Abstract: In a method of applying a weld to a target surface, a guide rail arrangement is attached to the target, the guide rail arrangement including at least one guide rail. A weld head carriage having a carriage housing, a rail follower assembly, and a sonotrode is movably mounted to the guide rail arrangement so that the follower assembly engages each guide rail for movement there-along. The weld head carriage is positioned adjacent the target surface, feedstock material is deposited onto the target surface, and the sonotrode is extended to engage the deposited feedstock material and apply a welding force to the feedstock material and the target. Relative movement between the carriage and the guide rail arrangement is initiated and ultrasonic vibrations are conducted into the feedstock material and the target, thereby welding the feedstock material to the target surface.

Abstract: A solder alloy is provided which suppresses the change in a solder paste over time, decreases the temperature difference between the liquidus-line temperature and the solidus temperature, and exhibits a high reliability. The solder alloy has an alloy constitution composed of: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of 0 ppm by mass to 10000 ppm by mass of Bi and 0 ppm by mass to 5100 ppm by mass of Pb; more than 0 ppm by mass and no more than 3000 ppm by mass of Sb; and a remaining amount of Sn; and satisfies both the formula (1) and the formula (2). 300?3As+Sb+Bi+Pb??(1) 0.1?{(3As+Sb)/(Bi+Pb)}×100?200??(2) In the formula (1) and the formula (2), As, Sb, Bi, and Pb each represents an amount thereof (ppm by mass) in the alloy constitution.

Abstract: A method for repairing a part and the resulting is disclosed. The method includes positioning a plug having an inner braze element coupled thereto into a cavity defined by an internal surface of a component. The cavity has a circular cross-section at the external surface of the component. The plug completely fills the circular cross-section and the inner braze element is within the cavity. A braze paste is positioned at least partially around the plug at the external surface. The component is positioned such that the inner braze element is above the plug. The component is subjected to a thermal cycle to melt the inner braze element around the plug, completely sealing the cavity by forming a metallurgical bond with the plug and the internal surface of the component. During the thermal cycle the braze paste is melted to form a metallurgical bond with the plug and external surface.

Abstract: An apparatus for fabricating an internally finned pressure vessel includes a plurality of positioning discs, each of the positioning discs defining a plurality of circumferentially spaced slots extending radially into the positioning disc from a perimeter thereof, and one or more rods extending through the plurality of positioning discs, the plurality of positioning discs being held in axial alignment by the one or more rods. A method of fabricating the internally finned pressure vessel includes providing the apparatus, loading a plurality of fins into the slots of the positioning discs, inserting the apparatus containing the plurality of fins into a pressure vessel, attaching the plurality of fins to the pressure vessel by a brazing process, and removing the apparatus from the pressure vessel.

Abstract: Described herein are compositions for use in the brazing of metal substrates. Methods of making and using these compositions are also described herein.

Abstract: A mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate includes: a first mounting head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and a second mounting head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations. The second mounting head includes: a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body.

Abstract: Provided is a multimaterial joint material that contributes to multimaterialization and a reduction in weight of a transport apparatus, the multimaterial joint material being configured from: a flame-retardant magnesium alloy; and a metal or alloy selected from the group consisting of aluminum alloys, titanium alloys, stainless steel, and steel. This multimaterial joint material is such that two or more layers of different types of metal materials are joined, wherein the multimaterial joint material is characterized in that: of the two or more layers of metal materials, at least one layer comprises a flame-retardant magnesium alloy, and another layer comprises a metal or alloy selected from the group consisting of aluminum alloys, titanium alloys, stainless steel, and steel; and the two or more layers of metal materials are joined together across the entire surface of joining surfaces that overlap each other.

Abstract: A manufacturing method for manufacturing a cylinder tube includes a joining step of joining a tube main body and a head member by friction welding by abutting an end surface of the tube main body and a flange portion of the head member in a state in which a through hole of the tube main body and a projecting portion of the head member are fitted to each other so as to form a predetermined clearance. In the joining step, a non-contact portion of the flange portion of the head member facing the clearance is joined to the tube main body by heating the non-contact portion with friction heat generated by relative rotation between the tube main body and the head member.

Abstract: A method for producing an overlap composite material from sheet metal is described, wherein a first sheet of a first metal and a second sheet of a second metal, which has a lower strength than the first metal, are positioned one above another in an overlapping manner in an edge region, and are then joined by rolling. The first sheet has a wedge-shaped edge in cross-section. The second sheet is to be positioned with its edge on a side surface of the first sheet formed by the wedge-shaped edge. The side surface formed by the wedge-shaped edge of the first sheet has a greater width than the side surface of the edge of the second sheet positioned on the said side surface of the first sheet, and, after positioning, the sheets are joined by rolling.

Abstract: A method of attaching a first metal object to a second metal object is presented. The first metal object and the second metal object are dissimilar materials. The first metal object comprises an upper surface and a lower surface. The method comprises: positioning the first metal object in intimate contact with the second metal object such that the second metal object is in contact with the lower surface of the first metal object; identifying at least one attachment location on the upper surface of the first metal object where the first metal object is in intimate contact with the second metal object; adding a powdered metal on the upper surface of the first metal object at the at least one attachment location; and firing a heat source at the powdered metal to melt the powdered metal and drive the melted powdered metal through the first metal object and into the second metal object.

