Patents Examined by Douglas Burtner
  • Patent number: 10162205
    Abstract: Provided is a display device capable of reducing a bezel space. The display device includes: a display panel; a lower chassis receiving the display panel; and a metal line fixed to one edge of the display panel and the lower chassis.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: December 25, 2018
    Assignee: Samsung Display Co., Ltd.
    Inventors: Chung Hui Lee, Seung-Won Kuk, Jee Su Park
  • Patent number: 10165693
    Abstract: The present invention relates to an attachment device for micro devices, comprising a main body and an attachment member seat in connection with the main body. The main body provides a receiving space to accommodate a functional module element. The attachment member seat provides a cavity to accommodate at least one attachment member to attach the attachment device to an article. A wearable micro device comprising the functional module element and the attachment device is also disclosed.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: December 25, 2018
    Inventors: Min-Chih Hsuan, Yu-Han Huang
  • Patent number: 10154601
    Abstract: Various embodiments of a modular electromechanical device are described herein. The modular electromechanical device includes a chassis and a plurality of functional modules that can be connected to the chassis. Each module is associated with a different functionality. The functionality of the modular electromechanical device is defined based on various attributes including the functionality of the different functional modules that are connected to the electromechanical device, the sequence in which the different functional modules are connected to the electromechanical device, the specific attachment structures used to attach the functional modules to the electromechanical device, or a pattern of traces formed within the chassis.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: December 11, 2018
    Assignee: Facebook, Inc.
    Inventors: Baback Elmieh, Alexandre Jais, Rex Wenters Crossen, Andrew Alexander Robberts
  • Patent number: 10149402
    Abstract: An IO subsystem, for use with an IT computing device, includes a cage assembly configured to releasably engage a chassis of the IT computing device and to receive a plurality of IO adapter cards. A midplane adapter assembly, positioned within the cage assembly, includes a first electrical connector system configured to engage a generic connector system included within the IT computing device and a second electrical connector system configured to engage the plurality of IO adapter cards. A coupling system is configured to releasably couple the cage assembly to the chassis of the IT computing device.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: December 4, 2018
    Assignee: EMC IP Holding Company LLC
    Inventors: Daniel Dufresne, James L. Pringle, Jr.
  • Patent number: 10139926
    Abstract: A peripheral device for a computing device comprises a body configured for insertion into a storage cavity in the computing device, a first magnet, and a second magnet. The first magnet is disposed within the body proximate a first external surface of the body and having a first pole of a first polarity and a second pole of a second polarity, wherein the first pole is oriented toward the first external surface. The second magnet is disposed within the body between a second external surface and the first magnet and having a first pole of the first polarity and a second pole of the second polarity, wherein the first pole of the second magnet is oriented toward the second external surface.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: November 27, 2018
    Assignee: NVIDIA CORPORATION
    Inventors: Sergey Murauyou, Nelson Au, Glenn Wernig, Don Miller, Mark Johnson, Tommy Lee
  • Patent number: 10120424
    Abstract: Microelectronic device assembly including a component attached to substrate by at least a screw. The screw applies compressive force against a pad of a thermally and electrically conductive material having sufficiently low modulus to mitigate stress in addition to providing a thermal and electrical path between the component and the substrate. In some embodiments, the screw affixes a printed circuit board hosting one or more integrated circuit components to a motherboard, or passive heat sink. The pad may be deformed to assuage stress applied through the screw during assembly of the device and/or as the device experiences thermal cycling, for example associated with intermittent operation.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: November 6, 2018
    Assignee: Intel Corporation
    Inventor: Hyoung Il Kim
  • Patent number: 10109256
    Abstract: A driver IC has a rectangular shape, and includes a first input terminal group in which first input terminals are disposed at intervals along a first long side, that is opposite a side that faces a display section, from a first short side. A second input terminal group is provided in which second input terminals are disposed at intervals along a second long side that faces the display section, from the first short side. An output terminal group is provided in which output terminals that output signals to the display section are disposed at intervals along the second long side from a position, which is spaced apart for a predetermined distance from where the second input terminals are disposed, to a second short side. A terminal group is not provided at positions that oppose the output terminal group at the first long side.
    Type: Grant
    Filed: October 5, 2015
    Date of Patent: October 23, 2018
    Assignee: LAPIS Semiconductor Co., Ltd.
