Abstract: A semiconductor device of the present invention includes a semiconductor substrate, a p-type impurity diffused region formed in the semiconductor substrate, and a polycide interconnection electrically connected to the p-type impurity diffused region. In the semiconductor device, the polycide interconnection includes a first polysilicon film, a refractory metal silicide film formed on the first polysilicon film, and a second polysilicon film formed on the refractory metal silicide film.
Type:
Grant
Filed:
December 11, 1992
Date of Patent:
August 23, 1994
Assignee:
Matsushita Electric Industrial Co., Ltd.