Patents Examined by Elizabeth Collister
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Patent number: 11833002Abstract: The present invention relates to a block (1) for the CAD/CAM machining of a dental prosthetic element: an insert (2) wherein the dental prosthetic element is intended to be machined, a polymeric layer (5) covering at least one surface of the insert, a mandrel (6) fixed to the insert (2), characterised in that the insert (2) comprises two parts (3, 4) connected to one another, of which: a first part (3) intended to be machined to form an inlay-core, said first part comprising a composite material comprising one-directional reinforcing fibres, a second part (4) intended to be machined to form a crown, said second part having no reinforcing fibres and comprising a material comprising one or more mineral fillers.Type: GrantFiled: September 14, 2021Date of Patent: December 5, 2023Assignee: SOCIETE DE RECHERCHES TECHNIQUES DENTAIRESInventor: Manh-Quynh Chu
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Patent number: 11826952Abstract: Multi-body interpenetrating lattices comprise two or more lattices that interlace or interpenetrate through the same volume without any direct physical connection to each other, wherein energy transfer is controlled by surface interactions. As a result, multifunctional or composite-like responses can be achieved by additive manufacturing of the interpenetrating lattices, even with only a single print material, with programmable interface-dominated properties. As a result, the interpenetrating lattices can have unique mechanical properties, including improved toughness, multi-stable/negative stiffness, and electromechanical coupling.Type: GrantFiled: March 1, 2021Date of Patent: November 28, 2023Assignee: National Technology & Engineering Solutions of Sandia, LLCInventors: Brad Boyce, Benjamin C. White, Anthony Garland, Ryan Alberdi
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Patent number: 11826822Abstract: In various embodiments, three-dimensional layered metallic parts are substantially free of gaps between successive layers, are substantially free of cracks, and have densities no less than 97% of the theoretical density of the metallic material.Type: GrantFiled: August 25, 2022Date of Patent: November 28, 2023Assignee: H.C. Starck Solutions Coldwater LLCInventor: Michael Thomas Stawovy
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Patent number: 11827986Abstract: In some examples, an article may include a substrate and a coating system on the substrate. The coating system may include a layer comprising a plurality of voids, wherein respective voids of the plurality of voids define respective void volumes; and a nucleating agent within at least some of the respective void volumes of the layer, wherein the nucleating agent is configured to induce crystallization of the molten CMAS. The coating system may include an environmental barrier coating, thermal barrier coating, and/or abradable coating.Type: GrantFiled: March 15, 2019Date of Patent: November 28, 2023Assignees: Rolls-Royce Corporation, Rolls-Royce North American Technologies, Inc., Rolls-Royce plcInventors: Sean E. Landwehr, Ngunjoh Lawrence Ndamka, Matthew R. Gold, Michael Cybulsky, Li Li, Robert Golden
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Patent number: 11827996Abstract: A Ni diffusion-plated steel sheet of the present invention includes a base steel sheet and a Fe—Ni diffusion alloy-plating layer positioned on at least one surface of the base steel sheet, a Ni coating weight of the Fe—Ni diffusion alloy-plating layer is 9.0 to 35 g/m2, a Fe concentration Cs of an outermost layer of the Fe—Ni diffusion alloy-plating layer is 10 to 55 mass %, the base steel sheet has a predetermined chemical composition, and a ferrite grain size number specified by JIS G 0551 (2013) of the base steel sheet is 10.0 or more.Type: GrantFiled: April 12, 2019Date of Patent: November 28, 2023Assignee: NIPPON STEEL CORPORATIONInventors: Takehiro Takahashi, Kiyokazu Ishizuka, Yasuto Goto
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Patent number: 11823891Abstract: A backside metallized compound semiconductor device includes a compound semiconductor wafer and a metal layered structure. The compound semiconductor wafer includes a substrate having opposite front and back surfaces, and a ground pad structure formed on the front surface. The substrate is formed with a via extending from the back surface to the front surface to expose a side wall of the substrate and a portion of the ground pad structure. The metal layered structure is disposed on the back surface, and covers the side wall and the portion of the ground pad structure. The metal layered structure includes an adhesion layer, a seed layer, a gold layer, and an electroplated copper layer that are formed on the back surface in such order. The method for manufacturing the backside metallized compound semiconductor device is also disclosed.Type: GrantFiled: October 28, 2020Date of Patent: November 21, 2023Assignee: XIAMEN SANAN INTEGRATED CIRCUIT CO., LTD.Inventors: Tsung-Te Chiu, Kechuang Lin, Houng-Chi Wei, Chia-Chu Kuo, Bing-Han Chuang
