Abstract: An inductor and a method of forming and the inductor, the method including: (a) providing a semiconductor substrate; (b) forming a dielectric layer on a top surface of the substrate; (c) forming a lower trench in the dielectric layer; (d) forming a resist layer on a top surface of the dielectric layer; (e) forming an upper trench in the resist layer, the upper trench aligned to the lower trench, a bottom of the upper trench open to the lower trench; and (f) completely filling the lower trench at least partially filling the upper trench with a conductor in order to form the inductor. The inductor including a top surface, a bottom surface and sidewalls, a lower portion of said inductor extending a fixed distance into a dielectric layer formed on a semiconductor substrate and an upper portion extending above said dielectric layer; and means to electrically contact said inductor.

Abstract: A semiconductor element of this invention includes a drift layer of a first conductivity type formed on a semiconductor substrate of the first conductivity type, a well layer of a second conductivity type selectively formed in the surface of the drift layer, a source layer of the first conductivity type selectively formed in the surface of the well layer, a trench formed to reach at least the inside of the drift layer from the surface of the source layer through the well layer, a buried electrode formed in the trench through a first insulating film, and a control electrode formed on the drift layer, the well layer, and the source layer through a second insulating film.

Abstract: The present invention provides a method for estimating resistance value of an LDD region that works in an actual FET and forming an optimum LDD region. Therefore, the present invention provides an FET in which OFF (leakage) current is reduced and has superior switching characteristics. An equivalent circuit is assumed so as to estimate an external resistance value. The equivalent circuit is a circuit in which an external resistor is serially-connected to the drain side of a conventional FET. And the threshold voltage and the external drain voltage—drain current characteristics of the FET having an LDD structure are measured, and the result is applied to the equivalent circuit. Regarding an external drain voltage when drain current is saturated as an external saturation drain voltage, a saturation drain voltage in an imaginary FET taking off the external resistor from the estimating FET is obtained from the threshold voltage.

Abstract: A thyristor-based semiconductor device exhibits a relatively increased base-emitter capacitance. According to an example embodiment of the present invention, a base region and an adjacent emitter region of a thyristor are doped such that the emitter region has a lightly-doped portion having a light dopant concentration, relative to the base region. In one embodiment, the thyristor is implemented in a memory circuit, wherein the emitter region is coupled to a reference voltage line and a control port is arranged for capacitively coupling to the thyristor for controlling current flow therein. In another implementation, the thyristor is formed on a buried insulator layer of a silicon-on-insulator (SOI) structure. With these approaches, current flow in the thyristor, e.g., for data storage therein, can be tightly controlled.

Abstract: A structure that reduces signal cross-talk through the semiconductor substrate for System-On-Chip (SOC) (2) applications, thereby facilitating the integration of digital circuit blocks (6) and analog circuit blocks (8) onto a single IC. Cross-circuit interaction through a substrate (4) is reduced by strategically positioning the various digital circuit blocks (6) and analog circuit blocks (8) in an isolated wells (10), (12), (16) and (20) over a resistive substrate (4). These well structures (10), (12), (16), and (20) are then surrounded with a patterned low resistivity layer (22) and optional trench region (24). The patterned low resistivity region (22) is formed below wells (10) and (12) and functions as a low resistance AC ground plane. This low resistivity region (22) collects noise signals that propagate between digital circuit blocks (6) and analog circuit blocks (8).

Abstract: A disclosed method for fabricating a structure in a semiconductor die comprises steps of implanting a deep N well in a substrate, depositing an epitaxial layer over the substrate, and forming a P well and a lateral isolation N well over the deep N well, wherein the lateral isolation N well and the P well are fabricated in the substrate and the epitaxial layer, and wherein the lateral isolation N well laterally surrounds the P well, and wherein the deep N well and the lateral isolation N well electrically isolate the P well. Implanting a deep N well can comprise steps of depositing a screen oxide layer over the substrate, forming a mask over the screen oxide layer, implanting the deep N well in the substrate, removing the mask, and removing the screen oxide layer. Depositing the epitaxial layer can comprise depositing a single crystal silicon over the substrate.