    Inventors: Takashi Ohno, Takahiro Imayoshi, Masakuni Kawagoe
  • Patent number: 10101584
    Abstract: A head up display unit can be provided in an inner portion of an instrument panel. A column bracket for mounting a steering column is at a lower portion of a vehicle body strength member and extends in a vehicle width direction in a vehicle rear side of a front wall panel of a vehicle interior. The head up display unit is mounted on the column bracket so as to be movable to a vehicle upward direction by an emergency input load from a vehicle front direction.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: October 16, 2018
    Assignee: CALSONIC KANSEI CORPORATION
    Inventor: Takeshi Satou
  • Patent number: 10091902
    Abstract: An electrical module is configured to be coupled to a tray of a battery distribution assembly. The electrical module includes a housing disposed along an outer surface of the tray. The electrical module also includes at least one electrical circuit device disposed within a cavity of the housing. The electrical module further includes multiple terminals electrically connected to the at least one electrical circuit device. The terminals project outward from the housing and extend through corresponding apertures in the tray for electrically connecting to one or more electrical conductors disposed along an inner surface of the tray.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: October 2, 2018
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Zachary Wood Lyon, Thomas Wojtacki, Jeremy Christin Patterson
  • Patent number: 10080290
    Abstract: An embedded electronic package includes a stretchable body that includes at least one electronic component, wherein each electronic component includes a back side that is exposed from the stretchable body; and a plurality of meandering conductors that are electrically connected to one or more of the electronic components. In some forms, the embedded electronic package includes a stretchable body that includes an upper surface and a lower surface, wherein the stretchable body includes at least one electronic component, wherein each electronic component is fully embedded in the stretchable body and the same distance from the upper surface of the stretchable body; and a plurality of meandering conductors that are electrically connected to one or more of the electronic components.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: September 18, 2018
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Srinivas Pietambaram, Rahul N. Manepalli
  • Patent number: 10070550
    Abstract: A fixing device for a circuit board and an electronic apparatus including the fixing device, related to the display field, and can be applied for the fixation of circuit boards with different sizes and structures onto a component to be fixed. The fixing device for a circuit board includes: a holding portion, used to hold a circuit board and including a containing space and a top portion including an opening allowing the circuit board to pass through the opening and to be inserted in the containing space; and a fixing portion, connected with the bottom portion of the holding portion and configured to fix on the display device. Also, an electronic apparatus including at least one fixing device for a circuit board is disclosed.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: September 4, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., K-TRONICS (SUZHOU) TECHNOLOGY CO., LTD.
    Inventors: Xiaolai Li, Zesen Fu
  • Patent number: 10060572
    Abstract: A portable device support system including a disc-shaped central hub having a mounting slot, two pairs of crossing support arms having a corner support tab for releasably securing a mobile device, and a supporting attachment with mounting insert configured to connect with the central hub. The crossing support arms are configured to expand outwardly in order to securely grasp edges of a mobile device and hold it in a desired position. The supporting attachment may feature a securing mechanism at its base, further making the system useful for holding a mobile device securely in position across a variety of locations and working environments.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: August 28, 2018
    Inventor: Joan Don
  • Patent number: 10061359
    Abstract: A hinge assembly for a multi-part electronic device comprises a pair of opposing living hinge elements for connecting first and second parts of the multi-part electronic device. Each hinge element has a first segment, an intermediate segment and a second segment, and comprises a first hinged joint positioned at a junction of the first segment and the intermediate segment and defining a first hinge axis, and a second hinged joint positioned at a junction of the second segment and the intermediate segment and defining a second hinge axis. The second hinged joint is spaced apart from the first hinged joint by a length of the intermediate segment. Each of the first and second hinged joints is configured to permit 180 degrees of rotation. A multi-part electronic device having a double-acting hinge arrangement is also described.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: August 28, 2018
    Assignee: Microsoft Technology Licensing, LLC
    Inventor: Esa-Sakari Määttä
  • Patent number: 10042389
    Abstract: The present disclosure provides a carrying structure for carrying electronic device. The carrying structure comprises a carrying base, a start-up member, a linkage module, a latch member, a first buckle member, and a releasing member. When an electronic device is disposed to the carrying base, the electronic device drives the start-up member, which drives the latch member via the linkage module so that the latch member can fix the electronic device to the carrying base. To disassemble the electronic device from the carrying base, press the releasing member, which pushes the first buckle member and makes the latch member depart from the first buckle member and restore to the original position. Consequently, the start-up member and the linkage module can restore to the original positions. Thereby, the effects of rapid assembling and disassembling can be achieved.