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Patent number: 11806655Abstract: A honeycomb filter includes a pillar-shaped honeycomb structure body having a porous partition wall disposed to surround a plurality of cells and a plugging portion, wherein the partition wall defining inflow cells includes partition wall parts making up sides of polygon that is sectional shape of each cell, the partition wall parts each having a surface that is a face defining the inflow cell, the partition wall part is either a first partition wall part loaded with the exhaust-gas purifying catalyst on the surface so that a percentage of the area loaded therewith exceeds 10%, or a second partition wall part loaded with the exhaust-gas purifying catalyst so that a percentage of the area loaded therewith is 10% or less, and the partition wall is configured to include one or more the first partition wall parts and one or more the second partition wall parts as the partition wall parts.Type: GrantFiled: January 25, 2021Date of Patent: November 7, 2023Assignee: NGK INSULATORS, LTD.Inventor: Kazuya Yuki
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Patent number: 11802093Abstract: An article includes a ceramic-based substrate and a barrier layer on the ceramic-based substrate. The barrier layer includes a matrix of barium-magnesium alumino-silicate or SiO2, a dispersion of silicon oxycarbide particles in the matrix, and a dispersion of particles, of the other of barium-magnesium alumino-silicate or SiO2, in the matrix.Type: GrantFiled: August 26, 2019Date of Patent: October 31, 2023Assignee: RTX CORPORATIONInventors: Xia Tang, Paul Sheedy, Tania Bhatia Kashyap, Wayde R. Schmidt, Daniel G. Goberman
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Patent number: 11798707Abstract: Provided are copper microparticles which have exceptional oxidation resistance, in which oxidation is reduced even when the copper microparticles are held at a firing temperature in an oxygen-containing atmosphere, and in which sintering also occurs. The copper microparticles have a particle diameter of 10-100 nm, have a surface coating material, and are such that, after the copper microparticles are held for one hour at a temperature of 400° C. in an oxygen-containing atmosphere, the particle diameter exceeds 100 nm while a copper state is retained.Type: GrantFiled: January 10, 2019Date of Patent: October 24, 2023Assignee: NISSHIN ENGINEERING INC.Inventors: Shu Watanabe, Shiori Sueyasu, Keitaroh Nakamura
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Patent number: 11786856Abstract: A honeycomb filter includes a pillar-shaped honeycomb structure body having a porous partition wall disposed to surround a plurality of cells and a plugging portion. The partition wall defining outflow cells includes an exhaust-gas purifying catalyst at least at a part of a region of 0 to 80% of a thickness of the partition wall and includes a portion that does not include the exhaust-gas purifying catalyst in a region of exceeding 80% and being 100% or less of the thickness of the partition wall, and the partition wall defining the inflow cells is not loaded with the exhaust-gas purifying catalyst on the surface, or is loaded with the exhaust-gas purifying catalyst so that a percentage of a ratio of an area of a range loaded with the exhaust-gas purifying catalyst to a surface area of the partition wall defining the inflow cells is 10% or less.Type: GrantFiled: January 20, 2021Date of Patent: October 17, 2023Assignee: NGK INSULATORS, LTD.Inventor: Kazuya Yuki
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Patent number: 11781236Abstract: [Problem] An object is to provide novel composite copper foils. [Means to solve the problem] A composite copper foil comprises a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein at least a part of the composite copper foil has protrusions on a surface thereof, and each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil.Type: GrantFiled: November 9, 2018Date of Patent: October 10, 2023Assignee: NAMICS CORPORATIONInventors: Makiko Sato, Osamu Suzuki, Naoki Obata, Yoshinobu Kokaji