Abstract: A high density horizontal merged MOS-bipolar gain memory cell is realized for DRAM operation. The gain cell includes a horizontal MOS transistor having a source region, a drain region, and a floating body region therebetween. The gain cell includes a horizontal bi-polar transistor having an emitter region, a base region and a collector region. The collector region for the horizontal bi-polar transistor serves as the floating body region for the horizontal MOS transistor. A gate opposes the floating body region and is separated therefrom by a gate oxide. The emitter region for the horizontal bi-polar transistor is coupled to a write data line.

Abstract: A ferroelectric element is described which has a structure including a common electrode 11, a ferroelectric film 10 formed on the common electrode 11, an individual electrode 3 formed on the ferroelectric film 10, a lead wire 15 for feeding electric power to the individual electrode 3, which is formed on the same plane as of the individual electrode 3, and a protection film 16 entirely covering the exposed parts of the ferroelectric film 10 and the individual electrode 3, and covering the lead wire 15. The protection film 16 is preferably made of a material whose Young's modulus is smaller than that of the ferroelectric film 10, exactly 1/20 or smaller of the Young's modulus of the ferroelectric film 10. Further, the ferroelectric film is formed with the insulation reinforcing film containing at least one of the elements constituting the ferroelectric film.

Abstract: Semiconductor devices, and methods of fabricating, having ammonia-treated polysilicon devices are provided. A substrate is provided upon which a polysilicon layer is formed. The polysilicon layer is treated with ammonia. Thereafter, portions of the polysilicon layer may be oxidized, forming poly-oxide regions. The poly-oxide regions may be used, for example, to form the poly-oxide layer of a split-gate transistor. The ammonia treatment reduces the tendency of the polysilicon to oxidize along the grain boundaries, thereby allowing smaller designs to be fabricated without bridging occurring between polysilicon structures.

Abstract: An aspect of the present invention provides a power module for automotive switching applications including a plurality of semiconductor chips and a unitary silicon nitride substrate. The plurality of semiconductor chips are attached to the silicon nitride substrate and the substrate is configured to have a thermal coefficient of expansion substantially the same as the plurality of semiconductor chips.

Abstract: The invention relates to a process of forming a compact bipolar junction transistor (BJT) that includes forming a self-aligned collector tap adjacent the emitter stack and an isolation structure. A base layer is formed from epitaxial silicon that is disposed in the substrate.

Abstract: A lid having a plurality of recesses at the edges of the lid to provide an improved adhesive bond between the lid and a substrate of an integrated circuit is disclosed. The plurality of recesses may be a castellation comprising a collection of semi-circular cuts into the originally straight edges of the lid. The castellation can be formed by stamping, etching, molding design, or milling/drilling, all of which are well-known methods in the art of forming lids for integrated circuits. The castellation can be vertically straight or it can be slightly tapered, to provide a better locking of the lid on to the package. Epoxy in the recesses can provide an epoxy post for locking the lid. Method of forming a lid having a plurality of recesses and employing a lid on an integrated circuit are also disclosed.

Abstract: The present invention relates to structures and methods that reduce ESD damage to electronic devices. In an embodiment, the structure is a parallel plate dissipative capacitor formed by sandwiching a dissipative dielectric layer between two conductive layers in series to the electronic device. The dissipative dielectric layer includes a nonconductive dielectric doped with a voltage dependent resistive material that defines a conductive threshold voltage. The structure functions as a voltage dependent resistor in response to an applied voltage such as an ESD surge voltage exceeding the defined conductive threshold voltage and dissipates the applied voltage into thermal energy before it can reach the electronic device and cause damage. The dissipative dielectric layer restores to a dielectric and the structure functions as a capacitor when the excess voltage is depleted that is drops below the defined conductive threshold voltage.

