Abstract: A temperature sensor arrangement includes a housing having on opposite sides thereof a spring element and cover, and a temperature sensor lead and thermal pad such that the spring element is disposed between one of the sides and the cover, the temperature sensor lead is disposed between the other of the sides and the thermal pad, and the cover and thermal pad define opposite exterior sides of the temperature sensor arrangement. The housing carries and permits relative movement of the cover. The spring pushes the cover away from the one of the sides.

Abstract: A temperature determination device includes: a temperature sensor; a mount; and at least one connection sensor. The temperature sensor is connectable to a process device via the mount. The temperature sensor acquires temperature data. The at least one connection sensor acquires connection status data relating to connection of the temperature sensor to the process device. The temperature determination device utilizes the temperature data and the connection status data with respect to a determination of a temperature of the process device.

Abstract: A scanning device includes: a motion sensor to detect motion imparted to the scanning device; a distance detector to determine a distance between the scanning device and a surface; an infrared detector to capture a temperature of the surface; an image sensor to capture an image of an indicia encoding data on the surface; and a processor configured to store the captured image and temperature, configured to operate the motion sensor to detect motion being imparted to the scanning device when in a low power state, and configured to transition the scanning device out of the low power state in response to such imparted motion by: operating the distance detector to determine the distance to the surface; and determining whether to operate the infrared detector to capture the temperature of the surface and whether to operate the image sensor to capture the image of the indicia, based on the distance.

Abstract: In a method for monitoring a winding temperature of a winding of an electric machine powered by a converter, a heating power applied to the winding of the electric machine is determined and evaluated using a thermal model. A relative increase in a resistance of the winding, when the winding heats up, is determined from the heating power in comparison with a standard reference value for 20° C. winding temperature. The winding temperature is calculated from the relative increase in the resistance, and a warning signal and/or a switch-off signal is generated when a critical winding temperature value is exceeded.

Abstract: A temperature detection device that can facilitate attachment of a temperature sensor to a coil and can improve thermal responsiveness by a simple structure reduced in the number of components. Such a temperature detection device includes a temperature sensor including a thermosensitive body configured to detect temperature of a coil of a rotary electric machine to be mounted on a vehicle, and a metal bracket attaching the temperature sensor to the coil. The bracket includes a bracket main body clamping the coil by elastic force, and a joining portion joined to the temperature sensor. The bracket main body includes a clamping portion internally clamping the coil, and a heat collection portion that protrudes to outside of the clamping portion and is thermally coupled to the temperature sensor.

Abstract: Circuitry generates base-to-emitter voltages (Vbe1, Vbe2) of two BJTs biased at different current densities, a base-to-emitter voltage (Vbe) of a BJT biased so Vbe is complementary to absolute temperature and has a curved non-linearity across temperature, and base-to-emitter voltages (Vbe1_c, Vbe2_c) of two BJTs biased by a temperature independent constant current and a current proportional to absolute temperature so Vbe2_c?Vbe1_c has the same but opposite curved non-linearity across temperature as Vbe. A sampling circuit samples these voltages and provides them to inputs of a loop filter. Filter outputs are quantized to produce a bitstream.

Abstract: A calibration arrangement has a sealable and thermally-isolated chamber comprising a socket mount having a number of reference samples in thermal contact with the socket mount and a number of sample sockets for devices-under test, DUTs, with each sample socket being arranged in proximity to and associated to at least one of the reference samples. The arrangement further comprises a thermal chuck and a circuit board, which is configured to provide electrical connection to the reference samples in the socket mount and DUTs in the sample sockets. The thermal chuck is configured to thermalize the socket mount and the circuit board to a temperature set point.

Abstract: The present disclosure is of an atmospheric characterization system that has a central processing board that has a first and a second communication interface. Further, the atmospheric characterization system further has a first precision temperature sensor that is communicatively coupled to the central processing board via the first communication interface and positioned a distance from a first side of the processing board, wherein the precision temperature measures a first temperature and transfers data indicative of the first temperature to the central processing board.

Abstract: An ear thermometer includes a probe including an infrared sensor unit for measuring a temperature of an eardrum of an ear of a temperature measurement target parson in a non-contact manner, the probe attached to an ear hole of the temperature measurement target parson. The probe includes a probe body inserted into the ear hole of the temperature measurement target parson, a housing for supporting the probe body; and an in-ear type earpiece attached to the probe body and abutting on an inside of the ear hole of the temperature measurement target person. The infrared sensor unit includes a first sensor and a second sensor arranged in the probe body and spaced apart by a predetermined distance along a direction substantially orthogonal to the eardrum when the probe body is inserted into the ear hole of the temperature measurement target person.

Abstract: A temperature detector is provided that is particularly suited towards the differential measurement of foot temperatures in diabetics. A radiation sensor views a surface area of the body and provides a radiation sensor output. Electronics coupled to the radiation sensor and an ambient temperature sensor compute a normalized surface temperature of the area normalized to a specified ambient temperature as a function of a sensed ambient temperature and a sensed radiation.

Abstract: A method for operating a thermal imaging camera includes measuring two-dimensional temperature information including a thermal image of a setting using an infrared detector array of the thermal imaging camera, the infrared detector array including a plurality of pixels sensitive to infrared radiation. At least one of ambient humidity information and ambient air temperature information is provided. An evaluation device is used to calculate two-dimensional information about a mold formation risk. The method includes generating a mold risk map of the setting using a mold growth model and using the calculated two-dimensional temperature information, and the provided at least one of ambient humidity information and ambient air temperature information.