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Patent number: 11772344Abstract: A panel (20) having opposite surfaces (22, 24), and including sheets (42, 43) and elongated cores or voids (40). The cores/voids extend parallel along a first direction (X), are arranged mutually adjacent in a second direction (Y), and include an outermost core/void (40a) along a panel edge (26). Each sheet includes a medial portion (44, 45) between two adjacent cores/voids, a first lateral portion (46, 47) folded away from the medial portion over one adjacent core/void, and towards the second direction along the first surface, and a second lateral portion (48, 49) folded away from the medial portion over another adjacent core/void, and towards a negative second direction (?Y) along the second surface. The sheets include an enveloping sheet (43), the first lateral portion (47) thereof extending into a folded lateral region (50, 52) that at the panel edge is folded around the outermost core/void, and extends in the negative second direction back towards the second surface.Type: GrantFiled: December 16, 2019Date of Patent: October 3, 2023Assignee: FiberCore IP B.V.Inventor: Johannes Hendricus Alphonsus Peeters
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Patent number: 11760887Abstract: The titanium material includes a titanium oxide layer formed on a surface of titanium being a base material, the titanium oxide layer having a thickness measured by a glow discharge spectrometry of 60 to 300 nm, wherein: the titanium oxide layer contains 0.5 to 7.0 at % of nitrogen, and an arithmetic mean roughness Ra of a surface thereof is 2.0 to 4.0 ?m; and a power spectrum of a surface roughness of the titanium material has a peak of an amplitude height of 0.005 to 0.020 ?m in a range of a wavelength of 1.1 to 2.5 ?m and has a peak of an amplitude height of 0.0010 to 0.0030 ?m in a range of a wavelength of 0.80 to 0.98 ?m. An L*a*b* color space may be L*: 30 to 40, a*: 2.0 to 9.0, and b*: ?7.0 to 18.0.Type: GrantFiled: June 18, 2018Date of Patent: September 19, 2023Assignee: NIPPON STEEL CORPORATIONInventors: Michio Kaneko, Kiyonori Tokuno, Takao Wada, Mitsuyuki Hasegawa, Kazuo Yamagishi, Mitsuru Nakayama
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Patent number: 11761064Abstract: A refractory metal alloy includes at least three metal components. At least one of the metal components is a refractory metal selected from the group of Mo, Nb, W, Ti, V, Cr, Mn, Y, Zr, Hf, Ta, Fe, Co, Al, Mn. The refractory metal alloy also includes two nonmetal components. The refractory metal alloy comprises non-trace amounts of each of the metal components and each of the nonmetal components. A component is also disclosed.Type: GrantFiled: December 18, 2020Date of Patent: September 19, 2023Assignee: RTX CORPORATIONInventors: Richard Wesley Jackson, John A. Sharon, Ryan M. Deacon
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Patent number: 11745384Abstract: A thin-walled honeycomb body (100) having a plurality of repeating cell structures (110) formed of intersecting porous thick walls (112V, 112H) and thin walls (114V, 114H). Each repeating cell structure (110) is bounded on its periphery by the thick walls (112V, 122H) of a first transverse thickness (Tk) and the thin walls (114V, 114H) have a second transverse thickness (Tt) that subdivides each repeating cell structure (110) into between 7 and 36 individual cells (108). In the thin-walled honeycomb body (100), the first transverse thickness (Tk) of the thick walls (112V, 112H) is less than or equal to 0.127 mm (0.005 inch) and the second transverse thickness (Tt) of the thin walls (114V, 114H) is less than or equal to 0.0635 mm (0.0025 inch), and Tk>Tt. Honeycomb extrusion dies and methods of manufacturing the thin-walled honeycomb body (100) having thick walls (112V, 112H) and thin walls (114V, 114H) are provided.Type: GrantFiled: December 16, 2018Date of Patent: September 5, 2023Assignee: Corning, IncorporatedInventors: Ravindra Kumar Akarapu, Amit Halder, Priyank Paras Jain, Weidong Li
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Patent number: 11746061Abstract: A coated ceramic honeycomb body comprising a honeycomb structure comprising a matrix of intersecting porous walls forming a plurality of axially-extending channels, at least some of the plurality of axially-extending channels being plugged to form inlet channels and outlet channels, wherein a total surface area of the outlet channels is greater than a total surface area of the inlet channels, and wherein a catalyst is preferentially located within the outlet channels, and preferentially disposed on non-filtration walls of the outlet channels. Methods and apparatus configured to preferentially apply a catalyst-containing slurry to the outlet channels and non-filtration walls are provided, as are other aspects.Type: GrantFiled: May 3, 2019Date of Patent: September 5, 2023Assignee: Corning IncorporatedInventors: Douglas Munroe Beall, Achim Karl-Erich Heibel, Konstantin Vladimirovich Khodosevich, Kenneth Richard Miller, Hrushikesh Govindrao Pimpalgaonkar, Kunal Upendra Sakekar, Min Shen, Todd Parrish St Clair