Abstract: To prevent an n-channel thin-film transistor from being deteriorated by hot holes generated in a gate-negative pulse mode. A thin polysilicon film 10 is provided with a p-type semiconductor region 13 in contact with a channel region 14. The p-type semiconductor region 13 is electrically connected to nowhere except the channel region 14. Holes induced on the surface due to a gate-negative pulse are further supplied from the p-type semiconductor region 13. An electric field established by the gate-negative pulse is relaxed by the holes, fewer hot holes are injected into the gate oxide film, and the TFT characteristics are less deteriorated.

Abstract: A vertical thin-film transistor (V-TFT) is provided along with a method for forming the V-TFT. The method comprises: providing a substrate made from a material such as Si, quartz, glass, or plastic; conformally depositing an insulating layer overlying the substrate; forming a gate, having sidewalls and a thickness, overlying a substrate insulation layer; forming a gate oxide layer overlying the gate sidewalls, and a gate insulation layer overlying the gate top surface; etching the exposed substrate insulation layer; forming a first source/drain region overlying the gate insulation layer; forming a second source/drain region overlying the substrate insulation layer, adjacent a first gate sidewall; and, forming a channel region overlying the first gate sidewall with a channel length about equal to the thickness of the gate, interposed between the first and second source/drain regions.

Abstract: The present invention provides a semiconductor device comprising a semiconductor substrate, and transistors formed on the semiconductor substrate, wherein control electrode terminals constituting external electrode terminals of the transistors, and first electrode terminals which transmit output signals, are provided on a main surface of the semiconductor substrate, wherein the control electrode terminals are provided at least one, and a plurality of the first electrode terminals are arranged on one side and a plurality of the first electrode terminals are arranged on the other side with the control electrode terminals being interposed therebetween, wherein a portion including the control electrode terminals and a plurality of the first electrode terminals located on one side of the control electrode terminals constitute a first transistor portion, and wherein a portion including the control electrode terminals and a plurality of the first electrode terminals located on the other side of the control electrode

Abstract: A bipolar junction transistor (BJT) includes a dielectric layer formed on a predetermined region of a substrate, an opening formed in the dielectric layer and a portion of the substrate being exposed, a heavily doped polysilicon layer formed on a sidewall of the opening to define a self-aligned base region in the opening, an intrinsic base doped region formed within the substrate and in a bottom of the opening by implanting through the self-aligned base region, a spacer formed on the heavily doped polysilicon layer to define a self-aligned emitter region in the opening, and an emitter conductivity layer being filled with the self-aligned emitter region and a PN junction being formed between the emitter conductivity layer and the intrinsic base doped region.

Abstract: A semiconductor device X1 comprises: a first conductor 110 including a first terminal surface 113a; a second conductor 120 placed by the first conductor 110 and including a second terminal surface 123a facing a same direction as does the first terminal surface 113a; a third conductor 130 connected with the first conductor 110; a semiconductor chip 140 including a first surface 141 and a second surface 142 away from the first surface, and bonded to the first conductor 110 and to the second conductor 120 via the second surface 142; and a resin package 150. The first surface 141 of the semiconductor chip 140 is provided with a first electrode electrically connected with the first conductor 110 via the third conductor 130. The second surface 142 is provided with a second electrode electrically connected directly with the second conductor 120.

Abstract: A semiconductor device containing a multi-layered wiring structure formed on a semiconductor substrate, the structure including at least two wiring layers formed in an interlayer insulation layer, and each of the wiring layers including a metal wiring made of one of Cu and a Cu alloy, wherein the multi-layered wiring structure comprises a lower wiring layer formed under the interlayer insulation layer, a via buried in the interlayer insulation layer to connect an upper wiring layer and the lower wiring layer, and a dummy via buried in the interlayer insulation layer, the dummy via being not connected to the upper wiring layer.

Abstract: A carrier for opto-electronic elements has a carrier plate that is transparent to emitted or absorbed light of an opto-electronic element that is allocated to the carrier. At least one semiconductor structure is inventively deposited on the carrier plate and forms at least one photodiode, whereby the semiconductor structure at least partly absorbs light impinging on the carrier plate. This makes light detection possible in a simple and highly integrated fashion. A transmitting device and a receiving device can be formed with this kind of carrier.