Abstract: A low power temperature detection method, system, and apparatus sense when a temperature threshold is reached by connecting a current conveyor (111) with a startup bias circuit (112) having a first FET (P1) (connected to level shift a reference voltage to provide an input voltage VS1), a first diode-connected BJT (Q0) (connected to generate a base-emitter voltage based on the junction temperature), and a second FET (P2) (connected to level shift the base-emitter voltage), where the startup bias circuit (112) selectively connects the current conveyor (111) to ground to form a closed loop that is activated only when an emitter current at the first diode-connected BJT (Q0) enters a self-turned-on operation region, thereby activating the current conveyor to detect a temperature threshold being reached by the device junction temperature.

Abstract: A non-contact temperature measuring device for an accessory comprises a body unit; a fixing unit to which the body unit is coupled; a distance sensor configured to measure a distance to an object; a temperature sensor configured to measure a temperature of the object; a control unit operatively connecting the distance sensor and the temperature sensor to obtain the temperature of the object; a display unit displaying the temperature obtained; and a connector configured to supply power, wherein the fixing unit includes a coupling part including a receiving groove capable of receiving the connector of the body unit, a support part connected to the coupling part and having an adhesive surface for bonding to another device; and an outer part configured to be connected to the coupling part, and when the body unit is fastened to the coupling part, surround an outer surface of the body unit.

Abstract: This application discloses a thermoelectric power generation structure and a temperature measuring sensor. The thermoelectric power generation structure includes: a semiconductor power generation element, a first thermal-conductive element arranged in a first environment and connected to an inner side face of the semiconductor power generation element, and a second thermal-conductive element connected to an outer side face of the semiconductor power generation element. When there is a temperature difference between the first environment and the second environment, the semiconductor power generation element generates electric power. This application solves the technical problem that the thermoelectric power generation structure cannot match a sensor probe and fails to create a thermoelectric power generation environment, and accordingly cannot effectively generate electric power to the sensor probe in an enclosed high-temperature food heating scene.

Abstract: A remote temperature measurement system for a gas turbine engine includes an optical emitter/receiver in communication with the control system and a probe system embedded within a component of the gas turbine engine, the probe system within a line-of-sight of the optical emitter/receiver, the control system operable to determine a local temperature of the component in response to optical communication with the probe system.

Abstract: Methods for measuring a temperature of a wafer chuck and calibrating temperature and a temperature measuring system are provided. The measuring method includes: placing a test wafer on a wafer chuck, where a plurality of semiconductor devices having electrical parameters varying as a function of temperature are formed on the test wafer; making the temperature of the wafer chuck reach set temperatures; measuring the semiconductor devices respectively to obtain electrical parameters corresponding to the semiconductor devices; obtaining actual temperatures of the semiconductor devices according to the electrical parameters and variations, of the electrical parameters, as the function of temperature; and obtaining an actual temperature distribution of the wafer chuck according to the actual temperatures of the semiconductor devices.

Abstract: Described is a calorimeter that includes a thermal column, a sample container, a reference container, a thermal shield, a diffusion-bonded block and a thermal plate. One or more heat flux sensors are disposed between the thermal column and the sample container and between the thermal column and the reference container. The thermal shield is in thermal communication with the thermal column and is separated from and substantially encloses the sample container, reference container and thermal column. The diffusion-bonded block includes a first metallic layer having a first thermal conductivity, a second metallic layer having a second thermal conductivity and a third metallic layer having a third thermal conductivity. The second thermal conductivity is different from the first and third thermal conductivities. The first metallic layer is in thermal communication with the base of the thermal column and the third metallic layer is in thermal communication with the thermal plate.

Abstract: A temperature measurement sensor according to an exemplary embodiment includes a substrate and an optical fiber provided on an upper surface of the substrate and extending along the upper surface. The temperature measurement sensor further includes a light introduction path of a space that allows a space above the upper surface and a space below a lower surface of the substrate to communicate with each other and an optical coupling portion provided on the upper surface and disposed in the light introduction path. The optical coupling portion is optically connected to the end surface of the optical fiber. The optical fiber forms the first pattern shape and the second pattern shape. The first pattern shape includes the optical fiber more densely than the second pattern shape. Light incident on the optical coupling portion from a side of the lower surface through the light introduction path reaches the end surface through the optical coupling portion.

Abstract: A system comprises a gate driver that is configured to couple to a transistor disposed in a transistor module via a first pin. The gate driver comprises a duty cycle measurement circuit having a first input terminal and a first output terminal, the first input terminal coupled to a second pin via an isolator. The duty cycle measurement circuit comprises a flip-flop, a counter, a shift register, and a comparator. The system comprises an analog to digital converter circuit having a second input terminal, a second output terminal, and a reference terminal, the second input terminal coupled to a third pin configured to couple to a temperature-sensitive device disposed in the transistor module, the second output terminal coupled to a fourth pin via the isolator, and the reference terminal coupled to the first output terminal.

Abstract: Disclosed are a method and a system for determining a background water temperature of thermal discharge from operating nuclear power plants based on the remote sensing. The system includes a station selection module, a model construction module, a background water temperature calculation module and a temperature rise calculation module; the general idea: constructing linear regression coefficients between water temperature reference station and water temperature estimation stations before the operation of the nuclear power plant based on historical satellite remote sensing water temperature data, and establishing a linear relationship model to calculate the background water temperature of the water temperature estimation of the operating nuclear power plant.