Abstract: A mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate includes: a first mounting head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and a second mounting head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations. The second mounting head includes: a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body.

Abstract: The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber (74) sealed off from its surroundings by heating and melting solder material (16) which is arranged between the components (12A, 12B) to be connected. It is proposed that the components (12A, 12B) to be connected are provisionally connected with a bonding material (18) to form a solder group (10) in which the components (12A, 12B) are fixed relative to one another in a joining position.

Abstract: A method includes applying a first flux onto an electrode provided on a substrate and placing a solder material on the electrode, heating the substrate to form a solder bump on the electrode, deforming the solder bump to provide a flat surface or a depressed portion on the solder bump, applying a second flux to the solder bump; placing a core material on the solder bump, the core material including a core portion and a solder layer that covers a surface of the core portion, and heating the substrate to join the core material to the electrode by the solder bump and the solder layer.

Abstract: According to an embodiment, a temperature of an inside of a furnace is set to fall within a range of a reduction temperature or more of a carboxylic acid and less than a melting temperature of a solder bump, and the inside is concurrently set to have a first carboxylic acid gas concentration. Thereafter, the temperature of the inside is raised up to the melting temperature, and the inside is concurrently set to have a second carboxylic acid gas concentration. The second carboxylic acid gas concentration is lower than the first carboxylic acid gas concentration, and is a concentration containing a minimum amount of carboxylic acid gas defined to achieve reduction on an oxide film of the solder bump. The inside has the second carboxylic acid gas concentration at least at a time when the temperature of the inside reaches the melting temperature.

Abstract: A method of friction stir processing (FSP) includes contacting a first workpiece with a FSP tool, where the first workpiece is a low-melting temperature metal or alloy and the FSP tool is a single-body FSP tool having a diamond working surface. The method also includes rotating the FSP tool in contact with the first workpiece at an interface and generating thermal energy at the interface to heat the first workpiece. The method further includes conducting thermal energy away from the interface with the FSP tool, and friction stirring the first workpiece at a temperature of the FSP tool below 800° C.

Abstract: Provided is a method for manufacturing an energy storage device. In the method of manufacturing an energy storage device, a lid assembly is formed by integrating a lid plate covering an opening of a case which houses a plate, an external terminal exposed to outside of the lid plate, and a conductive plate portion disposed inside the lid plate in an overlapping manner. The lid assembly is disposed between a vibrating jig and a receiving jig, a tab of the plate is disposed between the conductive plate portion and the vibrating jig, and ultrasonic welding is applied to the tab and the conductive plate portion.

Abstract: A component mounting line control system controls a component mounting line. The component mounting line control system includes an acquirer, a first detector, a second detector, and a controller. The acquirer acquires set-up changing data. The first detector is provided on the upstream side of the reflow device and detects the board. The second detector is provided on the downstream side of the reflow device and detects the board. The controller changes a reflow condition based on the set-up changing data and the result of detection performed by the first detector and the second detector after the acquirer acquires the set-up changing data.

Abstract: A method for producing a joined structure according to the present invention includes: a reflow step of heating a first member and a solder material while keeping them in contact with each other in a reflow chamber to melt a solder alloy constituting the solder material, the reflow step including: a first reflow step of melting the solder alloy with an atmosphere in the reflow chamber reduced to a first pressure P1 lower than the atmospheric pressure; and a second reflow step of, after the first reflow step, melting the solder alloy with the atmosphere in the reflow chamber reduced to a second pressure P2 lower than the first pressure P1.

Abstract: The present application provides a reflow oven (100) and a gas recovery method. The reflow oven (100) comprises a reflow oven hearth (101), a separator (105), the separator inlet (110) being connected to the gas outlet (102) of the reflow oven hearth (101) so that the gases in the reflow oven hearth (101) can flow into the separator (105), a zeolite box (107), the zeolite box inlet (112) being connected to the separator outlet (111), and the zeolite box outlet (113) being connected to the gas inlet (103) of the reflow oven hearth (101) so that the gases flowing through the separator (105) can enter the zeolite box (107) and the gases flowing through the zeolite box (107) can flow out of the zeolite box outlet (113), a sensor (106), which is provided in the gas passage between said zeolite box outlet (113) and the gas inlet (103) of the reflow oven hearth (101). The reflow oven (100) in the present application enables the gases flowing through the separator (105) to enter the zeolite box (107).

Abstract: The present disclosure relates to a full-automatic deep access ball bonding head device includes: a Z-axis base; a Z-axis sliding stage, which is connected to the Z-axis base in a sliding manner along Z-axis; an EFO mechanism; and a bonding mechanism, which is fixed on the Z-axis sliding stage. The EFO mechanism includes an EFO sliding block, an EFO wand, and a compressed spring. The EFO sliding block is located on the side of the Z-axis sliding stage and connected to the Z-axis base in a sliding manner. The compressed spring is connected between the upper end of the Z-axis sliding stage and the upper end of the EFO sliding block, and the EFO wand is connected to the lower end of the EFO sliding block.