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Patent number: 11739419Abstract: Improved thin film coatings, cutting tool materials and processes for cutting tool applications are disclosed. A boron-doped graded diamond thin film for forming a highly adhesive surface coating on a cemented carbide (WC—Co) cutting tool material is provided. The thin film is fabricated in a HFCVD reactor. It is made of a bottom layer of BMCD in contact with a surface layer of the cemented carbide, a top layer made of NCD and a transition layer with a decreasing concentration gradient of boron obtained by changing the reaction conditions through ramp up option in hot filament CVD reactor. The top layer has a low friction coefficient. The bottom layer in the coating substrate interface has better interfacial adhesion through cobalt and boron reactivity and decreased cobalt diffusivity in the diamond. The transition layer has minimized lattice mismatch and sharp stress concentration between the top and bottom layers.Type: GrantFiled: April 26, 2018Date of Patent: August 29, 2023Assignee: INDIAN INSTITUTE OF TECHNOLOGY MADRAS (IIT MADRAS)Inventors: Kannan Ramasubramaniyan, Narayanan Arunachalam, Ramachandra Rao
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Patent number: 11739670Abstract: A ceramic honeycomb structure having a web structure including a plurality of intersecting channel walls forming channels. The ceramic honeycomb structure has a total porosity greater than or equal to about 55%, an average channel wall thickness less than or equal to about 150 ?m, a median pore diameter greater than or equal to about 10 ?m, a df less than or equal to about 0.45, where df=(d50?d10)/d50, and a strength (MOR/CFA) greater than or equal to about 900 psi. A method of manufacturing a ceramic honeycomb structure by mixing a ceramic precursor batch composition having a median particle diameter less than or equal to about 10 ?m and at least one starch-based pore former having a median particle diameter greater than or equal to about 10 ?m. The method also includes forming a mixture of ceramic precursor batch composition and a starch-based pore former into a green ceramic structure having a web structure, and firing the green ceramic structure to yield a ceramic honeycomb structure.Type: GrantFiled: March 17, 2017Date of Patent: August 29, 2023Assignee: Corning IncorporatedInventors: Douglas Munroe Beall, Achim Karl-Erich Heibel, David John Thompson
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Patent number: 11739410Abstract: High temperature stable thermal barrier coatings useful for substrates that form component parts of engines such as a component from a gas turbine engine exposed to high temperatures are provided. The thermal barrier coatings include a multiphase composite and/or a multilayer coating comprised of two or more phases with at least one phase providing a low thermal conductivity and at least one phase providing mechanical and erosion durability. Such low thermal conductivity phase can include a rare earth zirconate and such mechanical durability phase can include a rare earth a rare earth aluminate. The different phases are thermochemically compatible even at high temperatures above about 1200° C.Type: GrantFiled: June 15, 2017Date of Patent: August 29, 2023Assignee: THE PENN STATE RESEARCH FOUNDATIONInventors: Douglas E. Wolfe, Michael P. Schmitt
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Patent number: 11732343Abstract: Disclosed is a part comprising a metal substrate, a non-hydrogenated amorphous ta-C or aC carbon coating that coats the substrate, and an undercoat which is based on chromium (Cr), carbon (C) and silicon (Si) and is disposed between the metal substrate and the amorphous carbon coating and to which the amorphous carbon coating is applied, characterized in that the undercoat included, at its interface with the amorphous carbon coating, a ratio of silicon in atomic percent to chromium in atomic percent (Si/Cr) of 0.3 to 0.60, and a ratio of carbon in atomic percent to silicon in atomic percent (C/Si) of 2.5 to 3.5.Type: GrantFiled: June 17, 2019Date of Patent: August 22, 2023Assignee: HYDROMECANIQUE ET FROTTEMENTInventors: Laurent Bombillon, Fabrice Prost