceeding the brazing temperature required to join the components. Thereafter, the components are assembled so that the bonded braze tape are between the respective faying surfaces of the components. The components are then brazed together by applying and heating a braze alloy to the braze temperature.

Abstract: A mandrel that provides a counter-force to the pressure exerted on the outside of a pipe or other arcuate surface by a friction stir welding tool, wherein the mandrel is expandable through the use of a wedge, and wherein the mandrel enables multiple friction stir welding heads to simultaneously perform welding on the arcuate surface.

Abstract: A method for manufacturing a printed circuit board includes providing a board including a plurality of electrical traces, a first surface, and a second surface opposite the first surface. The method further includes providing at least one surface mount component having a plurality of electrical terminals. The method also includes applying an adhesive on the first surface of the board, and adhering the surface mounting component to the first surface. The method also includes wave soldering the surface mount component on the first surface to the board to encapsulate at least a portion of the electrical terminals of the surface mount component with a lead-free solder.

Abstract: A problem of FSW spot-welding is that a bonding strength tends to be low, since an area of metallic bonding is limited to the neighborhood of a pin portion of the welding tool. In order to solve the problem, after a tool (1) is inserted into a member (4) to be welded, a rotation shaft of the welding tool is tilted around a predetermined point (13) as a fulcrum, and the tip portion of the welding tool (1) is swung to enlarge a plastic flow area caused by rotation of the tool. As a result, the welding strength can be increased.