    Type: Grant
    Filed: April 17, 2014
    Date of Patent: August 7, 2018
    Assignee: Wistron Corporation
    Inventors: Shin-Yi Hsieh, Ping-Sheng Yeh, Chia-Sheng Lin, Ko-Hsien Lee, Cheng-Tang Chang
  • Patent number: 10045449
    Abstract: A facial-interface system for a head-mounted display may include (1) a facial interface having a positioning abutment surface and (2) a facial-interface adjustment apparatus. The facial-interface adjustment apparatus may include a positioning member that is rotatable about a pivot, the positioning member comprising an extending surface and a contracting surface. The facial-interface adjustment apparatus may also include an actuation member that that is movable to rotate the positioning member about the pivot between (1) an extended holding position in which the extending surface of the positioning member faces and abuts the positioning abutment surface of the facial interface, and (2) a contracted holding position in which the contracting surface of the positioning member faces and abuts the positioning abutment surface of the facial interface. Various other systems, devices, and methods are also disclosed.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: August 7, 2018
    Assignee: Oculus VR, LLC
    Inventor: Phillip Yee
  • Patent number: 10025355
    Abstract: In embodiments of a flexible display extendable assembly, an extendable assembly includes a slideable display guide integrated in a first housing part of an extendable electronic device. The extendable electronic device includes a flexible display that slide-engages into the first housing part of the extendable electronic device. The extendable assembly includes an extendable mechanism that is coupled in a second housing part of the extendable electronic device and to the slideable display guide. The first and second housing parts of the extendable electronic device slide-engage relative to each other. The extendable mechanism is implemented to extend as the first and second housing parts slide apart relative to each other, and also to retract as the first and second housing parts slide together relative to each other.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: July 17, 2018
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: David D. Bohn, Paul M. O'Brien
  • Patent number: 10016039
    Abstract: A protective cover for an electronic device includes a first hardshell member, a second hardshell member, and a flexible hinge member. The first hardshell member removably attaches to a first portion of the electronic device to protect the first portion of the electronic device. The second hardshell member removably attaches to a second portion of the electronic device to protect the second portion of the electronic device. The flexible hinge member includes a flexible material and is attached to the first hardshell member and the second hardshell member such that the flexible hinge member aligns with a hinge of the electronic device. The flexible hinge member flexes to allow the second portion of the electronic device to remain articulable relative to the first portion of the electronic device when the protective cover is on the electronic device.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: July 10, 2018
    Assignee: Otter Products, LLC
    Inventors: Jamie L. Johnson, Stephen Willes, W. Travis Smith, Jonathan Watt
  • Patent number: 10019043
    Abstract: Embodiments disclosed herein generally relate to a hard disk drive system with improved isolation from operational vibration. More particularly, embodiments disclosed herein provide a hard disk drive system with a vibration isolation frame and flexible connection without deviation from standard form factor. The standard form factor is the form factor of the hard disk drive with the base plate, but without the isolation frame. The hard disk drive with the isolation frame has the same form factor as the hard disk drive without the isolation frame, but with the base plate. Examples of form factors that may be utilized include the form factors for 3.5 inch and 2.5 inch hard disk drives. It is to be understood that 3.5 inch and 2.5 inch form factors are simply examples. Other size form factors are contemplated as well.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: July 10, 2018
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Takehiko Eguchi, Kenji Tomida, Toshihisa Okazaki
  • Patent number: 10019028
    Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises one or more rotatable latches, the one or more rotatable latches each including a respective screw mechanism housed within the one or more rotatable latches. The apparatus further comprises one or more spring assemblies, the one or more spring assemblies each including a respective thread assembly housed within the one or more spring assemblies. The respective thread assemblies comprise threading that is capable of receiving a corresponding screw mechanism of the one or more rotatable latches.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: July 10, 2018
    Assignee: International Business Machines Corporation
    Inventors: John J. Loparco, David C. Olson, Michael T. Peets, John G. Torok, Wade H. White, Mitchell L. Zapotoski
  • Patent number: 10015916
    Abstract: An apparatus relating generally to an interposer is disclosed. In such an apparatus, the interposer has a plurality of conductors for coupling an integrated circuit die to the interposer to provide a stacked die. The interposer includes a pad coupled to a conductive network of the interposer to dissipate electrostatic charge from the interposer.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: July 3, 2018
    Assignee: XILINX, INC.
    Inventor: James Karp