Abstract: The resistive probing tip system has one or more carriers and one or more electrical contact assemblies. Each carrier has opposing surfaces with a plurality of resistors engaging the carrier. Each of the plurality of resistors has opposing electrical contacts that are exposed at respective opposing surfaces of the carrier. Each electrical contact assembly has opposing surfaces with electrical contacts exposed at the opposing surfaces with each electrical contact exposed on one surface coupled to a corresponding electrical contact on the other opposing surface. The carrier(s) and the electrical contact assembly(s) selectively mate to and mate from one another with the electrical contacts exposed at the opposing surfaces the carrier(s) and the electrical contact assembly(s) contacting one another. The carrier(s) and/or the electrical contact assembly(s) may be selectively secured to either of a circuit board or a probe head.

Abstract: A circuit board includes a main part on which a processor is mounted, a cut part to be cut off from the main part at a cut section before the board is reused, and a conductor pattern wired through the cut part via the cut section and to be cut off into a plurality of patterns at the cut section as the cut part is cut off. The processor detects a difference in signal level between a level of a signal output from the conductor pattern before the cut part is cut off, and a level of the signal output from the conductor pattern after the cut part is cut off, to determine a number of times the board is reused.

Abstract: A voltage measurement device, includes: a multiplexer that includes a plurality of input terminals at which voltage signals are inputted; a control circuit that performs voltage measurement by acquiring the voltage signal at a selected input terminal from the multiplexer; and a decision circuit that makes a decision as to whether or not an abnormality has occurred, based upon voltage values measured by the control circuit, wherein: the plurality of input terminals include input terminals at which voltage signals from a plurality of subjects of measurement are inputted, and an input terminal at which a potential for diagnosis is inputted; the control circuit, when performing voltage measurement for the plurality of subjects of measurement, measures voltages at the input terminals at which the voltage signals from the plurality of subjects of measurement are inputted, and a voltage at the input terminal at which the potential for diagnosis is inputted.

Abstract: A method of detecting a defect of a semiconductor device includes forming test patterns and unit cell patterns in a test region a cell array region of a substrate, respectively, obtaining reference data with respect to the test patterns by irradiating an electron beam into the test region, obtaining cell data by irradiating the electron beam into the cell array region, and detecting defects of the unit cell patterns by comparing the obtained cell data with the obtained reference data.

Abstract: A test circuit is described of a circuit integrated on wafer of the type comprising at least one antenna of the embedded type comprising at least one test antenna associated with said at least one embedded antenna that realizes its connection of the wireless loopback type creating a wireless channel for said at least one embedded antenna and allows its electric test, transforming an electromagnetic signal of communication between said at least one embedded antenna and said at least one test antenna into an electric signal that can be read by a test apparatus.

Abstract: Methods, apparatus, and computer program products for evaluating current transients measured during an electrical stress evaluation of a dielectric layer in a semiconductor device. Measured current transients are fit to an equation representing a time dependence for stress induced leakage currents. The measured current transients are corrected based upon stress currents computed from the equation to define corrected current transients.

Abstract: A signal distribution structure for distributing a signal to a plurality of devices includes a first signal guiding structure including a first characteristic impedance. The signal distribution structure also includes a node, wherein the first signal guiding structure is coupled to the node. The signal distribution structure includes a second signal guiding structure including one or more transmission lines. The one or more transmission lines of the second signal guiding structure are coupled between the node and a plurality of device connections. The second signal guiding structure includes, side-viewed from the node, a second characteristic impedance which is lower than the first characteristic impedance. The signal guiding structure also includes a matching element connected to the node.

Abstract: An apparatus for testing a semiconductor device includes a test socket, a test board, an ID reader, and an accumulator. The test socket comprises an ID information pattern and is configured to receive the semiconductor device. The test board is configured to detachably receive the test socket and electrically connect to the test socket. The ID reader is configured to read the ID information pattern and generate an ID signal corresponding to the test socket each time a semiconductor test is performed in the test socket. The accumulator is electrically connected to the ID reader and is configured to accumulate a plurality of ID signals, and store a test number equal to the number of times the test socket is used to perform the semiconductor test. The test number is based on the accumulated ID signals.

Abstract: Stimulated emissions due to nuclear quadropole resonance are detected utilizing a terminated balanced transmission line and a directional coupler for the detection of explosives, contraband, narcotics and the like that exist between the transmission lines, in which a swept frequency continuous wave generator is utilized to scan between 100 KHz and 10 MHz.

Abstract: A method is disclosed for the measurement of a power device in a prober, which serves the examination and testing of such components. In the process, a power device is held by a chuck, and at least one electric probe is held by a probe holder, and optionally, the power device or the probe is positioned each relative to the other using a positioning device with an electrical drive, and contacts the power device. At the same time, an electrical connection remains between the probe to a signal unit with which a power signal is sent out or received, is blocked and only unblocked when it is determined that the contact between probe 26 and contact area is established.

