Abstract: A press sintering process product carrier for carrying at least one product to be sintered in a press sintering process comprises a top side; a product receiving recess defined in the top side, and configured for receiving the product(s) therein and for carrying the product(s) on a recess bottom of the product receiving recess; a top side surface surrounding the product receiving recess; a holding groove provided in the top side surface and surrounding the product receiving recess, and a vacuum connection in fluid connection with the holding groove to allow providing a vacuum in the holding groove for holding a film, foil or sheet of material provided over the product receiving recess and the holding groove; and a recess gas inlet arranged in the product receiving recess for introducing a gas into the product receiving recess, and a recess gas outlet arranged in the product receiving recess for extracting gas from the product receiving recess to allow providing a flow of gas from the recess gas inlet to the r

Abstract: A split-type friction stir welding head with an adjustable stirring pin length includes a stirring head housing, where a clamping handle and a detachable stirring pin are successively mounted in the stirring head housing towards a welding direction, the clamping handle is provided with external threads on a periphery thereof and in drive connection with an adjusting plate through threads, the adjusting plate is limited, fixed and mounted in the stirring head housing, and a pore-diameter-adjustable aperture shoulder is mounted between a bottom of the stirring head housing and the detachable stirring pin in order to compensate for an outside gap between a stirring pin channel of the stirring head housing and the detachable stirring pin.

Abstract: A stable bonding processing for metal, of which at least a part is plated, is provided. A plated metal bonding apparatus performs bonding of a first metal and a second metal. At least one from among the first metal and the second metal has a plated bonding portion where the bonding processing is to be performed. A bonding processing unit performs bonding of the first metal and the second metal using sound vibration and/or ultrasound vibration. The bonding processing unit performs the bonding processing using a plated material or otherwise using a metal portion in a state in which a plating material has been removed.

Abstract: An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.

Abstract: A solar cell string production equipment includes first and second conveying devices, first and second carrying devices, and a transfer device. The first conveying device has a first continuous conveyor belt, the second conveying device has a second continuous conveyor belt, and the first and second continuous conveyor belts can turn and convey in the vertical direction. Back and front films are laid on the first conveying device. The first conveying device can transport the back film on the first continuous conveyor belt to the second continuous conveyor belt. The transfer device can transport the pressing tool from the terminal of the second continuous conveyor belt to the front film on the first continuous conveyor belt. The second carrying device can transport the pressing tool and front film stacked together to the second continuous conveyor belt. A solar cell string production method is further provided.

Abstract: A low-temperature joining method effectively suppresses reductions in the mechanical properties of a junction of various types of high-tensile steel or aluminum, and of a heat-affected zone; and produces a joint structure. A method for joining two metal materials by forming a joint interface in which the two metal materials face each other at a joint portion and plunge a rotation tool caused to rotate at a prescribed speed into the joint, the method for low-temperature joining of metal materials characterized in that the peripheral velocity of the outermost periphery of the rotation tool is set to 51 mm/s or less, whereby the recrystallization temperature inherent to the metal materials is reduced by introducing a large strain to the joint, and recrystallized grains are generated at the joint interface by setting the joining temperature to less than the recrystallization temperature inherent to the metal materials.

Abstract: An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The ultrasonic welding system also includes a z-axis motion system carrying the weld head assembly. The z-axis motion system includes (i) a z-axis forcer for moving the weld head assembly along a z-axis of the ultrasonic welding system, and (ii) a z-axis overtravel mechanism disposed between the z-axis forcer and the weld head assembly.

Abstract: A method for making a container for retaining anesthetic agent. The method includes creating two or more parts each having a mating surface, where the container is formed when the mating surfaces of the two or more parts are coupled together, and where a first part of the two or more parts is formed of a material having pores defined within the mating surface thereof. The method further includes processing the mating surface of the first part via friction stir welding to reduce the pores defined therein. The method further includes coupling the two or more parts together such that the mating surfaces contact to create the container configured to retain the anesthetic agent therein.

Abstract: A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.

Abstract: A shoulder-angle-adjustable friction stir welding head suitable for a fillet joint includes a stirring head body. A front end of the stirring head body is mounted with a movable shoulder, a stirring pin channel is arranged on the movable shoulder, and the stirring pin channel may allow a stirring pin of the stirring head body to pass through. The present disclosure can respond to welding tasks of the fillet joint of different angles and enlarges an application scope of the friction stir welding head in a manner that the front end of the stirring head body is mounted with the movable shoulder, the stirring pin channel is arranged on the movable shoulder, the stirring pin channel is used for allowing the stirring pin of the stirring head body to pass through, and the angle of the movable shoulder is adjusted.

Abstract: A wire bonding apparatus connecting a lead of a mounted member with an electrode of a semiconductor die through a wire comprises a capillary through which the wire is inserted, a shape acquisition part which acquires the shape of the lead to which the wire is connected, a calculating part which calculates an extending direction of a wire tail extending from the end of the capillary based on the shape of a lead to which the wire is connected next, and a cutting part which moves the capillary in the extending direction and cuts the wire to form the wire tail after the lead is connected with the electrode through the wire. Thus, in the wire bonding using wedge bonding, joining part tails (183a, 283a, 383a) formed in continuation to a first bonding point can be prevented from coming into contact with each other.

Abstract: An improved hammer mill hammer constructed by forming a groove in an edge of the grinding end of a hammer for receiving hard facing material and placing hard facing in the groove.

Abstract: The present disclosure provides a wire and arc additive manufacturing (WAAM) method for a titanium alloy. The method includes the following steps: step 1: performing a WAAM process assisted by cooling and rolling; step 2: milling side and top surfaces of an additive part; step 3: performing, by friction stir processing (FSP) equipment, an FSP process on the additive part, and applying cooling and rolling to a side wall of the additive part through a cooling and rolling device during the FSP process; step 4: finish-milling the top surface of the additive part for a WAAM process in the next step; and step 5: repeating the above steps cyclically until final forming of the part is finished. This WAAM method completely breaks dendritic structures and refines grains in the WAAM process of the titanium alloy, thereby effectively repairing defects such as pores and cracks.

Abstract: The present disclosure provides a wire and arc additive manufacturing (WAAM) method for a magnesium alloy. The method includes the following steps: step 1: performing a WAAM process assisted by cooling and rolling; step 2: milling side and top surfaces of an additive part; step 3: performing, by friction stir processing (FSP) equipment, an FSP process on the additive part, and applying cooling and rolling to a side wall of the additive part through a cooling and rolling device during the FSP process; step 4: finish-milling the top surface of the additive part for a WAAM process in the next step; and step 5: repeating the above steps cyclically until final forming of the part is finished. The present disclosure completely breaks dendritic structures and refines grains in the WAAM process of the magnesium alloy, thereby effectively repairing defects such as pores and cracks.

Abstract: A mechanical vibration machining apparatus or the like is suitable for forming a stable machined surface. A mechanical vibration machining apparatus performs machining of a machining target using a horn. A control unit instructs the horn to perform a mechanical vibration operation and a rotational driving operation. The control unit controls the mechanical vibration and/or the rotational driving in a periodic manner. For example, the control unit supports intermittent alternating control. That is to say, when one from among the mechanical vibration and the rotational driving is provided, the other is suspended. Such periodic control allows the stress that occurs due to the applied force to be dispersed, thereby allowing a stable machined surface to be formed.

Abstract: A stir pin includes a base end portion configured to be held rotatably about a first axis, a stirring portion provided to project from a shoulder member to be rotatable about the first axis together with the base end portion, and an intermediate portion including a second portion connected to the stirring portion to be rotatable about the first axis together with the stirring portion and having a second diameter passing through the first axis, and a first portion provided between and connected to the base end portion and the second portion to be rotatable about the first axis together with the base end portion and the second portion. The first portion has an end surface to which the second portion is connected and which has a maximum diameter larger than the second diameter. The end surface has a ring-shaped receiving surface configured to receive a material waste.

Abstract: The present invention concerns an ultrasonic welding installation comprising an ultrasonic vibration unit having a sonotrode and a converter, wherein the sonotrode and the converter are arranged in mutually adjacent relationship along a longitudinal axis and the ultrasonic vibration unit can be caused to resonate with an ultrasonic vibration in the direction of the longitudinal axis with a wavelength ?/2, wherein there is provided a holder for holding the ultrasonic vibration unit.

Abstract: A double-action friction stir joining system, which includes a double-action friction stir joining device, a cleaning mechanism having a dressing member, a robot, and a control device. The double-action friction stir joining device includes a first rotary driver configured to rotate a pin member and a shoulder member, and a tool driver configured to reciprocate the pin member and the shoulder member. The control device is adapted to (A) operate the tool driver so that the pin member is thrusted into the shoulder member, (B) operate the first rotary driver so that the shoulder member rotates, and (C) operate the robot so that the robot holds the double-action friction stir joining device and the dressing member contacts an inner circumferential surface of the shoulder member.

Abstract: An ultrasound sonotrode (101), the first end of which is adapted to be connected to a mechanical vibrations source, equipped with a working tip (105,205,405,805) at the opposite end of the sonotrode (101), equipped with a body (104) with a cooling jacket (103), sealed at the place of contact with the body (104) of the sonotrode (101) with the use of the first seal (106) and the second seal (107), characterized in that according to the invention the first seal (106) is placed at a distance less than or equal to 20 mm from the node of the standing wave excited in the sonotrode in the working conditions, and the second seal (107,207,407,507,607) is equipped with a resilient element (108,208,408,508,608) and is located at a distance less than or equal to 20 mm from the working tip (105,205,405,805).

Abstract: A method and apparatus for mounting optical components is described. The apparatus is suitable for mounting multiple optical components and comprises a baseplate having opposing first and second surfaces. Recesses or apertures are formed within the baseplate and are located upon the first or second surfaces so as to define thermally activated optic mounting areas. Pillars are then located within the thermally activated optic mounting areas and these provide a means for attaching the optical component to the baseplate. The employment of the recesses or apertures act to significantly reduce the thermal conduction throughout the baseplate. As a result preferential heating can be provided to the one or more thermally activated optic mounting areas while maintaining the baseplate with a desired mechanical strength. The optical mounting apparatus exhibits a high thermal stability thus making the apparatus ideally suited for use within commercial optical system.