Abstract: A continuous strip is electrochemically processed in an electrolytic processing bath using either a thin flexible or resilient dielectric wiping blade or an open web, plastic mesh to wipe bubbles of gas from the surface, sever dendritic material, if such is present, and to remove a surface layer of partially depleted electrolytic solution, replacing with fresh solution and to stabilize strip portions extending between support rolls. The resilient dielectric wiper blade is preferably used with perforated anodes which allow fresh electrolytic solution to flow into the space between the anodes and the strip surface after being expelled by passage of the strip past the wiping blade. The wiping blades may also be angularly oriented with respect to the strip to increase the wiping effectiveness.

Abstract: A method for continuously electroplating metal webs by coating a masking ink thereto in a fashion resembling flexographic printing, then electroplating the uncoated areas of the web and finally removing the ink, is described. The masking ink is applied continuously from a reservoir to an “anilox” roller which synchronously and rotatingly contacts either a plate roller or an intermediate roller. Contact between the rollers transfers the masking ink from one roller to the other. The plate roller has “proud” or raised areas in which the ink is drawn and contacts a guided metal web that is coated with the ink in a pattern matching that of the plate roller. Electroplating is effected after cleaning the inked web in an aqueous acid media. Finally, the masking ink is removed in an alkali medium.

Abstract: A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution.

Abstract: An apparatus for metal coating of bands by electroplating, with a band running through an acidic electrolyte enriched with a metal, the apparatus including at least one insoluble anode extending parallel to the band and divided, in a running direction of the band, in a plurality of separate anode strips insulated from each other, an arrangement for feeding current to each separate anode strip for precipitating the metal from the electrolyte, with the current flowing from a respective anode strip to the band which forms a cathode, whereby the metal is precipitated onto a band surface, and elements for supplying each anode strip with protective current the voltage of which is so selected that formation of cathode regions on anode strips, which are not supplied with the precipitation current, is prevented.

Abstract: An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: The various embodiments of coaxial capacitors are self-aligned and formed in a via, including blind vias, buried vias and plated through holes. The coaxial capacitors are adapted to utilize the plating of a plated via as a first electrode. The dielectric layer is formed to overlie the first electrode while leaving a portion of the via unfilled. A second electrode is formed in the portion of the via left unfilled by the dielectric layer. Such coaxial capacitors are suited for use in decoupling and power dampening applications to reduce signal and power noise and/or reduce power overshoot and droop in electronic devices. For such applications, it is generally expected that a plurality of coaxial capacitors, often numbering in the thousands, will be coupled in parallel in order to achieve the desired level of capacitance.

Abstract: A plating barrel includes a rotatable barrel of which the exterior shape is approximately a hexagonal column, cathode-lead connections which penetrate through end surfaces of the barrel generally along a rotational axis of the barrel, cathodes placed inside the barrel and which are connected to the ends of the cathode-lead connections, and attachments which are attached to the cathode-lead connections or the barrel in a manner such that the central axes of the attachments are approximately the same as the rotational axis of the barrel, the vertices of the attachments point toward the center of the barrel, and peripheral portions of the bases of the attachments at the opposite ends relative to the vertices are close to the inside end surfaces of the barrel so that objects do not pass through the gaps.

Abstract: An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with one aspect of the invention, the workpiece processing station is adapted for adjusting the level of the processing fluid relative to a workpiece, wherein the portion of the workpiece to be processed and possibly the paddle is selectively immersed within the processing fluid. In accordance with a further aspect of the invention, a paddle is provided for use proximate to a workpiece in a workpiece processing station. The paddle includes a one or more sets of delivery ports and one or more sets of fluid recovery ports. In at least one embodiment, the paddle provides for agitation of a processing fluid proximate to the surface of the workpiece. In at least another embodiment, the paddle provides for the delivery and/or recovery of one or more fluids to the portion of the workpiece to be processed.

Abstract: In at least one bath of the system, tumbling barrels containing pieces to be treated are arranged with their respective longitudinal axes set parallel to or coinciding with the longitudinal axis of the bath and are free to move longitudinally along the bath, supported by idle wheels resting on the edges of the bath. At least one pusher in each bath is free to move for a length longitudinally and engages a frame of a barrel at a trailing position to push the said barrel and possible barrels in front of it in an advance direction. The system may comprise a spray wash in sequential stages.

Abstract: Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path.

Abstract: An electroplating apparatus includes a plurality of feeding rollers adapted to advance a sheet-shaped article, and a spraying unit. The spraying unit has a pair of upper and lower casings, each of which includes a casing body defining a chamber, and a net plate disposed to confront with the article. An electrolyte is sprayed from the chamber via meshes in the net plate and onto a side surface of the article. An anode current-conducting assembly includes a conducting net that is disposed fixedly within the chamber and that is superimposed on the net plate so as to cover the meshes in the net plate, and two conducting units respectively in electrical contact with two opposite side portions of the conducting net so as to supply electric current to the conducting net.

Abstract: An electrochemical reactor is used to electrofill damascene architecture for integrated circuits or for electropolishing magnetic disks. An inflatable bladder is used to screen the applied field during electroplating operations to compensate for potential drop along the radius of a wafer. The bladder establishes an inverse potential drop in the electrolytic fluid to overcome the resistance of a thin film seed layer of copper on the wafer.

Abstract: In a device, rod-shaped objects 10 (rods of various length and diameter) are electrochemically partially processed in dip plants (galvanized, pickled). Stationary tubular electrodes 30, into which the rods 10 are centrically entered, are provided in the plating tank of the plant. The surfaces to be plated are each axially limited by an adjustable membrane carrier 26, in which elastic shielding membranes 9 for delimiting the field lines are arranged. The membranes 9 are held by membrane holders 5. The membrane holders 5 are arranged in a cage where they are free to move radially and are provided with inner centering springs 7 and with outer centering springs 19 so that the membrane holder 5 and the membranes 9 are held in such a way as to be self-centering.

Abstract: A method of coating an internal surface of a weapon barrel includes the steps of applying an intermediate layer to the internal barrel surface by explosion plating and applying a cover layer at least indirectly to the intermediate layer by electroplating. The intermediate layer has a heat conductivity which is greater than that of the weapon barrel and a ductility which is greater than that of the cover layer.

Abstract: A method, system and structure for a pin grid or pad grid array structure includes a plurality of pins connected to an electronic structure, a power plane within the electronic structure electrically connected to power pins, a ground plane within the electronic structure, and fuse portions electrically connecting the ground plane to ground pins and signal pins. The power plane and the ground plane create a charge in the pins during electroplating of the pins. The fuse portions disconnecting the signal pins from the ground plane after the electroplating.

Abstract: Device (60) having one or more operative units (55) for electroplating a film by chemical reaction with a specially made liquid product (29) and application of direct current, on sheets (50) for printed circuits continuously translating between one or more pairs of opposing oblong chambers (210, 130) respectively supplied with tubular nozzles (231) and with one longitudinal slit nozzle (233) and having internal electrodes (220, 240) electrically connected to the negative pole of a generator of direct current, between one or more pairs of titanium contact rollers (61-62, 130-131), electrically connected to the positive pole of the current, and plastic containment rollers (100-101, 110-111) of the liquid (29) rotating in each pair reciprocally in opposite directions, due to closure of the electric circuit between the liquid product (29), pumped in under pressure by the pump and projected by the nozzles (213, 233) of the chambers (210, 230) against the sheets (50), and said sheets through the contact rollers.

Abstract: An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: The present invention provides a self-replenishing liquid water source onboard an automobile for supplying liquid water to an electrolyzer, such as an on-board hydrogen generator useful for the suppression of unwanted emissions. While automobiles typically have water reservoirs resupplied by a person, the invention provides a passive means of water collection for reliable replenishment due to operations of the automobile itself. The invention provides condensate from the engine exhaust gas by cooling a region of the exhaust system using cooling fluid from the engine coolant system. The cooling fluid is circulated during a period following the engine cold start event when the heat load on the engine coolant system is low.

Abstract: A process for fabricating a structure using a metal carrier and forming a double capacitor structure. The process comprises forming a first via hole through the metal carrier, forming a dielectric layer around the metal carrier and inside the first via hole, forming a second via hole through the dielectric layer and the metal carrier, and filling at least one of the via holes with conductive material. In one preferred embodiment, the process further comprises forming a third via hole through the metal carrier before the forming of a dielectric layer, wherein the dielectric layer is formed around the metal carrier, inside the first via hole, and inside the third via hole. The first via hole, the second via hole, and the third via hole are all filled with a conductive material. In one preferred embodiment, the dielectric layer comprises a top surface opposed to a bottom surface, and electrodes are formed on at least one of the top surface and the bottom surface of the dielectric layer.

Abstract: A deposition tool and a method for depositing a material within the recesses in a substrate of semiconductor wafer employs a rotatable diffuser that diffuses the plating material onto the top surface of a substrate. The diffuser is placed into contact with the semiconductor wafer and rotated while the plating material is applied through apertures in the diffuser. The plating material fills recesses patterned into the substrate of the semiconductor wafer but is prevented from forming to a significant degree on the top surface of the semiconductor wafer due to the contact and rotation of the diffuser. Since the plating material is not deposited on the top surface of the semiconductor wafer to any significant degree, chemical mechanical polishing (CMP) planarization is significantly reduced or completely eliminated.