Abstract: A DC high potential testing meter comprises first and second probes. The first probe comprises an insulated shield supporting an electrode extending from a distal end of the shield. A high voltage resistor and a high voltage diode in the shield are connected in series with the electrode. A capacitance formed by a metallic collar across the high voltage diode provides uniform voltage distribution along the high voltage diode. The second probe comprises an insulated shield supporting an electrode. A high voltage resistor in the shield is connected in series with the electrode. A meter comprises a housing enclosing an electrical circuit for measuring voltage across the electrodes and provides an output representing measured voltage.

Abstract: A control device of a magnetic resonance imaging (MRI) apparatus includes a condition setting unit and a judging unit. The condition setting unit sets an imaging sequence to be performed by the MRI apparatus based on set conditions of the set imaging sequence. The judging unit then (a) calculates a value of electric current that would need to be supplied to a gradient magnetic field coil of the MRI apparatus to perform that set imaging sequence based on the set conditions of the set imaging sequence, (b) calculates a value of voltage that would need to be applied to the gradient magnetic field coil based on a mutual inductance of the gradient magnetic field to cause electric current flowing to the gradient magnetic field coil to equal to the value of the calculated electric current, and (c) judges whether the set imaging sequence is practicable or not based on the calculated value of voltage.

Abstract: Systems and methods for radiation-tolerant overcurrent detection are disclosed. In some embodiments, an integrated circuit may include a plurality of overcurrent detectors, each of the plurality of overcurrent detectors configured to detect a candidate overcurrent event. The integrated circuit may also include a voting circuit coupled to the overcurrent detectors, the voting circuit configured to indicate an overcurrent in response to receiving a selected number of candidate overcurrent events from the overcurrent detectors. At least one of the overcurrent detectors may be subject to detecting the candidate overcurrent in error, at least in part, due to exposure to ionizing radiation.

Abstract: A light emitting device control circuit controls a light emitting array which includes a plurality of light emitting device strings. Each light emitting device string includes a first terminal which is connected to a common node, a second terminal, and a plurality of light emitting devices connected in series. The light emitting device control circuit includes: a short detection circuit, coupled to the second terminals to receive second terminal signals from the second terminals, generating comparison signals according to whether the second terminal signals are higher than a reference signal, and generating a short detection signal according to whether a number of the comparison signals is between a first setting value and a second setting value.

Abstract: Gradient coil assemblies for horizontal magnetic resonance imaging systems (MRIs) and methods of their manufacture. Some embodiments may be used with open MRIs and can be used with an instrument placed in the gap of the MRI. In general, concentrations of conductors or radially oriented conductors may be moved away from the gap of the MRI so as to reduce eddy currents that may be induced in any instrument placed within the gap. Systems for directly cooling primary gradient and shield coils may be utilized and various coil supporting structures may be used to assist in coil alignment or to facilitate use of an instrument in the MRI gap.

Abstract: In order to increase the speed at which a user of a magnetic resonance imaging (MRI) system may electrically or optically connect and physically attach a spine coil unit to the MRI system, the spine coil unit includes a connector extending away from a side of a spine coil housing. The spine coil unit is positioned on a patient table of the MRI system and moved along the patient table of the MRI system adjacent to or in physical contact with a corresponding MRI system-side connector. A lever rotatably attached to the spine coil housing may be rotated into a corresponding recess in the MRI system to physically attach and electrically or optically connect the connector of the spine coil housing and/or to positionally fix the spine coil housing relative to the MRI system-side connector.

Abstract: A system for monitoring a connection to an active pin of an integrated circuit (IC) die, includes an input/output (I/O) cell of an IC die, where the I/O cell is bonded to a bonding pad on a ball grid array (BGA) substrate. The system includes a test point on a printed circuit board (PCB) coupled to the bonding pad which forms an electrical/conductive pathway between the test point and the I/O cell. The system includes a clock waveform injected through a resistor into the test point.

Abstract: According to one embodiment, a magnetic resonance imaging apparatus includes an acquiring unit and a generating unit. The acquiring unit performs compensation of a control waveform of a radio-frequency wave based on “an output waveform of a radio-frequency wave from an amplifier before the compensation” so that an intended output waveform of a radio-frequency wave for generating a spatially non-selective radio-frequency magnetic field is outputted from the amplifier, and acquires a magnetic resonance signal using the control waveform of a radio-frequency wave after the compensation. The generating unit generates image data based on the magnetic resonance signal.

Abstract: A connection diagnostic apparatus for a ground fault detector including an oscillator connected via a coupling capacitor to an electric circuit with a first connection line and a second connection line, and a voltage detector for detecting a voltage value between the oscillator and the coupling capacitor is provided with a first relay and a second relay provided in the first connection line and the second connection line, and a programmable controller. The programmable controller determines a connected state of the ground fault detector based on a change amount of a voltage value detected by the voltage detector when the first relay is turned on or off and determines the connected state of the ground fault detector based on a change amount of a voltage value detected by the voltage detector when the second relay is turned on or off.

Abstract: A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate.