Abstract: A probe apparatus comprises a vertically movable table for placing a semiconductor wafer having semiconductor devices, a heater for heating the wafer at a predetermined temperature, and a probe card located above the wafer and having support and positioning portions for probes. The probe has a vertical portion which extends downward substantially vertically, and is capable of buckling. Two positioning plates are supported by the support positioning portion through which the vertical portions of said probes are downwardly extended wherein a temperature controller heats the probes at the positioning plates at a predetermined temperature.