Abstract: The invention relates to a method and a device for testing the fire hazard of a material. According to one embodiment of the method, a plane region of the surface of a specimen made of the material is brought in contact for at most a predetermined contact time with a glow wire, which has been heated to a predetermined temperature. Image data of the specimen are furthermore acquired by at least a first camera at least while the specimen is in contact with the glow wire. Image processing of the acquired image data of the specimen is furthermore carried out, preferably in realtime, ignition of the specimen by the glow wire being detected if applicable. A first duration is then determined, which corresponds to the length of time between the application of the tip of the glow wire on the specimen and the ignition of the specimen.

Abstract: The present invention provides a micro-electro-mechanical-system (MEMS) temperature sensor that employs a suspended spiral comprising a material with a positive coefficient of thermal expansion. The thermal expansion of the suspended spiral is guided to by a set of guideposts to provide a linear movement of the free end of the suspended spiral, which is converted to an electrical signal by a set of conductive rotor azimuthal fins that are interdigitated with a set of conductive stator azimuthal fins by measuring the amount of capacitive coupling therebetween. Real time temperature may thus be measured through the in-situ measurement of the capacitive coupling. Optionally, the MEMS temperature sensor may have a ratchet and a pawl to enable ex-situ measurement.

Abstract: A moving object thermometer is provided which can precisely measure the surface temperature of a moving (travelling) measurement object, particularly, a small-diameter conductive wire. A first metallic wire 1 and a second metallic wire 2 constituting a thermocouple are disposed on the outer circumferential surface 13 of the disk 11 in the rotary section 10 so as to be inclined toward the shaft center. A thermoelectric force resulting from contact of the metallic wires with a measurement object is converted into an electric signal, which is transmitted through the light emitting diode 31 and passed to the photodiode 32 provided at the stationary section 20 in a non-contact manner. Application of a high frequency current to the stationary side coil 42 provided at the stationary section 20 causes electric power to be supplied in a non-contact manner to the rotary side coil 41 provided so as to be opposed to the stationary side coil 42.

Abstract: A microstructured sensor for detecting IR radiation includes: one measuring channel having a measuring diaphragm, on which a first sensitive detector surface is implemented for the absorption of a first IR radiation; and one reference channel having a reference diaphragm, on which a second sensitive detector surface is implemented for the absorption of a second IR radiation. A measuring structure, e.g., a thermopile measuring structure as a series circuit made of thermocouple pairs, is implemented between the measuring diaphragm and the reference diaphragm for measuring a temperature differential between the measuring diaphragm and the reference diaphragm. First and second thermal contacts lie alternately on the two diaphragms.

Abstract: Innovative tracking heat flux sensors located at or near the solar collector's focus for centering the concentrated image on a receiver assembly. With flux sensors mounted near a receiver's aperture, the flux gradient near the focus of a dish or trough collector can be used to precisely position the focused solar flux on the receiver. The heat flux sensors comprise two closely-coupled thermocouple junctions with opposing electrical polarity that are separated by a thermal resistor. This arrangement creates an electrical signal proportional to heat flux intensity, and largely independent of temperature. The sensors are thermally grounded to allow a temperature difference to develop across the thermal resistor, and are cooled by a heat sink to maintain an acceptable operating temperature.

Abstract: Two vertically offset thermistors for sensing a fluid such as oil and refrigerant in a compressor shell are monitored by a method that takes into account rapidly changing conditions within the shell. The system can determine the fluid's sump temperature, high/low liquid levels, and can determine whether the thermistors are sensing the fluid as a liquid, gas, or a mixture of the two, such as a foam or mist of liquid and gas. For greater accuracy, thermistor readings can be dithered and filtered to provide temperature or voltage values having more significant digits than the readings originally processed through a limited-bit A/D converter. For faster response, limited microprocessor time is conserved by sampling thermistor readings at strategic periods that enable the microprocessor to identify certain conditions and temperatures via simple delta-temperature ratios and undemanding equations rather than resorting to exponential functions or lookup tables to determine time constants.

Abstract: A mounting structure (34) for receiving a sensor (18) having a sensing portion (26) and a base portion (30) includes a substantially flat sheet of material (20) having a first surface (20a), a second surface (20b) opposite the first surface (20a), and an aperture (36). The aperture (36) is configured such that the sensing portion (26) of the sensor (18) is passable through the aperture (36), and the base portion (30) is not passable through the aperture (36), but instead rests on the first surface (20a). The mounting structure (34) also includes a pair of tabs (38) that extend in a downward direction away from the second surface (20b) of the sheet of material (20) and are configured to immobilize the sensor (18) within the aperture (36).

Abstract: Wafer temperature is measured as a function of time following removal of a heat source to which the wafer is exposed. During the wafer temperature measurements, a gas is supplied at a substantially constant pressure at an interface between the wafer and a chuck upon which the wafer is supported. A chuck thermal characterization parameter value corresponding to the applied gas pressure is determined from the measured wafer temperature as a function of time. Wafer temperatures are measured for a number of applied gas pressures to generate a set of chuck thermal characterization parameter values as a function of gas pressure. A thermal calibration curve for the chuck is generated from the set of measured chuck thermal characterization parameter values and the corresponding gas pressures. The thermal calibration curve for the chuck can be used to tune the gas pressure to obtain a particular wafer temperature during a fabrication process.

Abstract: Some embodiments provide a system that tests a computing system. During operation, the system monitors a temperature of a component in the computing system while running a series of calibrated workloads on the component. Next, the system analyzes a fluctuation of the temperature resulting from the calibrated workloads to determine a thermal performance of the component. The system then uses the determined thermal performance to improve the reliability of the computing system.

