Abstract: This is directed to an electronic circuit apparatus using a flexible printed wiring board having a conductive leaf formed on the surfaces of a flexible base material such as phenol resin or the like, wherein a circuit conductive leaf is formed on at least the single face of a flexible base material and a peripheral edge leaf is formed on the periphery of the flexible base material. An electronic parts is mounted and connected to the circuit conductive leaf. Since the flexible base material is extremely thin and flexible, the electronic circuit apparatus can be constructed smaller and thinner.

Abstract: A copper liner for a mold utilized in the electroslag refining process of a character to reduce thermal creep distortion and simultaneously increase the cooling effect obtained by circulating cold water, the liner being composed of copper and provided with a multiplicity of vertically disposed slots which may be straight or sinuous to receive cooling water, the structure between the slots dimensioned to function as cooling fins and at the same time structurally reinforce the mold liner to prevent creep.