Abstract: An apparatus for fabricating a semiconductor device, including an ultraviolet radiation source, a lamp house body surrounding the ultraviolet radiation source, the lamp house body carrying a mirror surface, an opening provided on the lamp house body, the opening being adapted for supporting semiconductor chips in a state that said semiconductor chips are arranged on an adhesive tape, an infrared radiation source provided in the lamp house body, such that the infrared radiation source is surrounded by the lamp house body, and an air nozzle disposed such that the air nozzle applies a dry gas to the semiconductor substrate held on the opening.

Abstract: Apparatuses and methods are implemented for machining a longitudinally extending slot in a bore of a component. The component is gripped in a gripping device of a workholding device. A cutting operation is performed in order to cut the slot in the bore by a cutting tool. The cutting operation forms burred slot edges. The edges are further machined by inserting a deburring device into the bore. Relative angular reciprocation for a limited angle is imparted between the deburring device and the component.