Abstract: Provided is a temperature detection system which is low in cost. The temperature detection system includes a plurality of temperature detection ICs (10) for detecting an abnormal temperature and a resistor (20). Each of the plurality of temperature detection ICs (10) includes a reference voltage terminal connected to an output terminal of one of the plurality of temperature detection ICs (10) located at a preceding stage. The resistor (20) is provided between an output terminal of one of the plurality of temperature detection ICs (10) located at the final stage and a ground terminal.

Abstract: A micro mechanical vacuum sensor for determining the pressure within a cavity of a micro mechanical device is provided. The sensor comprises a substrate, at least one electrically conductive support member connected to the substrate, and a thermally resistive layer supported by the at least one support member and spaced from the substrate by the support member to provide a space between the thermally resistive layer and the substrate. The sensor is arranged such that the thermally resistive layer is substantially thermally insulated from the substrate. The sensor is further arranged to be driven such that the pressure within the cavity is determined by a temperature value sensed by the sensor.

Abstract: A temperature sensor is disclosed having a measuring resistor which is accommodated inside a protective tube and a proximal end of which is connected to a sensor head. The sensor head includes a measurement insert for electrically connecting the measuring resistor and a measuring transducer which is connected downstream thereof to, for example, condition measurement signals. The sensor head is formed by a cylindrical housing having an intermediate base, the measurement insert being accommodated in a lower housing section which is adjacent to the measuring resistor and is sectioned off by the intermediate base, and the measuring transducer being accommodated in an opposite, upper housing section.

Abstract: Disclosed herein is a multiposition temperature cable, including: a measuring unit that includes a plurality of connectors, each being composed of a plus (+) terminal and a minus (?) terminal, in which each of the connectors measures a thermoelectromotive force; and a plurality of wire couples (thermocouples) that are connected to the plurality of connectors, wherein each of the wire couples includes a plus (+) junction wire, one end of which is connected to the plus (+) terminal, and a minus (?) junction wire, one end of which is connected to the minus (?) terminal, and the other end of the plus (+) junction wire and the other end of the minus (?) junction wire are connected to each other to form a hot junction with respect to each connector to form a closed circuit. The multiposition temperature cable can simultaneously measure temperatures at several positions in real time.

Abstract: Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.

Abstract: Embodiments of the invention provide a method and an apparatus for detecting the temperature of a substrate surface. In one embodiment, a method for measuring the temperature is provided which includes exposing the surface of the substrate to a laser beam radiating from a laser source, radiating emitted light from a portion of the surface of the substrate, through the shadow ring, and towards a thermal sensor, and determining the temperature of the portion of the surface of the substrate from the emitted light. The substrate may be disposed on a substrate support within a treatment region and a shadow ring may be disposed between the laser source and the surface of the substrate. The shadow ring may be selectively opaque to the laser beam and transparent to the emitted light.

Abstract: A compact resistive thermal sensor is provided for an integrated circuit (IC), wherein different sensor components are placed on different layers of the IC. This allows the lateral area needed for the sensor resistance wire on any particular IC layer to be selectively reduced. In a useful embodiment, first linear conductive members are positioned in a first IC layer, in parallel relationship with one another. Second linear conductive members are positioned in a second IC layer in parallel relationship with one another. Conductive elements connect the first linear members into a first conductive path, and the second linear members into a second conductive path. A third conductive element extending between the first and second layers connects the first and second conductive paths into a single conductive path, wherein the path resistance varies with temperature. The path resistance is used to determine temperature.

Abstract: A temperature sensor includes first and second lower electrodes, a ferroelectric layer having polarization, a semiconductor layer; and first to third upper electrodes. The second upper electrode is interposed between the first upper electrode and the third upper electrode in a plan view. The semiconductor layer includes a first channel disposed between the first upper electrode and the second upper electrode, and a second channel disposed between the second upper electrode and the third upper electrode. The ferroelectric layer includes a first ferroelectric part disposed below the first channel and a second ferroelectric part disposed below the second channel. A polarization direction of the first ferroelectric part is opposite to a polarization direction of the second first ferroelectric part. The temperature is calculated based on the output voltage from the second upper electrode and the voltage applied to the first upper electrode.

Abstract: A new step-index multimode pure silica core fiber for DTS (Distributed Temperature Sensing) system particularly useful for downhole environments is disclosed and described. The new sensor system provides optimum tradeoffs between coupling power, spatial resolution, and temperature resolution.

Abstract: Provided is a two-terminal semiconductor sensor device with which an external device having low circuit or element accuracy may be used. An output voltage (VOUT) of the two-terminal semiconductor sensor device based on temperature is not based on a constant current of a constant current source (70) of the external device and a current of an output transistor (60) of the two-terminal semiconductor sensor device, but on a resistance ratio of a voltage dividing circuit including a resistor (30) and a resistor (40), and a temperature voltage (Vbe) of the two-terminal semiconductor sensor device. Accordingly, accuracy of the constant current of the constant current source (70) of the external device that receives the output voltage (VOUT) does not need to be high. Therefore, the external device does not need to have a highly accurate circuit or element for receiving the output voltage (VOUT).

Abstract: A temperature measuring probe with a hollow outer shell including an electrically conductive section and an electrically insulating section. A temperature sensor including a resonator is disposed in the electrically conductive section and electrically conductively connected to the electrically conductive section. An antenna including a shortened monopole is disposed in the electrically insulating section. The temperature sensor and the antenna are electrically conductively connected to each other. A respective material and respective dimension of the electrically insulating section and the antenna are matched such that an effective resistance of the antenna is approximately equal to an effective resistance of the temperature sensor in an operating frequency range of the temperature sensor.